MINIATUREFUSES

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SideActuated,ThroughHoleDIPSwitches

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RUGGEDandLIGHTWEIGHTALUMINUMBATTERYHOLDERS

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包装：袋 描述：LAMP INCAND RT-3.25 WEDGE 14V 光电器件 灯 - 白炽灯，氖灯

包装：散装 描述：BATT HOLDER AA 6 CELL SOLDER LUG 电池产品 电池座，电池夹，电池触头

EmbeddedMini-ITXChassiswithOneExpansionSlot

Features ƒSupportsIntel®7thGenCore™&6thGenCore™iprocessor/Pentium/ Celeron(LGA1151)withIntelH110chipset ƒTwo260-pinSO-DIMMupto32GBDDR42133MHzSDRAM ƒSupportsDualdisplayconfigurationbymultipleinterface:DP/DVI-D/VGA ƒSupportsDirectX12,OpenGL4.4,OpenCL2.

EmbeddedMini-ITXChassiswithOneExpansionSlot

Features ƒSupportsIntel®7th&6thGenCore™iprocessor(LGA1151)withIntelQ170 ƒTwo260-pinSO-DIMMupto32GBDDR42133MHzSDRAM ƒSupportstripledisplayofVGA/DP/HDMI ƒOneexpansionslot(lowprofile) ƒReserved4USB,1COM,punchoutsonfrontpanel ƒTwoShockResistant2.5dr

IntelAtomplatformwithDualGbELANFanlessCompactBox

Features ƒIntel®ApolloLakeE3900series&NseriesProcessor ƒPalm-sizeformfactor:128(L)x152(W)x37mm(H) ƒSupports2xCOMport,1xHDMI,1xDisplayPort,2xUSB3.0,TPM2.0 andDCIN12~24V ƒBuilt-in1xM.22230slot,1xHalfsizeMiniPCIeexpansionslotand1xFull siz

15XGATFTLEDLCDThin-ClientTerminalwithIntel®Atom™ProcessorandULClass1Division2

Features ƒIndustrial-grade15XGATFTLCDwith70KlifetimeandLEDbacklight ƒIntel®Atom™E38451.91GHzquad-coreprocessorwith4GBDDR3L SDRAMand64GSSD ƒIn-cabinetDesignwithTrue-flattouchscreenwith5-wireresistivetouch controlandIP66-ratedfrontpanel ƒULC1D2certified

AMDV-seriesmini-ITXwith2HDMI/2DP/8USB/6COM/2Gb/2M.2

Features ƒSupportAMDV2000processor ƒTwo260-pinSO-DIMMupto64GBDDR43200SDRAM ƒSupportmultidisplay,Maxupto4displays ƒSupports1PCIex8,1E-Key2230M.2slot,1M-Key2242/2280M.2slot ƒ6COM,4USB3.2Gen2,2USB3.2Gen1,2USB2.0,2SATA,16bitGPIO ƒSupportSUSI,WIS

ModularFPM-VideoInputBoxModulewith2I/OSlots

Features ƒMonitorBoxwith2flexibleI/OslotstoaccommodateFPM-M700I/Omodules forvideosignalorlongdistancetransmission ƒMultiplesizedfrontpanelmoduleofferingwithP-Capmulti-touchsensor (12.1&19w/robust5-wireresistivetouch) ƒSupportsUSBtouchandtwoindependent

ModularTPC-ComputingBoxModulewithIntel®6thGen.Core™iCPU

Features ƒComputingBoxpoweredbyIntel®Core™i3-6100U/i5-6300U/i7-6600U with8GBSODIMM ƒSupportstwoindependentvideointerfaceswithpicture-in-picturefunction andupto100mlongsignaltransmissiondistance(iLINKtechnology) (iLINKtechnology) ƒMultiplesizedfrontpanelmodule

IoTRouter

Features ƒQCA650MHzCPUwithadvancedpowermanagementcapability ƒDynamicclockswitchingforultralowpowermodes ƒFullstandardsbasedWi-Fi ƒConfigurableasa1x1or2x2solution ƒOptionalexternalPA/LNA ƒLinuxOS/OpenWRTforeasydevelopment ƒUSB2.0hostinterface

