DESCRIPTION

The

SMF x xx is available in SOD 123FL Pa ckage.

FEATURES

 For surface mounted applications in order to

optimize board space.

 Low profile package

 Glass passivated junction

 Low inductance

 Plastic package has Underwriters Laboratory

Flamma

bility

 Availabl e in SOD 123FL P ackage

MECHANICAL DATA

Case: SOD

123FL

Ter

minals: Solderable per MIL STD 750,

Method 2026

Approx. Weight:15mg 0.00048oz