包装：盒 描述：LASER HEAD (33141), 1.52UM, 1.0M 光电器件 氦氖激光头

ST 2,5-TWIN/ 1P RD - 直通式接线端子

BST 2,5 - 组覆盖标识

一次性保险丝

UK 10,3-HESI 1000V

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SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER

Description The M16C/61 group of single-chip microcomputers are built using the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 100-pin plastic molded QFP. These single-chip microcomputers operate using sophisticated instructions featuring a high

SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER

Description The M16C/61 group of single-chip microcomputers are built using the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 100-pin plastic molded QFP. These single-chip microcomputers operate using sophisticated instructions featuring a high

SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER

Description The M16C/61 group of single-chip microcomputers are built using the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 100-pin plastic molded QFP. These single-chip microcomputers operate using sophisticated instructions featuring a high

SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER

Description The M16C/61 group of single-chip microcomputers are built using the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 100-pin plastic molded QFP. These single-chip microcomputers operate using sophisticated instructions featuring a high

SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER

Description The M16C/61 group of single-chip microcomputers are built using the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 100-pin plastic molded QFP. These single-chip microcomputers operate using sophisticated instructions featuring a high