Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Heyco®-Tite Brass Liquid Tight Cordgrips

文件：267.06 Kbytes Page：1 Pages

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

包装：散装 描述：GK NICU NRS PU V0 REC RF/IF，射频/中频和 RFID RFI 和 EMI - 触头，簧片和衬垫

包装：线轴 描述：GK,NICU,PTAFG,PU,V0,REC .060X.65 RF/IF，射频/中频和 RFID RFI 和 EMI - 触头，簧片和衬垫

Heyco®-Tite Brass Liquid Tight Cordgrips

文件：267.06 Kbytes Page：1 Pages

6.4 VOLT ZENER VOLTAGE 5

• 1N4565A THRU 1N4584A AVAILABLE IN JANHC AND JANKC PER MIL-PRF-19500/452 • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • 6.4 VOLT ZENER VOLTAGE ± 5 • ELECTRICALLY EQUIVALENT TO 1N4565 THRU 1N4584A • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF

6.4 VOLT ZENER VOLTAGE 5

• 1N4565A THRU 1N4584A AVAILABLE IN JANHC AND JANKC PER MIL-PRF-19500/452 • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • 6.4 VOLT ZENER VOLTAGE + 5 • ELECTRICALLY EQUIVALENT TO 1N4565 THRU 1N4584A • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF