DESCRIPTION

The

GS1A~GS1M a re available in SMA p a ckage

FEATURES

 The plastic package carries Underwriters

Laboratory Flammability Classification 94V 0

 For surface mounted applications

 Low reverse leakage

 Built in strain relief, ideal for automated

placem ent

 High forward surge current capability

 High temperature soldering guaranteed:

 250 C /10 seconds at terminals

 Glass passivated chip junction

 Availabl e in SMA p ackage

MECHANICAL DATA

Case: JEDEC DO-214AC molded plastic body over passivated chip

Terminals : Solder plated, solderable per MIL-STD-750,Method 2026

Polarity : Color band denotes cathode end

Mounting Position : Any

Weight : 0.002ounce, 0.07grams