包装：盒 描述：LASER HEAD (33141), 1.52UM, 1.0M 光电器件 氦氖激光头

ST 2,5-TWIN/ 1P RD - 直通式接线端子

直通式接线端子， 标称工作电压: 500 V， 额定电流: 24 A， 连接量: 3， 位数: 1， 接线方式: 回拉式弹簧/插拔式连接， 第1层左边连接， 额定接线容量: 2.5 mm2， 横截面: 0.08 mm2 - 4 mm2， 第1层右边连接， 安装方式: NS 35/7,5， NS 35/15， 颜色: 红色

BST 2,5 - 组覆盖标识

操作轴盖，5位，用于宽5.2 mm的弹簧连接器

UK 10,3-HESI 1000V

文件：105.59 Kbytes Page：5 Pages

一次性保险丝

SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER

Description The M16C/61 group of single-chip microcomputers are built using the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 100-pin plastic molded QFP. These single-chip microcomputers operate using sophisticated instructions featuring a high

SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER

Description The M16C/61 group of single-chip microcomputers are built using the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 100-pin plastic molded QFP. These single-chip microcomputers operate using sophisticated instructions featuring a high

SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER

Description The M16C/61 group of single-chip microcomputers are built using the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 100-pin plastic molded QFP. These single-chip microcomputers operate using sophisticated instructions featuring a high

SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER

Description The M16C/61 group of single-chip microcomputers are built using the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 100-pin plastic molded QFP. These single-chip microcomputers operate using sophisticated instructions featuring a high

SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER

Description The M16C/61 group of single-chip microcomputers are built using the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 100-pin plastic molded QFP. These single-chip microcomputers operate using sophisticated instructions featuring a high