蓝牙耳机-蓝牙音频 SoC 芯片

炬芯科技蓝牙耳机芯片系列产品主要为双模蓝牙5.3单芯片解决方案，具备高音质、低延迟、低功耗等特点，主要应用于真无线耳机(TWS)、颈挂式耳机、头戴式耳机等可穿戴音频设备。炬芯科技擅长在低功耗的前提下提供高音质及低延迟的无线音频体验，该系列产品蓝牙发射功率最高达13dBm，接收灵敏度-96dBm，有效地提升了无线音频连接的稳定性，常规音频播放的情况下空载功耗低至4.xmA。20段音频PEQ，支持音乐和通话场景下的音效调节；支持双连接，同时连接任意两个蓝牙设备，方便切换；自适应低延迟模式，蓝牙音频信号延迟小于50ms，让用户在更低延迟下享受真实还原的声音；内置AI单双麦通话降噪算法，大幅提升了用户

Switching Application

Switching Application (Bias Resistor Built In) • Switching circuit, Inverter, Interface circuit, Driver Circuit • Built in bias Resistor (R1=2.2KΩ, R2=10KΩ)

N - CHANNEL 30V - 0.013 ohm - 40A - D2PAK/TO-220 STripFETO POWER MOSFET

DESCRIPTION This Power MOSFET is the latest development of STMicroelectronics unique Single Feature Size strip-based process. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics and less critical alignment steps therefore a rema

N - CHANNEL 30V - 0.013 ohm - 40A - D2PAK/TO-220 STripFETO POWER MOSFET

DESCRIPTION This Power MOSFET is the latest development of STMicroelectronics unique Single Feature Size strip-based process. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics and less critical alignment steps therefore a rema

N - CHANNEL 30V - 0.013 ohm - 40A - D2PAK/TO-220 STripFETO POWER MOSFET

DESCRIPTION This Power MOSFET is the latest development of STMicroelectronics unique Single Feature Size strip-based process. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics and less critical alignment steps therefore a rema

SANKEN ELECTRIC COMPANY, LTD.

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