Product Description

3M™ Thermally Conductive Silicone Interface Pad (TCSIP) 5519 is designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. 3M TCSIP 5519 consists of a highly conformable and slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles, which helps provide enhanced thermal conductivity and excellent electrical insulation performance.

Key Features

• Very high thermal conductivity and good electrical insulation properties

• Good softness and conformability even to non-flat surfaces

• Good electrical insulation properties

• Good flame retardant, UL94 V-0 equivalent material

• Compression relaxation properties help reduce pressure to electric components

• Slight tack allows pre-assembly

• Good wettability for improved and lower thermal resistance

Applications

• Integrated chip (IC) packaging heat conduction

• Heat sink interface

• Chip on film (COF) heat conduction

• LED board thermal interface material (TIM)

• HDTV integrated chip (IC)

• General gap filling in electronic device