FEATURES

• Temperature coefficient of resistance (TCR)

+25°C to +60°C, +25°C ref.: 0 ±1 ppm/°C

–25°C to +125°C, +25°C ref.: 0 ±5 ppm/°C

• Utilizing Ni-Cr Bulk Metal® Foil Technology for realizing low TCR

• Low thermal resistance with Copper plate

Improved to 0.1°C/W from 0.3°C/W (conventional model)

Maximum rated power up to 500W on heat sink

• Extended max. ambient temperature to 125°C (85°C with conventional model)

• Built-in Pt100 sensor monitor temperature of resistive element

Easily define size of suitable heat sink

As safety function for continuous operation

APPLICATIONS

• Output reference of precision power supply

• Reference of charge-discharge test for high capacity batteries