3M??Adhesive Transfer Tape 966

文件：199 Kbytes Page：8 Pages

包装：散装 描述：TAPE ADHSV TRNSFR CLR 1\ 胶带，粘合剂，材料 胶带

包装：散装 描述：CONN ADAPTER MICRO SD TO SD 连接器，互连器件 PC 卡 - 适配器

MOTOR STARTING RELAYS CURRENT TYPE

Features • Smallest current-type relay available • Easy-to-install plug-on type • Useful service life to 1 million cycles • Wide range of pickup and dropout ratings • Use in equipment using flammable refrigerant

MOTOR STARTING RELAYS CURRENT TYPE

Features • Smallest current-type relay available • Easy-to-install plug-on type • Useful service life to 1 million cycles • Wide range of pickup and dropout ratings • Use in equipment using flammable refrigerant

2U short-depth Optimized Chassis for ASMB-62 Series Edge Accelerator Server Board

Features ƒ Supports ASMB-62 edge series motherboard ƒ Four 2.5 hot-swappable SATA drive bays (2 NVMe drives in option) ƒ Four FH/10.5L and four FH/HL expansion slots ƒ 1200W 1+1 redundant power supply with 80 Plus platinum level certificate ƒ Ultra Slim ODD support in option ƒ 2U Front Bezel

1U Storage Chassis for EATX/ATX Server board with 8 hot-swap Drive Bays

Features ƒ 1U rackmount chassis support EATX/ATX motherboard ƒ 8-bay hot-swappable 2.5 SATA/SAS/SSD drive bays with slim ODD ƒ Support 12Gb/s SASIII ƒ Anti-vibration FAN design ƒ Single front USB2.0 port

Front Access Micro Computer, Intel Core i7/i5/i3 CPU with 10 COM, 8 USB and 4 Expansion

Features .. Intel® H61 Platform ..Intel® Core™ i7/i5/i3 CPU (LGA1155) ..One PCIe x 16 & one PCIe x1 slot .. Compact & Rich I/O Configuration ..Two internal 3.5 SATA HDD bays ..2 VGA, 2 GbE LAN, 8 USB 2.0, 10 COM ..Optional filter module for dust proof ..Optional bracket module support up t

Front Access Micro Computer, Intel Core i7/i5/i3 CPU with 10 COM, 8 USB and 4 Expansion

Features .. Intel® H61 Platform ..Intel® Core™ i7/i5/i3 CPU (LGA1155) ..One PCIe x 16 & one PCIe x1 slot .. Compact & Rich I/O Configuration ..Two internal 3.5 SATA HDD bays ..2 VGA, 2 GbE LAN, 8 USB 2.0, 10 COM ..Optional filter module for dust proof ..Optional bracket module support up t

4U Rackmount Intel® Xeon® Scalable GPU Server, Supporting 4 x PCIe x16 Double-Deck Cards Plus 1 x PCIe x8 and 1 x PCIe x4 Single-Deck Cards

Features ƒ Processor: Dual 2nd Gen Intel® Xeon® scalable processors ƒ Memory: 12 x DDR4 2666/2933 MHz ECC RDIMM/LRDIMM / Intel Optane DC Persistent Memory, up to 2TB ƒ Remote Management: IPMI function support ƒ Expansion: Supporting 4 * PCIe x16 double-deck card + 1* PCIe x8 single-deck FH/H

1U Storage Chassis for MicroATX/ATX Serverboard with 4 Hot-swap Drive Bays

Features ƒ 1U rackmount chassis support ATX/uATX motherboard ƒ 4-bay hot-swappable 3.5/2.5 SATA/SAS/SSD drive bays with ultra slim ODD bay ƒ Anti-vibration FAN design ƒ Two front USB3.0 ports

4U Rackmount for EATX/ATX Motherboard

Features ƒ Supports EATX/ATX motherboard ƒ Supports up to eight SATA3 or SAS3 hot-swap HDD ƒ Supports 80plus 1U 1+1 redundant high watt power supply ƒ Supports up to eleven FH/FL expansion slots ƒ 3 x 12cm system fans with easy maintenance feature ƒ Supports up to dimension 379 x 346mm mothe

2U Rackmount Chassis for ATX/EATX Motherboard with 8 Hot-Swap SAS3/SATA3 HDD Trays and RPS

