KEY FEATURES:

‹ M AXIMIZES THROUGHPUT with

velocity to 2 m/s & acceleration to 5 g

‹ Incorporates active yaw &

orthogonality control for MAXIMUM

PRECISION

‹ IMPROVES TURNAROUND TIME

with dual linear-motor H-bridge design

‹ Maintains thermal stability with

optional AIR- & WATER-COOLING

FEATURES for optimal performance

‹ Optimizes move-and-settle time &

contouring performance with available

ENHANCED THROUGHPUT

MODULE

‹ Available with LASER

INTERFEROMETER FEEDBACK for

best performance at the wafer plane