Dual High Speed ECL Comparators

GENERAL DESCRIPTION The ADCMP563/ADCMP564 are high speed comparators fabricated on Analog Devices’ proprietary XFCB process. The devices feature a 700 ps propagation delay with less than 75 ps overdrive dispersion. Dispersion, a measure of the difference in propagation delay under differing overd

Dual, High Speed ECL Comparators

文件：279.49 Kbytes Page：16 Pages

Dual, High Speed ECL Comparators

文件：279.49 Kbytes Page：16 Pages

T-1 3/4 PACKAGE SOLID STATE LAMP

Description The MVL-564B, a blue source color device, is made with InGaN ( on SiC substrate) LED die. The package is T-1 3/4( 5mm) water clear plastic lens package. Features High performance - 2.5mW (470nm) Superior SiC substrate technology Excellent chip to chip consistency Hi

T-1 3/4 ( f5mm) InGaN LED LAMPs

Description The MVL-564BG, a blue source color device, is made with InGaN ( on SiC substrate) LED die. The package is T-1 3/4 (5mm) water clear plastic lens package. Features High performance - 2.5mW (490nm) Superior SiC substrate technology Excellent chip to chip consistency H

T-1 3/4 PACKAGE SOLID STATE LAMP

Description The MVL-564BV, a blue source color device, is made with GaN ( on SiC substrate) LED die. The package is T-1 3/4( 5mm) water clear plastic lens package. Features High performance - 1.15mW (430nm) Superior SiC substrate technology Excellent chip to chip consistency Hi

T-1 3/4 ( f 5mm) PACKAGE SOLID STATE LAMP PRELIMINARY

Description The MVL-564SG, a green source color device, is made with InGaN ( on SiC substrate) LED die. The package is T-1 3/4 (ф5mm) water clear plastic Features • High performance - 2.0mW (505nm) • Superior SiC substrate technology • Excellent chip to chip consistency • High reliability A

T-1 3/4 ( f 5mm) PACKAGE SOLID STATE LAMP

Description The MVL-564TG, a green source color device, is made with InGaN ( on SiC substrate) LED die. The package is T-1 3/4 (ф 5mm) water clear plastic type. Features • High performance - 1.5mW (525nm) • Superior SiC substrate technology • Excellent chip to chip consistency • High reliabi