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位置：首页 > IC中文资料第4423页 > 638-01

638-01价格

参考价格：￥26.5186

型号：638-015-230-047 品牌：EDAC 备注：这里有638-01多少钱，2025年最近7天走势，今日出价，今日竞价，638-01批发/采购报价，638-01行情走势销售排行榜，638-01报价。

型号	功能描述	生产厂家企业	LOGO
638-015-010-051	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-051	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-052	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-052	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-053	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-053	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-058	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-058	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-059	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-059	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-251	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-251	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-252	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-252	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-253	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-253	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-258	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-258	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-259	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-259	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-041	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-041	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-042	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-042	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-043	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-043	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-046	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-046	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-047	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-047	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-048	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-048	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-049	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-049	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-061	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-061	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-062	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-062	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-063	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-063	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-066	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-066	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-067	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-067	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-068	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-068	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-069	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-069	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-241	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-241	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-242	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-242	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-243	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-243	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-246	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-246	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-247	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-247	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-248	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-248	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC

638-01产品属性

类型
描述
型号
638-01
功能描述
HOURMETER ETI 10-80VDC 1W RND
RoHS
是
类别
工业控制，仪表 >> 仪表 - 小时
系列
638
其它有关文件
Declaration of Conformity
标准包装
1
系列
CHG48
显示器类型
- 电压 -
额定
24 ~ 30VAC
特点
无复位
封装/外壳
面板安装

638-01供应商更多...

更新时间：2025-12-26 16:30:00

IC供应商	芯片型号	品牌	批号	封装	库存	备注	价格
深圳市一线半导体有限公司	638-015-222-041	EDACInc	24+		50		询价
深圳市骏创达科技有限公司	638017200	MOLEX/莫仕	2508+	/	295898	一级代理，原装现货	询价
贸泽芯城（深圳）电子科技有限公司	638017300	MOLEX/莫仕	23+	Connector	9038	原厂授权代理,海外优势订货渠道。可提供大量库存,详	询价
深圳阅创想电子实业有限公司	638015100	MOLEX/莫仕	24+		13629	原厂现货渠道	询价
深圳市安富世纪电子有限公司	63-8016	IR	23+	GA-CHIPSWAFERS	8000	只做原装现货	询价
天津市博通航睿技术有限公司	63-8016	IR	23+	GA-CHIPSWAFERS	7000		询价
深圳市科雨电子有限公司	638-015-230-046	EDAC	25+	连接器	963	就找我吧!--邀您体验愉快问购元件!	询价
深圳市河锋鑫科技有限公司	63-8016	IR	22+	GA-CHIPS&WAFERS	6000	终端可免费供样,支持BOM配单	询价

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引脚触点镀金 14-18 AWG 压接
2021-9-15
618购5G手机？买得起玩的溜的OPPO手机Ace2了解一下
618购5G手机？买得起玩的溜的OPPO手机 Ace2了解一下
2020-6-5
63ZLH330MEFC10X23
63ZLH330MEFC10X23，全新原装当天发货或门市自取0755-82732291.
2019-3-1

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638078-1 TE连接器引脚触点端子 镀金 14-18 AWG 压接

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DdatasheetPDF页码索引

638078-1 TE连接器引脚触点端子镀金 14-18 AWG 压接