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ADL5561ACPZ-WP中文资料

厂家型号

ADL5561ACPZ-WP

文件大小

571.04Kbytes

页面数量

24

功能描述

2.9 GHz Ultralow Distortion RF/IF Differential Amplifier

2.9 GHZ ULTRALOW DISTORTION RF/IF DIFFERENTIAL AMPLIFIER - Gel-pak, waffle pack, wafer, diced wafer on film

数据手册

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生产厂商

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ADL5561ACPZ-WP数据手册规格书PDF详情

GENERAL DESCRIPTION

The ADL5561 is a high performance differential amplifier optimized for RF and IF applications. The amplifier offers low noise of 2.1 nV/√Hz and excellent distortion performance over a wide frequency range, making it an ideal driver for high speed 8-bit to 16-bit analog-to-digital converters (ADCs).

The ADL5561 provides three gain levels of 6 dB, 12 dB, and 15.5 dB through a pin-strappable configuration. For the single-ended input configuration, the gains are reduced to 5.6 dB, 11.1 dB, and 14.1 dB. Using an external series input resistor expands the amplifier gain flexibility and allows for any gain selection from 0 dB to 15.5 dB.

The quiescent current of the ADL5561 is typically 40 mA and, when disabled, consumes less than 3 mA, offering excellent input-to-output isolation.

FEATURES

−3 dB bandwidth of 2.9 GHz (AV = 6 dB)

Low supply current: 40 mA

Pin-strappable gain adjust: 6 dB, 12 dB, 15.5 dB

Differential or single-ended input to differential output

Low noise input stage: 2.1 nV/√Hz RTI at AV = 12 dB

Low broadband distortion (Av = 6 dB)

10 MHz: −94 dBc HD2, −87 dBc HD3

70 MHz: −98 dBc HD2, −87 dBc HD3

140 MHz: −95 dBc HD2, −87 dBc HD3

250 MHz: −80 dBc HD2, −73 dBc HD3

IMD3s of −86 dBc @ 250 MHz center

Slew rate: 9.8 V/ns

Fast settling of 2 ns and overdrive recovery of 3 ns

Single-supply operation: 3 V to 3.6 V

Power-down control

Fabricated using the high speed XFCB3 SiGe process

APPLICATIONS

Differential ADC drivers

Single-ended-to-differential conversion

RF/IF gain blocks

SAW filter interfacing

ADL5561ACPZ-WP产品属性

  • 类型

    描述

  • 型号

    ADL5561ACPZ-WP

  • 制造商

    Analog Devices

  • 功能描述

    2.9 GHZ ULTRALOW DISTORTION RF/IF DIFFERENTIAL AMPLIFIER - Gel-pak, waffle pack, wafer, diced wafer on film

更新时间:2025-10-4 16:12:00
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