封装/外壳：模块，SMA 连接器 功能：相移 包装：卷带（TR） 描述：30 PHASE SHIFT SMA WIDE BAND RF/IF，射频/中频和 RFID RF 其它 IC 和模块

Heyco®-Tite Brass Liquid Tight Cordgrips

文件：267.06 Kbytes Page：1 Pages

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

Strain Gage Load Cell for Tensile and Compression Forces, 0 ... 20 kN up to 0 ... 500 kN

包装：散装 描述：SPHERICAL BEARING LINK 工具 压接器，压接机，压力机 - 配件

Heyco®-Tite Brass Liquid Tight Cordgrips

文件：267.06 Kbytes Page：1 Pages

6.4 VOLT ZENER VOLTAGE 5

• 1N4565A THRU 1N4584A AVAILABLE IN JANHC AND JANKC PER MIL-PRF-19500/452 • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • 6.4 VOLT ZENER VOLTAGE + 5 • ELECTRICALLY EQUIVALENT TO 1N4565 THRU 1N4584A • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF

6.4 VOLT ZENER VOLTAGE 5

• 1N4565A THRU 1N4584A AVAILABLE IN JANHC AND JANKC PER MIL-PRF-19500/452 • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • 6.4 VOLT ZENER VOLTAGE ± 5 • ELECTRICALLY EQUIVALENT TO 1N4565 THRU 1N4584A • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF