Features:

—Package: white SMT package, colorless clear resin

—Chip technology: InGaAlP

—Typ. Radiation: 120° (Lambertian emitter)

—Color: λdom = 606 nm (● orange)

—Corrosion Robustness Class: 3B

—ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)