丝印代码：955A；Silicon Planar Zener Diodes

FEATURES • Total power dissipation: Max. 1.5 W. • Wide zener reverse voltage range 3.3V to 240V. • Small plastic package suitable for surface mounted design. MECHANICAL DATA • Case: SMA • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. Weight: 0.055g / 0.002oz

丝印代码：955A；Silicon Planar Zener Diodes

FEATURES ♦ Total power dissipation: Max. 1.5 W. ♦ Wide zener reverse voltage range 3.3V to 240V. ♦ Small plastic package suitable for surface mounted design. ♦ Lead free in comply with EU RoHS 2011/65/EU directives MECHANICAL DATA ♦ Case: DO-214AC/SMA ♦ Terminals: Solderable per MIL-STD-750

丝印代码：955A；PLASTIC-ENCAPSULATE ZENER DIODE

文件：512.57 Kbytes Page：3 Pages

丝印代码：955A；Surface Mount Silicon Zener Diodes

文件：612.4 Kbytes Page：3 Pages

CONN PLUG USB3.0 MICRO USB B SLD

文件：152.96 Kbytes Page：1 Pages

CONN PLUG USB3.0 MICRO USB B SLD

文件：152.96 Kbytes Page：1 Pages

SUBMINIATURE PC BOARD RELAY

FEATURES • Subminiature size for high density packaging • DIL pitch terminals • Epoxy sealed for automatic wave soldering • High sensitivity: 150 mW nominal with 84 mW pickup • Meets FCC Part 68.302 1500 V lightning surge • Meets FCC Part 68.304 1000 V dielectric • UL / CUR file E43203

SUBMINIATURE PC BOARD RELAY

[Zettler] FEATURES • Subminiature size for high density packaging • DIL pitch terminals • Epoxy sealed for automatic wave soldering • High sensitivity: 150 mW nominal with 84 mW pickup • Meets FCC Part 68.302 1500 V lightning surge • Meets FCC Part 68.304 1000 V dielectric • UL file E43203

SUBMINIATURE PC BOARD RELAY

FEATURES • Subminiature size for high density packaging • DIL pitch terminals • Epoxy sealed for automatic wave soldering • High sensitivity: 150 mW nominal with 84 mW pickup • Meets FCC Part 68.302 1500 V lightning surge • Meets FCC Part 68.304 1000 V dielectric • UL file E43203; CSA file