Mobile Multimedia Application Processor

AK10系列MCU选用高性能ARM926EJ内核，CPU运行频率0~200MHz， 系统运行频率0~100MHz，可软件动态配置，内置4KB I-Cache，4KB D-Cache。\r\n\r\n 该系列MCU内置资源包括192K bytes RAM，MPU LCD控制器（最高可支持QVGA 320×240分辨率）， 两个用于立体声录音的16-bit ADC；两个用于立体声输出的22-bit DAC；内置耳机驱动电路、 USB 2.0 高速控制器、NandFlash控制器、MMC/SD卡控制器、RTC、UART等丰富的接口和资源。\r\n\r\n AK10系列MCU面向的终端产品

SCHOTTKY BARRIER RECTIFIERS(VOLTAGE- 20 to 100 Volts CURRENT - 10.0 Ampere)

FEATURES • Plastic package has Underwriters Laboratory Flammability Classification 94V-O. Flame Retardant Epoxy Molding Compound. • Exceeds environmental standards of MIL-S-19500/228 • Low power loss, high efficiency. • Low forwrd voltge, high current capability • High surge capacity.

D2PAK SURFACT SCHOTTKY BARRIER RECTIFIERS(VOLTAGE 20 to 100 Volts CURRENT - 10 Ampere)

VOLTAGE 20 to 150 Volts CURRENT 10 Amperes FEATURES • Plastic package has Underwriters Laboratory Flammability Classification 94V-O. Flame Retardant Epoxy Molding Compound. • Exceeds environmental standards of MIL-S-19500/228 • Low power loss, high efficiency. • Low forwrd voltge, hig

ISOLATION SCHOTTKY BARRIER RECTIFIERS(VOLTAGE- 20 to 100 Volts CURRENT - 10.0 Ampere)

VOLTAGE 20 to 150 Volts CURRENT 10 Amperes FEATURES • Plastic package has Underwriters Laboratory Flammability Classification 94V-O. Flame Retardant Epoxy Molding Compound. • Exceeds environmental standards of MIL-S-19500/228 • Low power loss, high efficiency. • Low forwrd voltge,

DPAK SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER(VOLTAGE - 20 to 100 Volts CURRENT - 10.0 Amperes)

VOLTAGE - 20 to 100 Volts CURRENT - 10.0 Amperes FEATURES • Plastic package has Underwriters Laboratory Flammability Classification 94V-O • For surface mounted applications • Low profile package • Built-in strain relief • Metal to silicon rectifier majority carrier conduction

SCHOTTKY BARRIER RECTIFIER(VOLTAGE - 20 to 100 Volts CURRENT - 10.0 Amperes)

VOLTAGE - 20 to 1 00 Volts CURRENT - 10 .0 Amperes FEATURES • Plastic package has Underwriters Laboratory Fl ammability Classification 9 4V-O • For thorough hole applications • Low profile package • Built- in strain relief • Metal to silicon rectifier majority carr