F (M/F) Right Angle, F(M/F), F (F/F) Bulkhead, F (F) PCB

Features • True 75 Ω BNC adapters. • Gold-plated (15 micro–inches) contacts. • BNC insulation material is PTFE (not delrin).

包装：散装 描述：CONN ADAPT PLUG TO JACK F 75 OHM 连接器，互连器件 同轴连接器（RF）适配器

CANopen / DeviceNet Data Single-Ended Cordset

Product Description CANopen / DeviceNet Data Single-Ended Cordset: M12 Standard, female, straight, 5-pin, A-coded, black body, 50 V AC / 60 V DC, 4 A; PUR black cable, 4-wires, Data: 2x0.25 mm² + Power: 2x0.34 mm²

Crimping Die Assemblies for COPALUM Sealed Terminals and Splices

文件：653.48 Kbytes Page：9 Pages

COM Express® Basic Type 7 with AMD EPYC™ Embedded 3000 SoC Processors

文件：2.36255 Mbytes Page：4 Pages

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文件：2.36255 Mbytes Page：4 Pages

COM Express® Basic Type 7 with AMD EPYC™ Embedded 3000 SoC Processors

文件：2.36255 Mbytes Page：4 Pages

COM Express® Basic Type 7 with AMD EPYC™ Embedded 3000 SoC Processors

文件：2.36255 Mbytes Page：4 Pages

COM Express® Basic Type 7 with AMD EPYC™ Embedded 3000 SoC Processors

文件：2.36255 Mbytes Page：4 Pages

COM Express® Basic Type 7 with AMD EPYC™ Embedded 3000 SoC Processors

文件：2.36255 Mbytes Page：4 Pages

COM Express® Basic Type 7 with AMD EPYC™ Embedded 3000 SoC Processors

文件：2.36255 Mbytes Page：4 Pages

包装：盒 描述：HGUIDE N580 EVALUATION KIT WITH 开发板，套件，编程器 评估板 - 传感器

专用传感器

Crimping Die Assemblies and Supports for COPALUM Lite Sealed Terminals and Splices

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CRIMP SPLICER, STUB

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COM Express® Basic Type 7 with AMD EPYC™ Embedded 3000 SoC Processors

文件：2.36255 Mbytes Page：4 Pages

Crimping Die Assemblies and Supports for COPALUM Lite Sealed Terminals and Splices

文件：1.08185 Mbytes Page：17 Pages

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