AM64x Sitara™ Processors

1 Features Processor cores: • 1× Dual 64-bit Arm® Cortex®-A53 microprocessor subsystem at up to 1.0 GHz – Dual-core Cortex-A53 cluster with 256KB L2 shared cache with SECDED ECC – Each A53 Core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection • Up to 2× Dual-co

AM64x Sitara™ Processors

1 Features Processor cores: • 1× Dual 64-bit Arm® Cortex®-A53 microprocessor subsystem at up to 1.0GHz – Dual-core Cortex-A53 cluster with 256KB L2 shared cache with SECDED ECC – Each A53 Core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection • Up to 2× Dual-cor

AM64x Sitara™ Processors

1 Features Processor cores: • 1× Dual 64-bit Arm® Cortex®-A53 microprocessor subsystem at up to 1.0 GHz – Dual-core Cortex-A53 cluster with 256KB L2 shared cache with SECDED ECC – Each A53 Core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection • Up to 2× Dual-co

双核 64 位 Arm® Cortex®-A53，双核 Cortex-R5F，具有 PCIe、USB 3.0 和安全性

AM64x 是 Sitara™ 新增的工业级异构 Arm® 处理器产品系列，专为要求独特结合实时处理和通信与应用处理的电机驱动器和可编程逻辑控制器 (PLC) 等工业应用而构建。AM64x 将两个支持 TSN 技术的 Sitara 器件千兆位 PRU-ICSSG 实例与最多两个 Arm® Cortex®-A53 内核、最多四个 Cortex-R5F MCU 和一个 Cortex-M4F MCU 合并到一起。\n\nAM64x 旨在通过高性能 R5F 内核、紧密耦合的存储器组、可配置的 SRAM 分区和进出外设的专用低延迟路径提供出色的实时性能，从而实现数据快速进出 SoC。这种确定性架构允许 处理器内核： \n• 双核 Cortex-A53 集群（具有 256KB L2 共享缓存，包括 SECDED ECC）\n• 最多 2 个双核 Arm Cortex-R5F MCU 子系统，工作频率高达 800MHz，集成用于实现实时处理 \n• 每个 R5F 内核 32KB ICache、32KB DCache 和 64KB TCM，总共 256KB TCM，所有存储器上都有 SECDED ECC\n• 1 个单核 Arm Cortex-M4F MCU，高达 400MHz \n• 2 个千兆位工业通信子系统 (PRU_ICSSG) \n• 向后兼容 10/100Mb PRU_ICSS\n•;

丝印代码：AM6422B；AM64x Sitara™ Processors

1 Features Processor cores: • 1× Dual 64-bit Arm® Cortex®-A53 microprocessor subsystem at up to 1.0 GHz – Dual-core Cortex-A53 cluster with 256KB L2 shared cache with SECDED ECC – Each A53 Core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection • Up to 2× Dual-co

丝印代码：AM6422BSDFHAALV709；AM64x Sitara™ Processors

1 Features Processor cores: • 1× Dual 64-bit Arm® Cortex®-A53 microprocessor subsystem at up to 1.0GHz – Dual-core Cortex-A53 cluster with 256KB L2 shared cache with SECDED ECC – Each A53 Core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection • Up to 2× Dual-cor

丝印代码：AM6422BSDGHAALV709；AM64x Sitara™ Processors

1 Features Processor cores: • 1× Dual 64-bit Arm® Cortex®-A53 microprocessor subsystem at up to 1.0GHz – Dual-core Cortex-A53 cluster with 256KB L2 shared cache with SECDED ECC – Each A53 Core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection • Up to 2× Dual-cor

丝印代码：AM6422B；AM64x Sitara™ Processors

1 Features Processor cores: • 1× Dual 64-bit Arm® Cortex®-A53 microprocessor subsystem at up to 1.0 GHz – Dual-core Cortex-A53 cluster with 256KB L2 shared cache with SECDED ECC – Each A53 Core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection • Up to 2× Dual-co

丝印代码：AM6422B；AM64x Sitara™ Processors

1 Features Processor cores: • 1× Dual 64-bit Arm® Cortex®-A53 microprocessor subsystem at up to 1.0 GHz – Dual-core Cortex-A53 cluster with 256KB L2 shared cache with SECDED ECC – Each A53 Core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection • Up to 2× Dual-co

AM64x Sitara™ Processors

1 Features Processor cores: • 1× Dual 64-bit Arm® Cortex®-A53 microprocessor subsystem at up to 1.0 GHz – Dual-core Cortex-A53 cluster with 256KB L2 shared cache with SECDED ECC – Each A53 Core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection • Up to 2× Dual-co

GSM/DCS1800/PCS1900 Baseband Processing Chipset

GENERAL DESCRIPTION The Analog Devices GSM Baseband Processing Chipset provides a competitive solution for GSM based Mobile Radio Systems. It is designed to be fully integrated, easy to use, and compat ible with a wide range of product solutions. Examples are GSM900, DCS1800, PCS1900 handset

Enhanced Full-Duplex Speakerphone IC

General Description Most modern speakerphones use half-duplex operation, which alternates transmission between the far-end talker and the speakerphone user. This is done to ensure stability because the acoustic coupling between the speaker and microphone is much higher in speaker phones than in

High speed and Simple 4-Bit Microcontroller

GENERAL DESCRIPTION The MSM6422 is a low-power, single-chip device implemented in complementary metal-oxide semiconductor technology. The MSM6422 can be used in place of logic ICs configured around a main CPU, or for small-scale systems such as home electronic equipment. FEATURES • ROM : 2048

BUS-CONTROLLED AUDIO MATRIX

DESCRIPTION The TEA6422 switches 6 stereo audio inputs on 3 stereo outputs. All the switching possibilities are changed through the I2C BUS. ■ 6 Stereo Inputs ■ 3 Stereo Ouputs ■ Gain Control 0 dB/Mute for each Output ■ Cascadable (2 different addresses) ■ Serial Bus Controlled ■ Very

BUS-CONTROLLED AUDIO MATRIX

DESCRIPTION The TEA6422 switches 6 stereo audio inputs on 3 stereo outputs. All the switching possibilities are changed through the I2C BUS. ■ 6 Stereo Inputs ■ 3 Stereo Ouputs ■ Gain Control 0 dB/Mute for each Output ■ Cascadable (2 different addresses) ■ Serial Bus Controlled ■ Very