ModularTPC-ComputingBoxModulewithIntel®8thGen.Core™iCPU

Features ƒModularComputingBoxpoweredby8thGen.Intel®Core™i3-8145UE dual-core/i5-8365UEquad-core/i7-8665UEquad-coreprocessorwith built-in8GBDDR4SO-DIMM ƒDualchannelmemoryslotssupportupto32GBintotal ƒCompact,fanlessembeddedsystemwithchassisgroundingprotectio

13.3ePaperWi-FiDisplaySolution

Features ƒARMCortex-M4CoreProcessor ƒSupportsIEEE802.11b/g/n ƒ13.3ePaperpaneldisplay:EPD-662forred/black/white,EPD-660forblack/ white(16graylevel) ƒMultipleControlI/O:5buttonsand2colorLED ƒSupportswideoperatingtemperatures0~40°C;32~105°F(red/black/

EmbeddedMini-ITXChassiswithOneExpansionSlot

Features ƒSupportsIntel®7thGenCore™&6thGenCore™iprocessor/Pentium/ Celeron(LGA1151)withIntelH110chipset ƒTwo260-pinSO-DIMMupto32GBDDR42133MHzSDRAM ƒSupportsDualdisplayconfigurationbymultipleinterface:DP/DVI-D/VGA ƒSupportsDirectX12,OpenGL4.4,OpenCL2.

EmbeddedMini-ITXChassiswithOneExpansionSlot

Features ƒSupportsIntel®7th&6thGenCore™iprocessor(LGA1151)withIntelQ170 ƒTwo260-pinSO-DIMMupto32GBDDR42133MHzSDRAM ƒSupportstripledisplayofVGA/DP/HDMI ƒOneexpansionslot(lowprofile) ƒReserved4USB,1COM,punchoutsonfrontpanel ƒTwoShockResistant2.5dr

AMDAM4Ryzen™5000SeriesMicroATXwith1DP/HDMI/VGA,6COM,4GbELANs,8USB3.2,4USB3.0,3USB2.0

Features ƒSupportsAMDAM4Ryzen™5000seriesprocessorwithX570chipset ƒSupportstripledisplays.(DP,VGA,HDMIdisplay) ƒSupportsPCIeGen4,maxupto8xUSB3.2Gen2,4xUSB3.0Gen2, 3xUSB2.0,4xSATAIII,2x2.5GbE,2x1GbE,M.2(MKey) ƒSupportsDeviceOnandEmbeddedSoftw

Intel®Xeon®W10thGenCore™(CometLake-S)i9/i7/i5/i3LGA1200,MicroATXwith2DP/VGA/eDP/6COM,210GbELANs,2GbELANs,4USB3.2Gen2,6USB3.2Gen1

Features ƒSupportsIntel®Xeon®W10thGenCore™(CometLake-S)i9/i7/i5/i3 processorwithW480E/Q470E/H420Echipset ƒSupportstripledisplays.(2DP++,eDP,VGAdisplay) ƒSupportsIntelAMT12.0andIntelvProcompetent ƒSupportsPCIeGen3,maxupto4xUSB3.2Gen2,6xUSB3.2Gen1, 6x

Intel®12thGenCore™processors(AlderLake-S)i9/i7/i5/i3LGA1700,MicroATXwith2DP/HDMI/eDP,1GbELAN,32.5GbELANs,8USB3.2,1USB3.2Type-C,6COM

Features ƒSupportsIntel®12thGenCore™processors(AlderLake-S)withQ670E/ R680E/H610Echipset ƒSupportsupto32GBDDR54400MT/SwithfourUDIMMs ƒFourdisplays.(x2DP++,HDMI,eDP) ƒIntelAMTandIntelvProTechnology ƒPCIex16slotGen5,PCIex4slotGen4,PCIex4slotGen3 ƒ

Intel®Atom™E3950/E3930DC1.6/1.3GHzUTXIndustrialMotherboardwithHDMI/eDP(LVDS)/DP,2COMsandDualLAN

