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87761价格
参考价格：￥4.0763
型号：87761-BULK 品牌：Belden 备注：这里有87761多少钱，2025年最近7天走势，今日出价，今日竞价，87761批发/采购报价，87761行情走势销售排行榜，87761报价。| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
87761 | Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP Product Description High Temperature Electronic, 2 Conductor 22AWG (7x30) Tinned Copper, FEP Insulation, Overall Beldfoil® Shield, PVDF Outer Jacket, CMP | BELDEN 百通 |   | |
Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP Product Description High Temperature Electronic, 2 Conductor 22AWG (7x30) Tinned Copper, FEP Insulation, Overall Beldfoil® Shield, PVDF Outer Jacket, CMP | BELDEN 百通 | | ||
Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP Product Description High Temperature Electronic, 2 Conductor 22AWG (7x30) Tinned Copper, FEP Insulation, Overall Beldfoil® Shield, PVDF Outer Jacket, CMP | BELDEN 百通 | | ||
Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP Product Description High Temperature Electronic, 2 Conductor 22AWG (7x30) Tinned Copper, FEP Insulation, Overall Beldfoil® Shield, PVDF Outer Jacket, CMP | BELDEN 百通 | | ||
包装：线轴 描述：CBL 1PR 22AWG SHLD 电缆，电线 多芯导线 | BELDEN 百通 | | ||
包装：线轴 描述：CBL 1PR 22AWG SHLD 电缆，电线 多芯导线 | BELDEN 百通 | | ||
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 20 Circuits, 0.75關m (30關) Gold (Au) Selective Plating 文件：308.98 Kbytes Page：5 Pages | MOLEX10 莫仕 | | ||
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 24 Circuits, 0.75關m (30關) Gold (Au) Selective Plating 文件：308.99 Kbytes Page：5 Pages | MOLEX10 莫仕 | | ||
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 44 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, 12.50mm (.492) Stacking 文件：106.44 Kbytes Page：3 Pages | MOLEX10 莫仕 | | ||
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.75關m (30關) Gold (Au) Selective Plating, 10.30mm (.406) Stacking Height 文件：308.98 Kbytes Page：5 Pages | MOLEX10 莫仕 | | ||
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, 8.70mm (.343) Stacking Height 文件：309.25 Kbytes Page：5 Pages | MOLEX10 莫仕 | | ||
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, 5.71mm (.225) Stacking Height 文件：237.45 Kbytes Page：4 Pages | MOLEX10 莫仕 | |
87761产品属性
- 类型
描述
- 型号
87761
- 制造商
MOLEX
- 制造商全称
Molex Electronics Ltd.
- 功能描述
2.00mm(.079) Pitch Milli-Grid? Header, Dual Row Dual Body, Through Hole, Vertical, 20 Circuits, 0.75μm(30μ) Gold(Au) Selective Plating
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
MOLEX/莫仕 |
2508+ |
/ |
226570 |
一级代理，原装现货 |
|||
MOLEX/莫仕 |
24+ |
19405 |
原厂现货渠道 |
||||
MOLEX |
24+ |
con |
35960 |
查现货到京北通宇商城 |
87761芯片相关品牌
87761规格书下载地址
87761参数引脚图相关
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- 8778-CHR-250
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- 87783-0301
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- 8778
- 8777SB0101000
- 8777NH0601000
- 87779-1001
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- 8777060250
- 87770601000
- 8777060100
- 8777
- 87762-0006
- 87761-BULK
- 87760-4416
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- 87760-2016
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- 87734
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- 8766K
- 87668
- 87667-6
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- 87667-3
- 87667-2
- 87667-1
- 87667
- 87666-5
- 87666-4
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- 87666-2
87761数据表相关新闻
874001AGI-05LF绝对原装，只做原装
874001AGI-05LF绝对原装，只做原装
2024-9-1487715-9901保证原装，现货价优
87715-9901保证原装，现货价优
2024-8-1587832-1420
87832-1420
2024-4-1087568-1444
集管和線殼 MGrid IDT Rec W/PolK PolKey .76AuLF 14Ckt
2024-3-487832-1420
集管和線殼 14P SMD PB FREE SHRD
2024-1-15878321414
878321414
2021-9-10
DdatasheetPDF页码索引
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