FEATURES

■ High temperature thermoplastic material

■ Customizable height

■ Blank 0.64mm square contacts present 4 surfaces of equal

quality

■ Standoff design

■ Duplex plating

■ Tin-lead plating in press-fit area

■ Press-fit designed to fit 1.02mm diameter hole, solder-toboard products

■ Meets DIN 41651 specification, HE 13, and BT D2632

BENEFITS

■ Re-flow compatible

■ Cater to a wide range of applications

■ Suitable for mezzanine application and gives more flexibility

in meeting different stack height requirements

■ Can be used for wire wrapping

■ Allows cleaning to remove soldering contamination

■ Cost efficient

■ Easy pin insertion onto PCB

■ High retention force onto PCB

■ Same layout on THT and press-fit

■ Qualified product