Features ƒSupportsIntel®Atom™Quad/DualcoreE3950/E39301.6/1.3GHz processor ƒSingle204-pinSO-DIMMupto8GBDDR3L1866MHzSDRAM ƒSupportsHDMI/DP++,eDP(co-laydual-channel48-bitLVDS) ƒSupports1Mini-PCIEexpansionslot,M.2E-Keyslot,2COMs (RS-232,RS-422/485),4USB3

THINbarebonewith8thGen.Intel®DesktopCoreiProcessor

Features ƒThindesignwith44.2mminheight ƒThinbarebonewithmulti-IOportsissuitableforvarietyofapplication environmentswithDC-indesign ƒEasy/quickinstallationforadditionalperipherals ƒOne2.5shock-resistantdrivebay ƒSupportWall/VESA/RackmountingKit ƒLocktype

1UThinMini-ITXChassiswith1xExpansionSlot

Features ƒSupportsIntel®Pentium®N4200 ƒ1Uchassissupportsthinmini-ITXboard ƒEasydeviceinstallation(likemini-PCIe,mSATA…) ƒOneexpansionslot(fullheight) ƒReservedpre-cutUSB,COM,andWLANantennaslots ƒOptionalwidepower9~36VDCinput

1UthinMini-ITXChassiswithOneExpansionSlot

Features ƒ1Uchassissupportthinmini-ITXboard ƒEasydeviceinstallation(e.g.mini-PCIe,mSATA…) ƒOneexpansionslot(Fullheight) ƒRichI/OconnectivitywithadditionalUSB,COMPortsandRFoptionsincl. antennas ƒOptionalWidepower9~36VDCinput ƒSupportsIntel®7th&6thGen

THINbarebonewith8th/9thGen.Intel®DesktopCoreiProcessor

Features ƒTHINCompactdesignwith44.2mminheight ƒThinbarebonewithmulti-IOportsissuitableforvarietyofapplication environmentswithDC-indesign ƒEasy/quickinstallationforadditionalperipherals ƒSupportWall/VESA/DinRailKit ƒLocktypeDCpowerjack

EmbeddedSystemwithAMDAM4Platformand3PCIEExpansionSlots

Features ƒAMDAM4platformtosupportRyzen™5000seriesCPU ƒ3UEmbeddedSystemwith3PCIeexpansionslots. ƒUp-to4x2.5SATASSD ƒToaccommodate500WPSUfordifferentapplications ƒPlentifulIOPortsforVariousApplications ƒNVIDIAqualifiedwithRTXA4500graphiccard ƒWin10I

18.5WXGATFTLEDLCDTouchPanelComputerwith8thGen.Intel®Core™i5Processor,built-in8GDDR4RAMandULClass1Division2

Features ƒIndustrial-grade18.5WXGATFTLCDwith50KlifetimeandLEDbacklight ƒ8thGen.Intel®Core™i5-8365UEquad-coreprocessorwithbuilt-in8GB DDR4SO-DIMM ƒDualchannelmemoryslotssupportupto64Gintotal ƒCompact,fanlessembeddedsystemwithaluminumalloyfrontbezeland

ModularTPC-ComputingBoxModulewithIntel®6thGen.Core™iCPU

Features ƒComputingBoxpoweredbyIntel®Core™i3-6100U/i5-6300U/i7-6600U with8GBSODIMM ƒSupportstwoindependentvideointerfaceswithpicture-in-picturefunction andupto100mlongsignaltransmissiondistance(iLINKtechnology) (iLINKtechnology) ƒMultiplesizedfrontpanelmodule

ModularTPC-ComputingBoxModulewithIntel®8thGen.Core™iCPU

Features ƒModularComputingBoxpoweredby8thGen.Intel®Core™i3-8145UE dual-core/i5-8365UEquad-core/i7-8665UEquad-coreprocessorwith built-in8GBDDR4SO-DIMM ƒDualchannelmemoryslotssupportupto32GBintotal ƒCompact,fanlessembeddedsystemwithchassisgroundingprotectio

15Point-of-CareTerminalwith11thGenerationIntel®Processor

Features ƒ11thgenerationIntel®Core™i5/i7processor ƒ15.6fullHDdisplaywithmulti-touchP-CAPcontrol ƒMultipleI/O,includingUSB3.2Gen2(TypeA),USB3.2Gen2(TypeC)with displayfunction,andHDMI ƒPCIex4,miniPCIe,M.2expansionslotsforintegratingadd-onmodules ƒFa

