DESCRIPTION

The

ES2ABF~ES2JBF is available in SMBF

p a ckage

FEATURES

 F or surface mounted applications

 Low profile package

 Glass Passivated Chip Jun c tio n

 Superfast reverse recovery time

 Availabl e in SM BF p ackage

MECHANICAL DATA

Case: SM

B F

Terminals: Solderable per MIL

STD 750,

Method 2026

Approx. Weight:

57mg/ 0.0 02 oz