位置:534002B02554G > 534002B02554G详情
534002B02554G中文资料
534002B02554G数据手册规格书PDF详情
Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.
更新时间:2025-10-11 15:21:00
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
AMI |
23+ |
SOP-24 |
5000 |
原厂授权代理,海外优势订货渠道。可提供大量库存,详 |
|||
AMI |
99 |
15 |
公司优势库存 热卖中!! |
||||
22+ |
5000 |
||||||
NEWBRIDGE |
24+ |
PLCC44 |
5642 |
公司原厂原装现货假一罚十!特价出售!强势库存! |
|||
NEWBRIDGE |
24+ |
PLCC-44P |
5000 |
只做原装公司现货 |
|||
NEWBRIDGE |
24+ |
PLCC44 |
6540 |
原装现货/欢迎来电咨询 |
|||
AMP |
24+/25+ |
16 |
原装正品现货库存价优 |
||||
AMP |
新 |
244 |
全新原装 货期两周 |
||||
TE/泰科 |
24+ |
34977 |
原厂现货渠道 |
||||
TE/泰科 |
2508+ |
/ |
343380 |
一级代理,原装现货 |
534002B02554G 资料下载更多...
534002B02554G 芯片相关型号
- 02011K4R7CBTTR
- 0201ZK680CBTTR
- 05813711
- 09-40-003-5411
- 1.5KE7.5A
- 3F20
- 574502B03300G
- 5962-8754601PA
- B1RAB-JE
- B23AP-JE
- B29AP-JE
- B2RHB-JE
- B2SAB-JE
- B2SHB-JE
- C22M40I
- C22M6
- CW100505-3N9J
- CY74FCT16374ATPVC
- DRV8844PWP
- DS26LS31MQML
- GC5325IZND
- MK20DN512ZCAB10R
- MK20DN512ZVMD10
- MOV-10DNN(0)KTR
- PLC-0755-220S
- PLC-0755-330S
- PLC-1245-120S
- RP43725RXXXXGTTR
- RP52010RXXXXGTTR
- RPA0300T0050JNBK
AAVID相关芯片制造商
Datasheet数据表PDF页码索引
- P1
- P2
- P3
- P4
- P5
- P6
- P7
- P8
- P9
- P10
- P11
- P12
- P13
- P14
- P15
- P16
- P17
- P18
- P19
- P20
- P21
- P22
- P23
- P24
- P25
- P26
- P27
- P28
- P29
- P30
- P31
- P32
- P33
- P34
- P35
- P36
- P37
- P38
- P39
- P40
- P41
- P42
- P43
- P44
- P45
- P46
- P47
- P48
- P49
- P50
- P51
- P52
- P53
- P54
- P55
- P56
- P57
- P58
- P59
- P60
- P61
- P62
- P63
- P64
- P65
- P66
- P67
- P68
- P69
- P70
- P71
- P72
- P73
- P74
- P75
- P76
- P77
- P78
- P79
- P80
- P81
- P82
- P83
- P84
- P85
- P86
- P87
- P88
- P89
- P90
- P91
- P92
- P93
- P94
- P95
- P96
- P97
- P98
- P99
- P100
- P101
- P102
- P103
- P104
- P105