9537价格

参考价格:¥0.2765

型号:9537 品牌:BELDEN 备注:这里有9537多少钱,2026年最近7天走势,今日出价,今日竞价,9537批发/采购报价,9537行情走势销售排行榜,9537报价。
型号 功能描述 生产厂家 企业 LOGO 操作
9537

RS232, #24-7c, SR-PVC, O/A Foil, PVC Jkt, CMG

Product Description Computer EIA RS-232 Cable, 24 AWG stranded (7x32) tinned copper conductors, semi-rigid PVC insulation, overall Beldfoil® shield (100 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

9537

包装:散装 描述:SCOTCH-BRITE GRIDDLE SCRUBBER 95 工业用品 保洁和维护产品

3M

9537

包装:散装 描述:MACH SCREW FLAT SLOTTED #6-32 五金件,紧固件,配件 螺丝,螺栓

KEYSTONE

Keystone Electronics Corp.

9537

MACHINE SCREW PAN PHILLIPS 10-32

文件:130.87 Kbytes Page:1 Pages

KEYSTONE

Keystone Electronics Corp.

9537

Computer Cable for EIA RS-232 Applications

文件:33.27 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

丝印代码:95372AM;CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

TI

德州仪器

丝印代码:95372AM;CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

TI

德州仪器

丝印代码:95372AM;CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

TI

德州仪器

丝印代码:95372AM;CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

TI

德州仪器

丝印代码:95372AM;CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

TI

德州仪器

丝印代码:95372BM;CSD95372BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BM;CSD95372BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BM;CSD95372BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BMC;CSD95372BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature-Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BMC;CSD95372BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature-Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BMC;CSD95372BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature-Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BMC;CSD95372BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature-Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BMC;CSD95372BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature-Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BMC;CSD95372BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature-Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BM;CSD95372BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BM;CSD95372BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BM;CSD95372BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BM;CSD95372BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95372BM;CSD95372BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95373AM;CSD95373AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 45 A Continuous Operating Current Capability • 92.6% System Efficiency at 25 A • Ultra-Low Power Loss of 2.6 W at 25 A • High Frequency Operation (up to 2 MHz) • High Density – SON 5 × 6-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

TI

德州仪器

丝印代码:95373AM;CSD95373AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 45 A Continuous Operating Current Capability • 92.6% System Efficiency at 25 A • Ultra-Low Power Loss of 2.6 W at 25 A • High Frequency Operation (up to 2 MHz) • High Density – SON 5 × 6-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

TI

德州仪器

丝印代码:95373BM;CSD95373BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 45-A Continuous Operating Current Capability • 92.7% System Efficiency at 25 A • Low-Power Loss of 2.6 W at 25 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95373BM;CSD95373BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 45-A Continuous Operating Current Capability • 92.7% System Efficiency at 25 A • Low-Power Loss of 2.6 W at 25 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95373BM;CSD95373BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 45-A Continuous Operating Current Capability • 92.7% System Efficiency at 25 A • Low-Power Loss of 2.6 W at 25 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95373BM;CSD95373BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 45-A Continuous Operating Current Capability • 92.7% System Efficiency at 25 A • Low-Power Loss of 2.6 W at 25 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95373BM;CSD95373BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 45-A Continuous Operating Current Capability • 92.7% System Efficiency at 25 A • Low-Power Loss of 2.6 W at 25 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95373BM;CSD95373BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 45-A Continuous Operating Current Capability • 92.7% System Efficiency at 25 A • Low-Power Loss of 2.6 W at 25 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95375M;CSD95375Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• 93% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High Frequency Operation (up to 2 MHz) • High Density - SON 3.5 × 4.5-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode • 3.3

TI

德州仪器

丝印代码:95375M;CSD95375Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• 93% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High Frequency Operation (up to 2 MHz) • High Density - SON 3.5 × 4.5-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode • 3.3

TI

德州仪器

丝印代码:95377M;CSD95377Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Above 94% System Efficiency at 15 A • Max Rated Continuous Current 35 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm × 4.5-mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • 3.3-V and 5-V PWM Signal Compatible • Diode Emul

TI

德州仪器

丝印代码:95377M;CSD95377Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Above 94% System Efficiency at 15 A • Max Rated Continuous Current 35 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm × 4.5-mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • 3.3-V and 5-V PWM Signal Compatible • Diode Emul

TI

德州仪器

丝印代码:95377M;CSD95377Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Above 94% System Efficiency at 15 A • Max Rated Continuous Current 35 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm × 4.5-mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • 3.3-V and 5-V PWM Signal Compatible • Diode Emul

TI

德州仪器

丝印代码:95377M;CSD95377Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Above 94% System Efficiency at 15 A • Max Rated Continuous Current 35 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm × 4.5-mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • 3.3-V and 5-V PWM Signal Compatible • Diode Emul