Features ƒ Supports ATX/EATX motherboard with dual processors ƒ Eight shock-resistant hot-swap disk trays supporting 3.5 or 2.5 SAS3/ SATA3 drives, one slim ODD, and two 2.5 internal drives ƒ Dual front USB 3.0 ports ƒ Supports 80plus single or redundant power supply up to 800W ƒ LED indicat

4U Rackmount / Tower Chassis for EATX/ATX/MicroATX Motherboard with 8 Hot Swap Drive Trays

Features ƒ Supports EATX/ATX/MicroATX motherboard ƒ Shock-resistant disk drive bay provides eight hot-swap 3.5 or 2.5 SAS/SATA disk trays, one slim optical disk drive, and one 2.5 internal drive space ƒ Supports 80plus single high watt power supply (700W/1200W) ƒ Supports up to seven FH/FL e

Explosion Proof LoRaWAN Wireless Condition Monitoring Sensor

Features ƒ LoRaWAN wireless connectivity ƒ Built-in 3-axis accelerometer and temperature sensor ƒ On-board computing. Directly sends VRMS, ARMS, Peak, Displacement, Kurtosis, Crest factor, Skewness and Standard Deviation values to applications ƒ Support battery power and remote configuration

Explosion Proof LoRaWAN Wireless Condition Monitoring Sensor

Features ƒ LoRaWAN wireless connectivity ƒ Built-in 3-axis accelerometer and temperature sensor ƒ On-board computing. Directly sends VRMS, ARMS, Peak, Displacement, Kurtosis, Crest factor, Skewness and Standard Deviation values to applications ƒ Support battery power and remote configuration

Explosion Proof LoRaWAN Wireless Condition Monitoring Sensor

Features ƒ LoRaWAN wireless connectivity ƒ Built-in 3-axis accelerometer and temperature sensor ƒ On-board computing. Directly sends VRMS, ARMS, Peak, Displacement, Kurtosis, Crest factor, Skewness and Standard Deviation values to applications ƒ Support battery power and remote configuration

Explosion Proof LoRaWAN Wireless Condition Monitoring Sensor

Features ƒ LoRaWAN wireless connectivity ƒ Built-in 3-axis accelerometer and temperature sensor ƒ On-board computing. Directly sends VRMS, ARMS, Peak, Displacement, Kurtosis, Crest factor, Skewness and Standard Deviation values to applications ƒ Support battery power and remote configuration

LoRaWAN Single RS-485 I/O Module

Features ƒ LoRaWAN wireless technology with Less interference with high penetration rate capability ƒ Support Modbus/RTU communication protocol ƒ Support max. 128 address and 30 rule settings ƒ Compact design, suitable for plug and play applications ƒ Industrial design concept for different

LoRaWAN Single RS-485 I/O Module

Features ƒ LoRaWAN wireless technology with Less interference with high penetration rate capability ƒ Support Modbus/RTU communication protocol ƒ Support max. 128 address and 30 rule settings ƒ Compact design, suitable for plug and play applications ƒ Industrial design concept for different

LoRaWAN Single RS-485 I/O Module

Features ƒ LoRaWAN wireless technology with Less interference with high penetration rate capability ƒ Support Modbus/RTU communication protocol ƒ Support max. 128 address and 30 rule settings ƒ Compact design, suitable for plug and play applications ƒ Industrial design concept for different

LoRaWAN Single RS-485 I/O Module

Features ƒ LoRaWAN wireless technology with Less interference with high penetration rate capability ƒ Support Modbus/RTU communication protocol ƒ Support max. 128 address and 30 rule settings ƒ Compact design, suitable for plug and play applications ƒ Industrial design concept for different

LoRaWAN Single RS-485 I/O Module

Features ƒ LoRaWAN wireless technology with Less interference with high penetration rate capability ƒ Support Modbus/RTU communication protocol ƒ Support max. 128 address and 30 rule settings ƒ Compact design, suitable for plug and play applications ƒ Industrial design concept for different

Explosion Proof LoRaWAN Wireless Condition Monitoring Sensor

Features ƒ LoRaWAN wireless connectivity ƒ Built-in 3-axis accelerometer and temperature sensor ƒ On-board computing. Directly sends VRMS, ARMS, Peak, Displacement, Kurtosis, Crest factor, Skewness and Standard Deviation values to applications ƒ Support battery power and remote configuration

