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9537价格

参考价格:¥0.2765

型号:9537 品牌:BELDEN 备注:这里有9537多少钱,2026年最近7天走势,今日出价,今日竞价,9537批发/采购报价,9537行情走势销售排行榜,9537报价。
型号 功能描述 生产厂家 企业 LOGO 操作

丝印代码:9537;4-bit I²C-bus and SMBus low power I/O port with interrupt and 4-bit I2C-bus and SMBus low power I/O port with interrupt and

ETC

知名厂家

9537

RS232, #24-7c, SR-PVC, O/A Foil, PVC Jkt, CMG

Product Description Computer EIA RS-232 Cable, 24 AWG stranded (7x32) tinned copper conductors, semi-rigid PVC insulation, overall Beldfoil® shield (100 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

9537

Computer Cable for EIA RS-232 Applications

文件:33.27 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

9537

MACHINE SCREW PAN PHILLIPS 10-32

文件:130.87 Kbytes Page:1 Pages

KEYSTONE

Keystone Electronics Corp.

9537

包装:散装 描述:SCOTCH-BRITE GRIDDLE SCRUBBER 95 工业用品 保洁和维护产品

3M

9537

包装:散装 描述:MACH SCREW FLAT SLOTTED #6-32 五金件,紧固件,配件 螺丝,螺栓

KEYSTONE

Keystone Electronics Corp.

丝印代码:95372AM;CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

TI

德州仪器

丝印代码:95372AM;CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

TI

德州仪器

丝印代码:95372AM;CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

TI

德州仪器

丝印代码:95372AM;CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

TI

德州仪器

丝印代码:95372AM;CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

TI

德州仪器

丝印代码:95372BM;CSD95372BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BM;CSD95372BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BM;CSD95372BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BMC;CSD95372BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature-Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BMC;CSD95372BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature-Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BMC;CSD95372BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature-Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BMC;CSD95372BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature-Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BMC;CSD95372BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature-Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BMC;CSD95372BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature-Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BM;CSD95372BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BM;CSD95372BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BM;CSD95372BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BM;CSD95372BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BM;CSD95372BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95373AM;CSD95373AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 45 A Continuous Operating Current Capability • 92.6% System Efficiency at 25 A • Ultra-Low Power Loss of 2.6 W at 25 A • High Frequency Operation (up to 2 MHz) • High Density – SON 5 × 6-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

TI

德州仪器

丝印代码:95373AM;CSD95373AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 45 A Continuous Operating Current Capability • 92.6% System Efficiency at 25 A • Ultra-Low Power Loss of 2.6 W at 25 A • High Frequency Operation (up to 2 MHz) • High Density – SON 5 × 6-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

TI

德州仪器

丝印代码:95373BM;CSD95373BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 45-A Continuous Operating Current Capability • 92.7% System Efficiency at 25 A • Low-Power Loss of 2.6 W at 25 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95373BM;CSD95373BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 45-A Continuous Operating Current Capability • 92.7% System Efficiency at 25 A • Low-Power Loss of 2.6 W at 25 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95373BM;CSD95373BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 45-A Continuous Operating Current Capability • 92.7% System Efficiency at 25 A • Low-Power Loss of 2.6 W at 25 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95373BM;CSD95373BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 45-A Continuous Operating Current Capability • 92.7% System Efficiency at 25 A • Low-Power Loss of 2.6 W at 25 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95373BM;CSD95373BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 45-A Continuous Operating Current Capability • 92.7% System Efficiency at 25 A • Low-Power Loss of 2.6 W at 25 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95373BM;CSD95373BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 45-A Continuous Operating Current Capability • 92.7% System Efficiency at 25 A • Low-Power Loss of 2.6 W at 25 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95375M;CSD95375Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• 93% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High Frequency Operation (up to 2 MHz) • High Density - SON 3.5 × 4.5-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode • 3.3

TI

德州仪器

丝印代码:95375M;CSD95375Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• 93% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High Frequency Operation (up to 2 MHz) • High Density - SON 3.5 × 4.5-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode • 3.3

TI

德州仪器

丝印代码:95377M;CSD95377Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Above 94% System Efficiency at 15 A • Max Rated Continuous Current 35 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm × 4.5-mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • 3.3-V and 5-V PWM Signal Compatible • Diode Emul

TI

德州仪器

丝印代码:95377M;CSD95377Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Above 94% System Efficiency at 15 A • Max Rated Continuous Current 35 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm × 4.5-mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • 3.3-V and 5-V PWM Signal Compatible • Diode Emul

TI

德州仪器

丝印代码:95377M;CSD95377Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Above 94% System Efficiency at 15 A • Max Rated Continuous Current 35 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm × 4.5-mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • 3.3-V and 5-V PWM Signal Compatible • Diode Emul