21Point-of-CareTerminalwith11thGenerationIntel®Processor

Features ƒ11thgenerationIntel®Core™i5/i7processor ƒ21.5fullHDdisplaywithmulti-touchP-CAPcontrol ƒMultipleI/O,includingUSB3.2Gen2(TypeA),USB3.2Gen2(TypeC)with displayfunction,andHDMI ƒPCIex4,miniPCIe,M.2expansionslotsforintegratingadd-onmodules ƒFa

24Point-of-CareTerminalwith11thGenerationIntel®Processor

Features ƒ11thgenerationIntel®Core™i5/i7processor ƒ23.8fullHDdisplaywithmulti-touchP-CAPcontrol ƒMultipleI/O,includingUSB3.2Gen2(TypeA),USB3.2Gen2(TypeC)with displayfunction,andHDMI ƒPCIex4,miniPCIe,M.2expansionslotsforintegratingadd-onmodules ƒFa

15XGATFTLEDLCDThin-ClientTerminalwithIntel®Atom™ProcessorandULClass1Division2

Features ƒIndustrial-grade15XGATFTLCDwith70KlifetimeandLEDbacklight ƒIntel®Atom™E38451.91GHzquad-coreprocessorwith4GBDDR3L SDRAMand64GSSD ƒIn-cabinetDesignwithTrue-flattouchscreenwith5-wireresistivetouch controlandIP66-ratedfrontpanel ƒULC1D2certified

15.6Bezel-lessTouchMonitor

Features ƒ15.6LCDwidescreenpanelwithLEDbacklightdeliversalongservicelife ƒSupportswideoperatingtemperatures ƒTrueflatsurface–contemporaryProflatdesign ƒWideviewinganglessupportportraitandlandscapemodes ƒThinprofileenclosureeliminatesneedforadditionalcas

TISitara™ARMAM3352Cortex-A81GHzRTX2.0Module

Features ƒTISitara™ARM®AM3352Cortex®-A81Ghzhighperformanceprocessor ƒOnboardDDR3512MBmemory/4GBEMMC ƒSupportswiderangepowerinput5V~24V ƒSupports1GbE,1USB2.0,1USB2.0OTG,2CANbus,10GPIO,4UART, 1I2C,1I2S,1SPI,1SDIO ƒOperatingtemperature0~60°C/

EmbeddedMini-ITXChassiswithOneExpansionSlot

Features ƒSupportsIntel®7thGenCore™&6thGenCore™iprocessor/Pentium/ Celeron(LGA1151)withIntelH110chipset ƒTwo260-pinSO-DIMMupto32GBDDR42133MHzSDRAM ƒSupportsDualdisplayconfigurationbymultipleinterface:DP/DVI-D/VGA ƒSupportsDirectX12,OpenGL4.4,OpenCL2.

EmbeddedMini-ITXChassiswithOneExpansionSlot

Features ƒSupportsIntel®7th&6thGenCore™iprocessor(LGA1151)withIntelQ170 ƒTwo260-pinSO-DIMMupto32GBDDR42133MHzSDRAM ƒSupportstripledisplayofVGA/DP/HDMI ƒOneexpansionslot(lowprofile) ƒReserved4USB,1COM,punchoutsonfrontpanel ƒTwoShockResistant2.5dr

THINbarebonewith8thGen.Intel®DesktopCoreiProcessor

Features ƒThindesignwith44.2mminheight ƒThinbarebonewithmulti-IOportsissuitableforvarietyofapplication environmentswithDC-indesign ƒEasy/quickinstallationforadditionalperipherals ƒOne2.5shock-resistantdrivebay ƒSupportWall/VESA/RackmountingKit ƒLocktype

1UThinMini-ITXChassiswith1xExpansionSlot

Features ƒSupportsIntel®Pentium®N4200 ƒ1Uchassissupportsthinmini-ITXboard ƒEasydeviceinstallation(likemini-PCIe,mSATA…) ƒOneexpansionslot(fullheight) ƒReservedpre-cutUSB,COM,andWLANantennaslots ƒOptionalwidepower9~36VDCinput

