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638-01价格

参考价格：￥26.5186

型号：638-015-230-047 品牌：EDAC 备注：这里有638-01多少钱，2026年最近7天走势，今日出价，今日竞价，638-01批发/采购报价，638-01行情走势销售排行榜，638-01报价。

型号	功能描述	生产厂家企业	LOGO
638-015-010-051	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-051	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-052	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-052	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-053	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-053	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-058	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-058	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-059	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-059	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-251	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-251	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-252	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-252	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-253	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-253	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-258	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-258	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-259	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-010-259	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-041	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-041	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-042	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-042	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-043	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-043	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-046	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-046	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-047	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-047	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-048	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-048	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-049	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-049	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-061	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-061	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-062	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-062	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-063	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-063	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-066	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-066	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-067	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-067	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-068	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-068	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-069	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-069	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-241	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-241	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-242	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-242	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-243	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-243	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-246	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-246	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-247	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-247	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-248	638 Series,D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC
638-015-230-248	638 Series D-Sub Connectors \| Vertical High Density \| PCB Mount \| Metal Body \| Receptacle Features Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention Grounding Features include Boardlock for Excep	EDAC 亚得电子	EDAC

638-01产品属性

类型
描述
总PIN位数：
15P
安装方式：
直插
排数：
3
触头镀层：
金

638-01供应商更多...

更新时间：2026-5-19 22:30:00

IC供应商	芯片型号	品牌	批号	封装	库存	备注	价格
深圳市纳艾斯科技有限公司	638/2HP	EBM-PAPST	24+	NA	80000	只做自己库存全新原装进口正品假一赔百可开13%增	询价
深圳市科恒伟业电子有限公司	638001	WURTH/伍尔特	2450+	SMD	9850	只做原装正品现货或订货假一赔十!	询价
深圳市骏创达科技有限公司	638000120	MOLEX/莫仕	2608+	/	220083	一级代理，原装现货	询价
深圳阅创想电子实业有限公司	638000122	MOLEX/莫仕	24+		12554	原厂现货渠道	询价
深圳市芯睿晨科技有限公司	63800-1	TE Connectivity AMP Connectors	23+	原厂封装	40	只做原装只有原装现货实报	询价
深圳市向鸿伟业电子有限公司	63800-1	TE/泰科	2407+	con	10750	只有原装!量大可以订!一片起卖!	询价
深圳市米特尔科技有限公司	63800-1	TE/泰科	23+	NA/原装	82985	代理-优势-原装-正品-现货*期货	询价
天津市博通航睿技术有限公司	63800-1	TE			920		询价
北京京北通宇电子元件有限公司	63800-1	TE	24+	con	875	现货常备产品原装可到京北通宇商城查价格	询价
艾睿（深圳）半导体有限公司	638/2HP	EBM-PAPST	2447	NA	100500	一级代理专营品牌!原装正品,优势现货,长期排单到货	询价

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632723300021
2022-8-2
638078-1 TE连接器引脚触点端子镀金 14-18 AWG 压接
引脚触点镀金 14-18 AWG 压接
2021-9-15
618购5G手机？买得起玩的溜的OPPO手机Ace2了解一下
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2020-6-5
63ZLH330MEFC10X23
63ZLH330MEFC10X23，全新原装当天发货或门市自取0755-82732291.
2019-3-1

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63SXE100M

62783G-SOP18R-TG_UTC代理商

632723300021

638078-1 TE连接器引脚触点端子 镀金 14-18 AWG 压接

618购5G手机？买得起玩的溜的OPPO手机Ace2了解一下

63ZLH330MEFC10X23

DdatasheetPDF页码索引

638078-1 TE连接器引脚触点端子镀金 14-18 AWG 压接