Features:

—Package: white SMT package, colorless clear silicone resin

—Chip technology: ThinGaN

—Typ. Radiation: 120° (Lambertian emitter)

—Color: λdom = 470 nm (● blue)

—Corrosion Robustness Class: 1B

—Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C,

Stress Test Qualification for Automotive Grade Discrete Semiconductors.

—ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)