TI

德州仪器

丝印代码:95378BM;CSD95378BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BM;CSD95378BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BM;CSD95378BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BMC;CSD95378BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BMC;CSD95378BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BMC;CSD95378BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BMC;CSD95378BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BMC;CSD95378BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BMC;CSD95378BQ5MC Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bidirectional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BM;CSD95378BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BM;CSD95378BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BM;CSD95378BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BM;CSD95378BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95378BM;CSD95378BQ5M Synchronous Buck NexFET™ Smart Power Stage

1 Features 1• 60-A Continuous Operating Current Capability • 93.4% System Efficiency at 30 A • Low-Power Loss of 2.8 W at 30 A • High-Frequency Operation (up to 1.25 MHz) • Diode Emulation Mode With FCCM • Temperature Compensated Bi-Directional Current Sense • Analog Temperature Output

TI

德州仪器

丝印代码:95379M;CSD95379Q3M Synchronous Buck NexFET™ Power Stage

1 Features 1• 92.5% System Efficiency at 12 A • Ultra-Low Power Loss of 1.8 W at 12 A • Max Rated Continuous Current of 20 A and Peak Current of 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Ultra-Low Inductance Package • System Optimized

TI

德州仪器

丝印代码:95379M;CSD95379Q3M Synchronous Buck NexFET™ Power Stage

1 Features 1• 92.5% System Efficiency at 12 A • Ultra-Low Power Loss of 1.8 W at 12 A • Max Rated Continuous Current of 20 A and Peak Current of 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Ultra-Low Inductance Package • System Optimized

TI

德州仪器

丝印代码:95379M;CSD95379Q3M Synchronous Buck NexFET™ Power Stage

1 Features 1• 92.5% System Efficiency at 12 A • Ultra-Low Power Loss of 1.8 W at 12 A • Max Rated Continuous Current of 20 A and Peak Current of 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Ultra-Low Inductance Package • System Optimized

TI

德州仪器

丝印代码:95379M;CSD95379Q3M Synchronous Buck NexFET™ Power Stage

1 Features 1• 92.5% System Efficiency at 12 A • Ultra-Low Power Loss of 1.8 W at 12 A • Max Rated Continuous Current of 20 A and Peak Current of 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Ultra-Low Inductance Package • System Optimized

TI

德州仪器

丝印代码:95379M;CSD95379Q3M Synchronous Buck NexFET™ Power Stage

1 Features 1• 92.5% System Efficiency at 12 A • Ultra-Low Power Loss of 1.8 W at 12 A • Max Rated Continuous Current of 20 A and Peak Current of 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Ultra-Low Inductance Package • System Optimized

TI

德州仪器

丝印代码:95379M;CSD95379Q3M Synchronous Buck NexFET™ Power Stage

1 Features 1• 92.5% System Efficiency at 12 A • Ultra-Low Power Loss of 1.8 W at 12 A • Max Rated Continuous Current of 20 A and Peak Current of 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Ultra-Low Inductance Package • System Optimized

TI

德州仪器

丝印代码:95379M;CSD95379Q3M Synchronous Buck NexFET™ Power Stage

1 Features 1• 92.5% System Efficiency at 12 A • Ultra-Low Power Loss of 1.8 W at 12 A • Max Rated Continuous Current of 20 A and Peak Current of 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Ultra-Low Inductance Package • System Optimized

TI

德州仪器

丝印代码:95379M;CSD95379Q3M Synchronous Buck NexFET™ Power Stage

1 Features 1• 92.5% System Efficiency at 12 A • Ultra-Low Power Loss of 1.8 W at 12 A • Max Rated Continuous Current of 20 A and Peak Current of 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.3-mm × 3.3-mm Footprint • Ultra-Low Inductance Package • System Optimized

TI

德州仪器

9537产品属性

  • 类型

    描述

  • 型号

    9537

  • 功能描述

    螺丝和紧固件 5/8 6-32 NYLON FLT

  • RoHS

  • 制造商

    Unspecified

  • 类型

    Washer

  • 材料

    Steel

  • 电镀

    Nickel

更新时间:2026-3-13 17:23:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TE
NA
43589
一级代理 原装正品假一罚十价格优势长期供货
恩XP
0814+
MSOP10
10
一级代理,专注军工、汽车、医疗、工业、新能源、电力
WEID
23+
NA
1836
专做原装正品,假一罚百!
TE/泰科
26+
NA
360000
只有原装
TE/泰科
2508+
原厂封装
182881
一级代理,原装现货
FUJITSU/富士通
24+
302
现货供应
TE/泰科
24+
13680
原厂现货渠道
TE/泰科
2407+
30098
全新原装!仓库现货,大胆开价!
FUJITSU/富士通
23+
TO-59
8510
原装正品代理渠道价格优势
TE/泰科
23+
NA/原装
82985
代理-优势-原装-正品-现货*期货

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