位置:首页 > IC中文资料 > 2331929

型号 功能描述 生产厂家 企业 LOGO 操作
2331929

AMPMODU SMALL CENTERLINE INTERCONNECTION SYSTEMS

BENEFITS • 85% space savings on PCB with 1.0 mm centerline as compared to 2.54 mm [0.100”] connectors • Reliable signal transfers through two points of contact even in severe shock/vibration applications • Manufacturing flexibility in automated environment with surface mount configuratio

TEC

泰科电子

2331929

AMPMODU SMALL CENTERLINE INTERCONNECTION SYSTEMS

BENEFITS • 85% space savings on PCB with 1.0 mm centerline as compared to 2.54 mm [0.100”] connectors • Reliable signal transfers through two points of contact even in severe shock/vibration applications • Manufacturing flexibility in automated environment with surface mount configuratio

TEC

泰科电子

包装:管件 描述:SCL 1.0 HDR DRVT USP 012 SMT G3 连接器,互连器件 针座,公插针

ETC

知名厂家

包装:管件 描述:SCL 1.0 HDR DRVT USP 016 SMT G3 连接器,互连器件 针座,公插针

ETC

知名厂家

更新时间:2026-7-22 17:50:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TE
2450+
SOP
6540
只做原厂原装正品终端客户免费申请样品
TE CONNECTIVITY/AMP BRAND
2026+
N/A
6058
芯为深圳仓现货
TE/泰科
24+
26490
原厂现货渠道

2331929数据表相关新闻