型号 功能描述 生产厂家 企业 LOGO 操作
72T18105L10BB

2.5 VOLT HIGH-SPEED TeraSync??FIFO

文件:372.41 Kbytes Page:56 Pages

IDT

72T18105L10BB

封装/外壳:240-BGA 功能:异步,同步 包装:卷带(TR) 描述:IC FIFO 131X18 2.5V 10NS 24BGA 集成电路(IC) FIFO 存储器

ETC

知名厂家

2.5 VOLT HIGH-SPEED TeraSync™ FIFO 18-BIT/9-BIT CONFIGURATIONS

FEATURES: • Choose among the following memory organizations: IDT72T1845 ⎯ 2,048 x 18/4,096 x 9 IDT72T1855 ⎯ 4,096 x 18/8,192 x 9 IDT72T1865 ⎯ 8,192 x 18/16,384 x 9 IDT72T1875 ⎯ 16,384 x 18/32,768 x 9 IDT72T1885 ⎯ 32,768 x 18/65,536 x 9 IDT72T1895 ⎯ 65,536 x 18/131,072 x 9 IDT72T18105 ⎯ 131

RENESAS

瑞萨

2.5 VOLT HIGH-SPEED TeraSync™ FIFO 18-BIT/9-BIT CONFIGURATIONS

FEATURES: • Choose among the following memory organizations: IDT72T1845 ⎯ 2,048 x 18/4,096 x 9 IDT72T1855 ⎯ 4,096 x 18/8,192 x 9 IDT72T1865 ⎯ 8,192 x 18/16,384 x 9 IDT72T1875 ⎯ 16,384 x 18/32,768 x 9 IDT72T1885 ⎯ 32,768 x 18/65,536 x 9 IDT72T1895 ⎯ 65,536 x 18/131,072 x 9 IDT72T18105 ⎯ 131

RENESAS

瑞萨

2.5 VOLT HIGH-SPEED TeraSync FIFO 18-BIT/9-BIT CONFIGURATIONS

文件:540.67 Kbytes Page:55 Pages

IDT

2.5 VOLT HIGH-SPEED TeraSync FIFO 18-BIT/9-BIT CONFIGURATIONS

文件:540.67 Kbytes Page:55 Pages

IDT

72T18105L10BB产品属性

  • 类型

    描述

  • 型号

    72T18105L10BB

  • 制造商

    Integrated Device Technology Inc

  • 功能描述

    FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 128K x 18/256K x 9 240-Pin BGA

  • 制造商

    Integrated Device Technology Inc

  • 功能描述

    FIFO ASYNC/SYNC DUAL DEPTH/WIDTH UNI-DIR 128KX18/256KX9 240B - Trays

更新时间:2025-11-6 22:59:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
RENESAS(瑞萨)/IDT
24+
PBGA240(19x19)
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
IDT, Integrated Device Technol
24+
240-PBGA(19x19)
53200
一级代理/放心采购
RENESAS(瑞萨)/IDT
2021+
PBGA-240(19x19)
499
RENESAS(瑞萨)/IDT
2447
PBGA-240(19x19)
315000
1个/托盘一级代理专营品牌!原装正品,优势现货,长期
24+
N/A
48000
一级代理-主营优势-实惠价格-不悔选择
Renesas
25+
电联咨询
7800
公司现货,提供拆样技术支持
IDT
25+
BGA-240
10
就找我吧!--邀您体验愉快问购元件!

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