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S3JF中文资料
S3JF数据手册规格书PDF详情
DESCRIPTION
The
S3 A F S 3 M F are available in SM A F p a ckage
FEATURES
F or surface mounted applications
Low profile package
Glass Passivated Chip Juntion
Easy to pick and place
Availabl e in SM A F p ackage
MECHANICAL DATA
Case: SMA
F
Terminals:
Solderable per MIL STD 750,
Method 2026
Approx. Weight: 27mg 0.00086oz
更新时间：2025-10-13 9:59:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
Crownpo |
19+ |
ThinSMC |
200000 |
||||
JINGDAO/晶导微 |
21+ |
SMASMAF |
60000 |
晶导优势分销 实单必成 可开13点增值税 |
|||
JINGDAO/晶导微 |
23+ |
SMAF |
50000 |
全新原装正品现货,支持订货 |
|||
Crownpo |
24+ |
ThinSMC |
99200 |
原装现货假一赔十 |
|||
Crownpo |
ThinSMC |
99200 |
一级代理 原装正品假一罚十价格优势长期供货 |
||||
JINGDAO/晶导微 |
24+ |
NA/ |
3260 |
原厂直销,现货供应,账期支持! |
|||
Crownpo |
2025+ |
ThinSMC |
7695 |
全新原厂原装产品、公司现货销售 |
|||
24+ |
N/A |
58000 |
一级代理-主营优势-实惠价格-不悔选择 |
||||
JINGDAO/晶导微 |
23+ |
SMAF(DO-214AC) |
30000 |
原装现货 |
|||
UN SEMICONDUCTOR |
24+ |
con |
10000 |
查现货到京北通宇商城 |
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Datasheet数据表PDF页码索引
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