| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 |   | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
INDUSTRIAL MINI I/O CONNECTOR Key Features • Small form factor reduces PCB area and equipment height • High board retention and metal latch prevents unnecessary disconnections • Improved coplanarity and LCP materials allow for the latest assembly process technologies • Two unique interfaces (Type 1 and Type 2) prevent unw | TEC 泰科电子 | | ||
12 V / 24 V, 22 Position, Automotive Housing for Male Terminals, Wire-to-Wire, 2.54 mm [.1 in] Centerline, Natural, Wire & Cable, Signal 12 V / 24 V, 22 Position, Automotive Housing for Male Terminals, Wire-to-Wire, 2.54 mm [.1 in] Centerline, Natural, Wire & Cable, Signal | TECHSPRAY | | ||
12 V / 24 V, 22 Position, Automotive Housing for Male Terminals, Wire-to-Wire, 2.54 mm [.1 in] Centerline, Green, Wire & Cable, Signal 12 V / 24 V, 22 Position, Automotive Housing for Male Terminals, Wire-to-Wire, 2.54 mm [.1 in] Centerline, Green, Wire & Cable, Signal | TECHSPRAY | | ||
包装：托盘 描述：CONN RCPT 24POS SMD GOLD 连接器，互连器件 阵列，边缘型，夹层式（板对板） | ETC 知名厂家 | ETC | | |
包装：散装 描述：DIE ASSY 25 POS RIBBON COAX 工具 压接器 - 压头，模具组，成套模具 | ETC 知名厂家 | ETC | | |
TE Connectivity 2m网线, 黑色PUR护套, Mini I/O公插转Mini I/O公插, 2205132系列, 2-2205132-3 | TECHSPRAY | | ||
E-Series I/Q Modulator 215 - 225 MHz Description M/A-COM’s EKIN2-220 is a passive, high performance surface mount Modulator. It is ideally suited for IF Modulation in Cellular Base Stations. Typical system applications include GSM, DCS1800, W-CDMA and PCS. Features • High Carrier Suppression • High 3I and 5I Suppression | MACOM | | ||
E-Series I/Q Demodulator 215 - 225 MHz Description M/A-COM’s EKIN2-220D is a passive, high performance surface mount Demodulator. It is ideally suited for IF demodulation in Cellular Base Stations. Typical system applications include GSM, DCS1800, W-CDMA and PCS. Features • Excellent Phase and Amplitude Balance • LO Power +10 dBm T | MACOM | | ||
Drum Cores - Radial Leaded 文件：156.17 Kbytes Page：1 Pages | CT Central Technologies | | ||
Miniature SMD Common Mode Double Chokes 文件：134.31 Kbytes Page：2 Pages | TALEMA | | ||
Power Inductors - Shielded 文件：198.09 Kbytes Page：1 Pages | CT Central Technologies | |
2-220产品属性
- 类型
描述
- 符合标准：
符合欧式 ELV 标准，UL 444
- 绞线数目：
8
- 额定电流：
500 mA
- 电缆形状：
圆形
- 美国线规：
26 AWG
- 外层护套材料：
PUR
- 连接器 1 极性：
公插
- 连接器 1：
RJ45
- 护套颜色：
黑色
- 端接/未端接：
端接
- 长度：
2m
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
Bourns Inc. |
25+ |
6-SMD,鸥翼 |
18798 |
正规渠道,免费送样。支持账期,BOM一站式配齐 |
|||
Bourns Inc. |
25+ |
6-SMD,鸥翼 |
18746 |
样件支持,可原厂排单订货! |
|||
JST |
25+ |
100 |
只做原装鄙视假货15118075546 |
||||
TE/泰科 |
2608+ |
/ |
470984 |
一级代理，原装现货 |
|||
TE |
25+ |
100 |
原厂现货渠道 |
||||
JST/日压 |
22+ |
连接器 |
728922 |
代理-优势-原装-正品-现货*期货 |
|||
26+ |
N/A |
54000 |
一级代理-主营优势-实惠价格-不悔选择 |
||||
TE CONNECTIVITY/AMP BRAND |
2026+ |
N/A |
6058 |
芯为深圳仓现货 |
|||
鑫远鹏 |
25+ |
NA |
5000 |
价优秒回原装现货 |
|||
TE |
2026+ |
SMT |
300000 |
济德97T0-12317替代2-2005243-2 |
2-220规格书下载地址
2-220参数引脚图相关
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- 3q1
- 3g汽车
- 3579
- 35001
- 3477
- 31337
- 303c
- 2sc4226
- 2n3904
- 256p
- 2531
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- 2222a
- 222151B
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- 22-211
- 222103B
- 222102B
- 222101B
- 2220XXX
- 2220SDF
- 2220-RC
- 2220G
- 22-206
- 222054B
- 222053B
- 222052B
- 222051B
- 22-204
- 22-201
- 222003B
- 2220-030-686X16V
- 2220030686X16V
- 222002B
- 22-20025-000
- 2220-025
- 222001B
- 222-0012-01100
- 222001-2
- 222-0011-01100
- 2220-010-110
- 222-0010-01100
- 2220-010
- 2220002-3
- 222000-1
- 22200-01
- 2220-000-111
- 2220000
- 2220.0/100
- 2220.0
- 2220 TAPE 9MM X 4.5MTR
- 2220
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- 222.15
- 222.13
- 222.115
- 222.105
- 222.1
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- 222,BK
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- 222 A 163
- 222 A 152
- 222 A 142
- 222 A 132
- 222 A 121
- 222 A 111
- 222 3714 1473
- 222 10 ML
- 2-2-1W_
- 2-2-1W
- 221LR9
- 221LR16
- 221LR13
- 221LR11
- 221KD14
- 221JE
- 2-2-1J_
- 2-2-1J
- 221DIP
- 221D211
- 2-2-1D_
- 2-2-1D
- 221AE
- 2219-RC
- 2219C
- 221951B
- 221917B
- 221916B
2-220数据表相关新闻
218101-1060
矩形電纜組件 2mm SR 6Ckt 50mm Blk Cbl Assy Micro-Lock Plus
2024-3-62-2316109-0
集管和線殼 20P，2MM，REC，HSG， DR，CRMP，LCK RAMP，BOX集管和線殼 20P，2MM，REC，HSG， DR，CRMP，LCK RAMP，BOX
2021-1-72291392-2
2291392-2
2020-12-22220KD10压敏电阻君耀 220KD10产品资料
220KD10压敏电阻君耀 220KD10产品资料
2020-5-82225B103K302NT
深圳科雨电子有限公司，联系人：卢小姐 手机：18975515225 原装正品 大量现货，有需要的可以联系我 QQ:97877805 微信：wei555222777
2019-7-52-1827876-3原装TE连接器
只做原装，假一罚十，可开16%增值税票。TE.NXP.ON.Renesas.Microchip.英飞凌.ALLEGRO
2019-3-13
DdatasheetPDF页码索引
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