Silicon PNP transistor in a TO-92 Plastic Package

Descriptions Silicon PNP transistor in a TO-92 Plastic Package. Features High hFE. Applications General amplifier application.

Silicon PNP transistor in a TO-92 Plastic Package

Descriptions Silicon PNP transistor in a TO-92 Plastic Package. Features High hFE. Applications General amplifier application.

Low-profile WLAN antenna built for ground plane to extend beneath the antenna.

A low-profile antenna for Bluetooth/BLE, Wi-Fi (802.11a/b/g/n), ZigBee. It’s designed for use with a ground plane under the antenna, minimising the footprint of your RF stackup. This makes this antenna perfect for wearables and sensors. Available in left- and right-hand options, allowing for maximum • Frequency: 2.4 – 2.5GHz\n\n• Efficiency: 65%\n\n• Dimension: 20.5 x 3.6 x 3.3 mm;

Silicon PNP transistor in a TO-92 Plastic Package

Descriptions Silicon PNP transistor in a TO-92 Plastic Package. Features High hFE. Applications General amplifier application.

四8

• Size 0.56 inch\n• Energy meter\n• Home appliance\n• Medical devices display;

Mica 2.4 GHz SMD Antenna

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包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：A5645H MICA 2.4 GHZ SMD HALOGEN RF/IF，射频/中频和 RFID RF 天线

包装：盒 描述：A5645H MICA EVALUATION BOARD 开发板，套件，编程器 射频评估和开发套件，开发板

T-1 3/4 PACKAGE SOLID STATE LAMP

Description The MVL-564B, a blue source color device, is made with InGaN ( on SiC substrate) LED die. The package is T-1 3/4( 5mm) water clear plastic lens package. Features High performance - 2.5mW (470nm) Superior SiC substrate technology Excellent chip to chip consistency Hi

T-1 3/4 ( f5mm) InGaN LED LAMPs

Description The MVL-564BG, a blue source color device, is made with InGaN ( on SiC substrate) LED die. The package is T-1 3/4 (5mm) water clear plastic lens package. Features High performance - 2.5mW (490nm) Superior SiC substrate technology Excellent chip to chip consistency H

T-1 3/4 PACKAGE SOLID STATE LAMP

Description The MVL-564BV, a blue source color device, is made with GaN ( on SiC substrate) LED die. The package is T-1 3/4( 5mm) water clear plastic lens package. Features High performance - 1.15mW (430nm) Superior SiC substrate technology Excellent chip to chip consistency Hi

T-1 3/4 ( f 5mm) PACKAGE SOLID STATE LAMP PRELIMINARY

Description The MVL-564SG, a green source color device, is made with InGaN ( on SiC substrate) LED die. The package is T-1 3/4 (ф5mm) water clear plastic Features • High performance - 2.0mW (505nm) • Superior SiC substrate technology • Excellent chip to chip consistency • High reliability A

T-1 3/4 ( f 5mm) PACKAGE SOLID STATE LAMP

Description The MVL-564TG, a green source color device, is made with InGaN ( on SiC substrate) LED die. The package is T-1 3/4 (ф 5mm) water clear plastic type. Features • High performance - 1.5mW (525nm) • Superior SiC substrate technology • Excellent chip to chip consistency • High reliabi