TI

德州仪器

丝印代码:95377M;CSD95377Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Above 94% System Efficiency at 15 A • Max Rated Continuous Current 35 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm × 4.5-mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • 3.3-V and 5-V PWM Signal Compatible • Diode Emul

TI

德州仪器

丝印代码:95378BM;CSD95378BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BM;CSD95378BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BM;CSD95378BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BMC;CSD95378BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BMC;CSD95378BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BMC;CSD95378BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BMC;CSD95378BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BMC;CSD95378BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BMC;CSD95378BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BM;CSD95378BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BM;CSD95378BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BM;CSD95378BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BM;CSD95378BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BM;CSD95378BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95379M;CSD95379Q3M Synchronous Buck NexFET™ Power Stage

1 Features 1• 92.5% System Efficiency at 12 A • Ultra-Low Power Loss of 1.8 W at 12 A • Max Rated Continuous Current of 20 A and Peak Current of 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Ultra-Low Inductance Package • System Optimized

TI

德州仪器

丝印代码:95379M;CSD95379Q3M Synchronous Buck NexFET™ Power Stage

1 Features 1• 92.5% System Efficiency at 12 A • Ultra-Low Power Loss of 1.8 W at 12 A • Max Rated Continuous Current of 20 A and Peak Current of 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Ultra-Low Inductance Package • System Optimized

TI

德州仪器

丝印代码:95379M;CSD95379Q3M Synchronous Buck NexFET™ Power Stage

1 Features 1• 92.5% System Efficiency at 12 A • Ultra-Low Power Loss of 1.8 W at 12 A • Max Rated Continuous Current of 20 A and Peak Current of 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Ultra-Low Inductance Package • System Optimized

TI

德州仪器

丝印代码:95379M;CSD95379Q3M Synchronous Buck NexFET™ Power Stage

1 Features 1• 92.5% System Efficiency at 12 A • Ultra-Low Power Loss of 1.8 W at 12 A • Max Rated Continuous Current of 20 A and Peak Current of 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Ultra-Low Inductance Package • System Optimized

TI

德州仪器

丝印代码:95379M;CSD95379Q3M Synchronous Buck NexFET™ Power Stage

1 Features 1• 92.5% System Efficiency at 12 A • Ultra-Low Power Loss of 1.8 W at 12 A • Max Rated Continuous Current of 20 A and Peak Current of 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Ultra-Low Inductance Package • System Optimized

TI

德州仪器

丝印代码:95379M;CSD95379Q3M Synchronous Buck NexFET™ Power Stage

1 Features 1• 92.5% System Efficiency at 12 A • Ultra-Low Power Loss of 1.8 W at 12 A • Max Rated Continuous Current of 20 A and Peak Current of 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Ultra-Low Inductance Package • System Optimized

TI

德州仪器

丝印代码:95379M;CSD95379Q3M Synchronous Buck NexFET™ Power Stage

1 Features 1• 92.5% System Efficiency at 12 A • Ultra-Low Power Loss of 1.8 W at 12 A • Max Rated Continuous Current of 20 A and Peak Current of 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Ultra-Low Inductance Package • System Optimized

TI

德州仪器

9537产品属性

  • 类型

    描述

  • 系列:

    95XX

  • 最低工作温度:

    -30°C

  • 最高工作温度:

    +80°C

  • 防火性能:

    阻燃

  • 线芯绞距:

    7/0.20 mm

  • 外层护套材料:

    PVC

  • 外径:

    5.08mm

  • 护套颜色:

  • 屏蔽类型:

  • 长度:

    305m

  • 屏蔽/无屏蔽:

    屏蔽

  • 美国线规:

    24 AWG

  • 芯数:

    7

  • 横截面积:

    0.22 mm²

更新时间:2026-5-15 23:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
恩XP
25+
N/A
18798
正规渠道,免费送样。支持账期,BOM一站式配齐
恩XP
24+
标准封装
8048
全新原装正品/价格优惠/质量保障
恩XP
2016+
MSOP10
3500
本公司只做原装,假一罚十,可开17%增值税发票!
恩XP
24+
MSOP
80000
只做自己库存 全新原装进口正品假一赔百 可开13%增
恩XP
2223+
MSOP-10
26800
只做原装正品假一赔十为客户做到零风险
恩XP
24+
N/A
12980
原装正品现货支持实单
恩XP
25+
MSOP10
262
百分百原装正品 真实公司现货库存 本公司只做原装 可
恩XP
22+
MSOP-10
12245
现货,原厂原装假一罚十!
恩XP
24+
TSSOP10
6230
只做原装正品
恩XP
25+
SMD
20000
原装

9537数据表相关新闻