Available in two types - 0.8mm height without stem or 1.5mm height with stem.

Soldering Conditions

Condition for Reflow

Available for Surface Mount Type.

1. Heating method: Double heating method with infrared heater.

2. Temperature measurement: Thermocouple 0.1 to 0.2φCA（K）or CC（T）at solder joints（copper foil surface）. A heat resistive tape should be used to fix thermocouple.

3. Temperature profile