DESCRIPTION

The

S1AF~S1MF are available in SM A F p a ckage

FEATURES

 F or surface mounted applications

 Low profile package

 Glass Passivated Chip Jun c tion

 Easy to pick and place

 Availabl e in SM A F p ackage

MECHANICAL DATA

Case: SM

A F

Terminals: Solderable per MIL

STD 750,

Method 2026

Approx. Weight:

27 mg / 0.0 0 0 86 oz