DSA Keycaps for MX Compatible Switches in Various Colors

Dress up your mechanical keys in your favorite colors, with a wide selection of stylish DSA key caps. Here is a 10 pack of Adafruit black DSA keycaps for your next mechanical keyboard or NeoKey project. Snap 'em onto any Cherry MX or compatible switch to turn your Feather or breakout into the lil'es

包装：散装 描述：11N SLEEVE REPAIR PART 工具 配件

Speaker Cable, 2 Conductor 2.5 mm², BC, Unshielded

Product Description Highly Flexible Speaker Cable, 2 core 2.5 mm² stranded bare copper conductors with TPE insulation, TPE jacket

2.0mm Pitch Battery Conn Male DIP R/A H=4.2mm

Voltage: 30 Volts AC (per pin) \n\nCurrent: 5.0Amperes (per pin) \n\nContact Resistance:40mΩ max. \n\nDielectric Withstanding Voltage: 500 VAC Min. \n\nInsulation Resistance: 500MΩ min. \n\nOperating Temp. : -40℃ ~ +85℃ • Family: Blade Male\n• Pitch(mm): 2.00\n• PCB Mounting: T/H\n• Operation Direction: R/A Sink\n• AbovePCBHeight (mm): 4.20\n• Current(A): 5.0\n• Screw (Yes/No): No\n• Circuits: 5;

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

1/2.7” 2.2MP NIR Enhanced Global Shutter Image

Features ● 1/2.7” ● 1600x1400 ● 8/10/12-bit ● 2.79 μm 90 fps global shutter with CDS High sensitivity Small die size achieved via state-of-the-art stacked BSI technology Class leading QE at 940 nm combined with high sensitivity. Industry leading PLS at 940 nm Digital CDS and row noise c

护线盒

包装：散装 描述：GRILL GUARD 254 MM FOR M4Q SER 风扇，热管理 风扇 - 护手板，滤波器和套管

40V, 600mA Buck Converters with Low-Quiescent-Current Linear Regulator Mode

General Description The MAX5096/MAX5097 easy-to-use, Dual Mode™, DC-DC converters operate as LDO (low dropout) or switch-mode buck converters. At a high output load, the converters operate as high-efficiency pulse-width modulated (PWM) switch-mode converters and reduce the power dissipation. The

40V, 600mA Buck Converters with Low-Quiescent-Current Linear Regulator Mode

General Description The MAX5096/MAX5097 easy-to-use, Dual Mode™, DC-DC converters operate as LDO (low dropout) or switch-mode buck converters. At a high output load, the converters operate as high-efficiency pulse-width modulated (PWM) switch-mode converters and reduce the power dissipation. The

40V, 600mA Buck Converters with Low-Quiescent-Current Linear Regulator Mode

General Description The MAX5096/MAX5097 easy-to-use, Dual Mode™, DC-DC converters operate as LDO (low dropout) or switch-mode buck converters. At a high output load, the converters operate as high-efficiency pulse-width modulated (PWM) switch-mode converters and reduce the power dissipation. The

DECT baseband controllers

INTRODUCTION This data sheet details the specific features of the: PCD5090/xxx; DSP-ROM, with external ROM PCA5097/xxx; DSP-ROM, with Field Electronically Erasable Programmable Read Only Memory (FEEPROM). FEATURES General • The PCx509x is designed for GAP-compliant handsets and simple base sta

DECT baseband controllers

INTRODUCTION This data sheet details the specific features of the: PCD5090/xxx; DSP-ROM, with external ROM PCA5097/xxx; DSP-ROM, with Field Electronically Erasable Programmable Read Only Memory (FEEPROM). FEATURES General • The PCx509x is designed for GAP-compliant handsets and simple base sta