包装：袋 描述：LOW OUTGASSING LABEL MATERIAL 标签，标志，护栏，标识 标签，贴纸，贴标 - 空白

包装：盒 描述：TEST CLIP QFP 208 (4 X 52) 测试与计量 测试夹 - IC

Channel style heat sink with folded back fins

Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.

Channel style heat sink with folded back fins

Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.

For use with TO-220 packages

文件：79.6 Kbytes Page：2 Pages

How to Use This Catalog

文件：8.73467 Mbytes Page：116 Pages

Product Change Notification

文件：26.44 Kbytes Page：2 Pages

For use with TO-220 packages

文件：82.46 Kbytes Page：2 Pages

How to Use This Catalog

文件：8.73467 Mbytes Page：116 Pages

Isolated Diode Array with HiRel MQ, MX, MV, and SP Screening Options

文件：64.129 Kbytes Page：2 Pages

6-Channel, 14-Bit, Current Output DAC

文件：2.053239 Mbytes Page：59 Pages

High Performance Photodiode in Side Look Package

文件：195.11 Kbytes Page：5 Pages

HIGH-PERFORMANCE 8/4-PORT SATA-I ????PCI-X-R CONTROLLERS

文件：129.38 Kbytes Page：2 Pages

NPN SILICON TRANSISTOR

文件：47.33 Kbytes Page：1 Pages