UNO-1000 Series Accessories

Features ƒƒ Dimensions: 270 x 162 x 11 mm (W x H x D) (Only extension kit) ƒƒ Supports VESA 75 and 100 monitor

UNO-1000 Series Accessories

Features ƒƒ Dimensions: 270 x 162 x 11 mm (W x H x D) (Only extension kit) ƒƒ Supports VESA 75 and 100 monitor

UNO-1000 Series Accessories

Features ƒƒ Dimensions: 270 x 162 x 11 mm (W x H x D) (Only extension kit) ƒƒ Supports VESA 75 and 100 monitor

Advanced Industrial LoRa/LoRaWAN Wireless I/O Module

Features ƒ Private LoRa and LoRaWAN selectable ƒ Longer communication range ƒ Better penetration through concrete and steel ƒ Less interference than 2.4GHz spectrum ƒ Application-ready I/O combination with IP65 enclosure ƒ Powered by solar rechargeable battery or 10~50VDC input ƒ GPS/Galile

Advanced Industrial LoRa/LoRaWAN Wireless I/O Module

Features ƒ Private LoRa and LoRaWAN selectable ƒ Longer communication range ƒ Better penetration through concrete and steel ƒ Less interference than 2.4GHz spectrum ƒ Application-ready I/O combination with IP65 enclosure ƒ Powered by solar rechargeable battery or 10~50VDC input ƒ GPS/Galile

Advanced Industrial LoRa/LoRaWAN Wireless I/O Module

Features ƒ Private LoRa and LoRaWAN selectable ƒ Longer communication range ƒ Better penetration through concrete and steel ƒ Less interference than 2.4GHz spectrum ƒ Application-ready I/O combination with IP65 enclosure ƒ Powered by solar rechargeable battery or 10~50VDC input ƒ GPS/Galile

Advanced Industrial LoRa/LoRaWAN Wireless I/O Module

Features ƒ Private LoRa and LoRaWAN selectable ƒ Longer communication range ƒ Better penetration through concrete and steel ƒ Less interference than 2.4GHz spectrum ƒ Application-ready I/O combination with IP65 enclosure ƒ Powered by solar rechargeable battery or 10~50VDC input ƒ GPS/Galile

Advanced Industrial LoRa/LoRaWAN Wireless I/O Module

Features ƒ Private LoRa and LoRaWAN selectable ƒ Longer communication range ƒ Better penetration through concrete and steel ƒ Less interference than 2.4GHz spectrum ƒ Application-ready I/O combination with IP65 enclosure ƒ Powered by solar rechargeable battery or 10~50VDC input ƒ GPS/Galile

Advanced Industrial LoRa/LoRaWAN Wireless I/O Module

Features ƒ Private LoRa and LoRaWAN selectable ƒ Longer communication range ƒ Better penetration through concrete and steel ƒ Less interference than 2.4GHz spectrum ƒ Application-ready I/O combination with IP65 enclosure ƒ Powered by solar rechargeable battery or 10~50VDC input ƒ GPS/Galile

11th Gen. Intel® Core™ i7/i5/i3/Celeron U-Series 3.5 SBC w/ MIOe

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W/ 28W ƒ Dual Channel DDR4-3200 up to 64GB ƒ 4 simultaneous displays: LVDS/HDMI/DP/USB Type-C, eDP (optional) ƒ 2 GbE, 4 USB3.2, CAN Bus, DC-in 12-24V ƒ Expansion: M.2 E-Key/B-Key/M-Key (supports NVMe), MIOe ƒ Supports i

Intel짰 Atom??In-Vehicle Computing Box

Introduction The TREK-550 is a dedicated box computer for industrial vehicle fleets, transport trucks, buses and taxis. TREK-550 combined with variety of I/O connectors can be connected to devices like OBD-II or TPMS (Tire Pressure Monitoring Systems). Dual display/dual audio interfaces supporting

Intel짰 Atom??In-Vehicle Computing Box

Introduction The TREK-550 is a dedicated box computer for industrial vehicle fleets, transport trucks, buses and taxis. TREK-550 combined with variety of I/O connectors can be connected to devices like OBD-II or TPMS (Tire Pressure Monitoring Systems). Dual display/dual audio interfaces supporting

