GENERAL DESCRIPTION

The ADSD3030 is a CMOS 3D Time of Flight (ToF)-based 3D depth

and 2D visual light imager that is available for integration into 3D

sensor systems. The functional blocks required for read out, which

include analog-to-digital converters (ADCs), amplifiers, pixel biasing

circuitry, and sensor control logic, are built into the chip to enable a

cost-effective and simple implementation into systems.

The ADSD3030 interfaces electrically to a host system over a

mobile industry processor interface (MIPI), Camera Serial Interface

2 (CSI-2) interface. A lens plus optical band-pass filter for the

imager and an infrared light source plus an associated driver are

required to complete the working subsystem.

FEATURES

► 512 (horizontal) × 640 (vertical) pixel array

► 3.5 μm × 3.5 μm square pixels

► 1/6 inch optical format

► 4-wire SPI or 2-wire I2C serial interface

► MIPI CSI-2 transmitter interface with support for 1 or 2 data

lanes, programmable up to 2.5 Gbps per lane

► Dual, 3.3 V and 1.2 V external supplies, 1.8 V input and output section

► Die size: 3.749 mm± 0.01 mm × 6.4544 mm ± 0.01 mm

APPLICATIONS

► Smartphones

► Augmented reality (AR) and virtual reality (VR)

► Machine vision systems (logistics and inventory)

► Robotics (consumer and industrial)