包装：袋 描述：LOW OUTGASSING LABEL MATERIAL 标签，标志，护栏，标识 标签，贴纸，贴标 - 空白

包装：盒 描述：TEST CLIP QFP 208 (4 X 52) 测试与计量 测试夹 - IC

Channel style heat sink with folded back fins

Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.

Channel style heat sink with folded back fins

Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.

For use with TO-220 packages

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How to Use This Catalog

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Product Change Notification

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For use with TO-220 packages

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How to Use This Catalog

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Isolated Diode Array with HiRel MQ, MX, MV, and SP Screening Options

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DIODE ARRAY CIRCUITS

DESCRIPTION The Linfinity series of diode arrays feature high breakdown, high speed diodes in a variety of configurations. Each array configuration consists of either common anode diodes, common cathode diodes, or a combination of common anode and common cathode diodes. Individual diodes within

POWER ZENERS

DESCRIPTION Fused-in-glass, metallurgically-bonded 5 watt zeners. FEATURES • 2 Times Greater Surge Rating than Conventional 10 Watt Zeners • Small Physical Size

Quad smart power solid state relay for complete H bridge configurations

Description The VN5770AK-E is a device formed by three monolithic chips housed in a standard SO-28 package: a double high side and two low side switches. The double high side is made using STMicroelectronics VIPower™ M0-5 Technology, while the low side switches are fully protected VIPower™ M0-3 O

HIGH-PERFORMANCE 8/4-PORT SATA-I ????PCI-X-R CONTROLLERS

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NPN SILICON TRANSISTOR

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