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型号 功能描述 生产厂家 企业 LOGO 操作
3108A

RS485, 3 Pr #22 Str TC, PO Ins, OSTC Brd, PVC Jkt, CM

文件:251.58 Kbytes Page:3 Pages

BELDEN

百通

3108A

110A竊?0V N-CHANNEL MOSFET

文件:470.23 Kbytes Page:7 Pages

KIA

可易亚半导体

包装:线轴 描述:CBL 3PR 22AWG SHLD 电缆,电线 多芯导线

HIRSCHMANN

包装:线轴 描述:CBL 3PR 22AWG SHLD 电缆,电线 多芯导线

HIRSCHMANN

RS485, 3 Pr #22 Str TC, PO Ins, OSTC Brd, PVC Jkt, CM

文件:251.58 Kbytes Page:3 Pages

BELDEN

百通

RS485, 3 Pr #22 Str TC, PO Ins, OSTC Brd, PVC Jkt, CM

文件:251.58 Kbytes Page:3 Pages

BELDEN

百通

RS485, 3 Pr #22 Str TC, PO Ins, OSTC Brd, PVC Jkt, CM

文件:251.58 Kbytes Page:3 Pages

BELDEN

百通

L-band Down Converter IC with On-Chip PLL

Description The CXA3108AQ is a monolithic IC that downconverts the L-band (1 to 2 GHz) 1st IF to 2nd IF for satellite broadcast receivers. It integrates a local oscillator circuit, double-balanced mixer, IF AGC amplifier and tuning PLL onto a single chip. This IC supports both analog and digita

SONYSony Corporation

索尼

PIN Photodiode

PIN Photodiode For optical control systems Features ● High sensitivity and low dark current ● For one-dimensional light-point position detection ● Good positional linearity ● Small plastic package

PANASONIC

松下

TRIPLE-BAND GSM/DCS/PCS POWER AMP MODULE

Product Description The RF3108 is a high-power, high-efficiency power amplifier module offering high performance in GSM or GPRS applications. The device is self-contained with 50Ω input and output terminals. The device is manufactured on an advanced GaAs HBT process, and has been designed for u

RFMD

威讯联合

TRIPLE-BAND GSM/DCS/PCS POWER AMP MODULE

Product Description The RF3108 is a high-power, high-efficiency power amplifier module offering high performance in GSM or GPRS applications. The device is self-contained with 50Ω input and output terminals. The device is manufactured on an advanced GaAs HBT process, and has been designed for u

RFMD

威讯联合

Single-Chip Video Processor

Introduction The entire video processing and controlling for a color TV has been developed on a single chip in 0.8µ CMOS technology. Modular design and submicron technology allow the economic integration of features in all classes of TV sets. Open architecture is the key word to the new DSP gene

MICRONAS

更新时间:2026-7-29 16:26:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TE/泰科
2608+
/
182881
一级代理,原装现货

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