Intel짰 Atom??In-Vehicle Computing Box

Introduction The TREK-550 is a dedicated box computer for industrial vehicle fleets, transport trucks, buses and taxis. TREK-550 combined with variety of I/O connectors can be connected to devices like OBD-II or TPMS (Tire Pressure Monitoring Systems). Dual display/dual audio interfaces supporting

Intel짰 Atom??In-Vehicle Computing Box

Introduction The TREK-550 is a dedicated box computer for industrial vehicle fleets, transport trucks, buses and taxis. TREK-550 combined with variety of I/O connectors can be connected to devices like OBD-II or TPMS (Tire Pressure Monitoring Systems). Dual display/dual audio interfaces supporting

Intel짰 Atom??In-Vehicle Computing Box

Introduction The TREK-550 is a dedicated box computer for industrial vehicle fleets, transport trucks, buses and taxis. TREK-550 combined with variety of I/O connectors can be connected to devices like OBD-II or TPMS (Tire Pressure Monitoring Systems). Dual display/dual audio interfaces supporting

7 All-in-One Ultra Rugged Mobile Data Terminal

Features ƒ Intel® Atom™ E3827 SoC compatible with Windows 10 and Ubuntu OS ƒ 7 WVGA wide-angle LCD with resistive touch control ƒ Vehicle diagnostics interface with CAN (J1939, OBD-II/ISO 15765) and J1708 (J1587) protocols ƒ Built-in NFC, GNSS, WLAN, Bluetooth, and LTE WWAN modules ƒ Intelli

7 All-in-One Ultra Rugged Mobile Data Terminal

Features ƒ Intel® Atom™ E3827 SoC compatible with Windows 10 and Ubuntu OS ƒ 7 WVGA wide-angle LCD with resistive touch control ƒ Vehicle diagnostics interface with CAN (J1939, OBD-II/ISO 15765) and J1708 (J1587) protocols ƒ Built-in NFC, GNSS, WLAN, Bluetooth, and LTE WWAN modules ƒ Intelli

LDPE Sheet Metal Plugs

文件：118.04 Kbytes Page：1 Pages

Clamp Sensors

文件：451.92 Kbytes Page：1 Pages

Clamp Sensors

文件：125.07 Kbytes Page：1 Pages

LDPE Sheet Metal Plugs

文件：118.04 Kbytes Page：1 Pages

TAB HEADER, 2.8X0.8, 6-21POS MESSERLEISTE, 2.8X0.8, 6-21POL

文件：639.32 Kbytes Page：1 Pages

THIS DRAWING IS A CONTROLLED DOCUMENT.

文件：934.26 Kbytes Page：2 Pages

THIS DRAWING IS A CONTROLLED DOCUMENT.

文件：934.26 Kbytes Page：2 Pages

THIS DRAWING IS A CONTROLLED DOCUMENT.

文件：934.26 Kbytes Page：2 Pages

THIS DRAWING IS A CONTROLLED DOCUMENT.

文件：934.26 Kbytes Page：2 Pages

THIS DRAWING IS A CONTROLLED DOCUMENT.

文件：934.26 Kbytes Page：2 Pages

THIS DRAWING IS A CONTROLLED DOCUMENT.

文件：934.26 Kbytes Page：2 Pages

4U Rackmount / Tower Chassis for EATX/ATX/MicroATX Motherboard

文件：991.81 Kbytes Page：2 Pages

Its a complete tool kit that fits in your palm.

文件：1.8415 Mbytes Page：16 Pages

3M??Through-Board Socket

文件：276.77 Kbytes Page：5 Pages

4U Rackmount Chassis for Full-size SHB/SBC

文件：1.2557 Mbytes Page：2 Pages

2U Rackmount Chassis for ATX/MicroATX Motherboard

文件：785.97 Kbytes Page：2 Pages

2U Rackmount Chassis for ATX/MicroATX Motherboard

文件：541.8 Kbytes Page：2 Pages

Intel Atom D525 AFC with Dual GigaLAN and 16 COM/Expansion Slots

文件：531.04 Kbytes Page：2 Pages

AMPMODU II - 2.54mm [.100] Centerline Board-to-Board Headers

文件：494.8 Kbytes Page：3 Pages

MOS-to-LED Digit Driver, Quad Segment Driver