Dual-Band Power Amplifier Module

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WCDMA/HSPA Band 1 and Band 8 3.0 mm 횞 4.2 mm Dual-Band Power Amplifier Module

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Dual-Band Power Amplifier Module

封装/外壳：14-SMD 模块 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：IC POWER AMP SMD RF/IF，射频/中频和 RFID 射频放大器

WCDMA/HSPA Band 1 and Band 8 3.0 mm 횞 4.2 mm Dual-Band Power Amplifier Module

文件：163.89 Kbytes Page：3 Pages

封装/外壳：14-SMD 模块 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：IC POWER AMP SMD RF/IF，射频/中频和 RFID 射频放大器

BNC(m)/F(f), BNC(f)/F(f), BNC(f)/F(m), BNC(m)/F(m)

Features • True 75 Ω BNC adapters. • Easily adapt F-Connectors to BNC. • Gold-plated (15 micro–inches) contacts. • BNC insulation material is PTFE (not delrin). Materials • Body is made of machined brass with tarnish resistant nickel-plating. • Female BNC center contact: Gol

Low-Power, 1-Accurate Battery Monitors in uDFN and SC70 Packages

General Description The MAX6775–MAX6781 low-power, 1-accurate battery monitors are available in the ultra-small µDFN package (1.0mm x 1.5mm) and SC70 packages. These low-power devices are ideal for monitoring single lithium-ion (Li+) cells, or multicell alkaline/NiCd/NiMH power sources. These dev

EM-6781 is ultra-small Hall effect ICs of a single silicon chip composed of Hall element and a signal processing IC

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