位置：BW63-2G > BW63-2G详情
BW63-2G中文资料
BW63-2G数据手册规格书PDF详情
Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.
更新时间：2025-12-15 20:00:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
FE |
25+ |
100 |
原装正品,假一罚十! |
||||
BROADCOM |
24+ |
BGA |
9480 |
公司现货库存,支持实单 |
|||
N/A |
24+ |
QFP |
2000 |
||||
POWER THERM |
24+ |
模块 |
6430 |
原装现货/欢迎来电咨询 |
|||
原厂 |
2023+ |
模块 |
600 |
专营模块,继电器,公司原装现货 |
|||
POWER THERM |
2018 |
模块 |
300 |
十七年VIP会员,诚信经营，一手货源，原装正品可零售！ |
|||
M/A-COM |
24+ |
SMD |
3000 |
低价风暴根本停不下来绝对进口原装假一赔十 |
|||
Mini |
2023+ |
N/A |
4512 |
专注配单,只做原装进口现货 |
|||
Mini |
23+ |
N/A |
7000 |
||||
BWAVE |
21+ |
TQFP |
5 |
原装 |
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AAVID相关芯片制造商
Datasheet数据表PDF页码索引
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