DESCRIPTION

The

ES1AF~ES1JF is available in SMAF p a ckage

FEATURES

 F or surface mounted applications

 Low profile package

 Glass Passivated Chip Jun c tio n

 Superfast reverse recovery time

 Availabl e in SMAF p ackage

MECHANICAL DATA

Case: SMAF

Terminals: Solderable per MIL

STD 750,

Method 2026

Approx. Weight

: 27mg 0.00086oz