1UthinMini-ITXChassiswithOneExpansionSlot

Features ƒ1Uchassissupportthinmini-ITXboard ƒEasydeviceinstallation(e.g.mini-PCIe,mSATA…) ƒOneexpansionslot(Fullheight) ƒRichI/OconnectivitywithadditionalUSB,COMPortsandRFoptionsincl. antennas ƒOptionalWidepower9~36VDCinput ƒSupportsIntel®7th&6thGen

EmbeddedMini-ITXChassiswithOneExpansionSlot

Features ƒSupportsIntel®7thGenCore™&6thGenCore™iprocessor/Pentium/ Celeron(LGA1151)withIntelH110chipset ƒTwo260-pinSO-DIMMupto32GBDDR42133MHzSDRAM ƒSupportsDualdisplayconfigurationbymultipleinterface:DP/DVI-D/VGA ƒSupportsDirectX12,OpenGL4.4,OpenCL2.

EmbeddedMini-ITXChassiswithOneExpansionSlot

Features ƒSupportsIntel®7th&6thGenCore™iprocessor(LGA1151)withIntelQ170 ƒTwo260-pinSO-DIMMupto32GBDDR42133MHzSDRAM ƒSupportstripledisplayofVGA/DP/HDMI ƒOneexpansionslot(lowprofile) ƒReserved4USB,1COM,punchoutsonfrontpanel ƒTwoShockResistant2.5dr

EmbeddedSystemwith4PCIEExpansionSlots

Features ƒ4UEmbeddedSystemforMicro-ATXmotherboard ƒUpto4PCIEExpansionSlots ƒ2ShockResistant2.5drivebays ƒToaccommodate300WPSUfordifferentapplications ƒPlentifulIOPortsforVariousApplications

EmbeddedSystemwith4PCIEExpansionSlots

Features ƒ4UEmbeddedSystem ƒUpto4PCIEExpansionSlots ƒUpto6ShockResistant2.5drivebays ƒToaccommodate700Woroptional1200WPSUfordifferentapplications ƒPlentifulIOPortsforVariousApplications ƒServerGradeCPUforHigh-endComputing

THINbarebonewith8thGen.Intel®DesktopCoreiProcessor

Features ƒThindesignwith44.2mminheight ƒThinbarebonewithmulti-IOportsissuitableforvarietyofapplication environmentswithDC-indesign ƒEasy/quickinstallationforadditionalperipherals ƒOne2.5shock-resistantdrivebay ƒSupportWall/VESA/RackmountingKit ƒLocktype

1UthinMini-ITXChassiswithOneExpansionSlot

Features ƒ1Uchassissupportthinmini-ITXboard ƒEasydeviceinstallation(e.g.mini-PCIe,mSATA…) ƒOneexpansionslot(Fullheight) ƒRichI/OconnectivitywithadditionalUSB,COMPortsandRFoptionsincl. antennas ƒOptionalWidepower9~36VDCinput ƒSupportsIntel®7th&6thGen

NXPARM®Cortex®-A9i.MX6RTXv2.0module

Features ƒNXPARM®Cortex®-A9i.MX6highperformanceprocessor ƒOnbardDDR3memoryandeMMC16GB ƒSupportswiderangepowerinput5V~24V ƒSupportsOpenGLES2.0andOpenVG1.1hardwareaccelerators ƒSupportsfullHD1080pvideodecodeandHD1080pvideoencodehardware engine ƒSupport

NXPARM®Cortex®-A9i.MX6SMARCv1.1Module

Features ƒNXPARM®Cortex®-A9i.MX6highperformanceprocessor ƒOnbardDDR3memoryandeMMC16GB ƒParallelRGB,HDMI,singlechannel18/24-bitLVDS,1366x768 ƒ2xCAN,4xUART,5xI2C,12xGPIO,1xPCIe,1xcamerainputand 1xGigabitLAN ƒSupportsOpenGLES2.0andOpenVG1.1

NXPi.MX8MCortex®-A53SMARC2.0/2.1Computer-on-Module

Features ƒNXPi.MX8MprocessorwithdualorquadArmCortexA53cores ƒ1xArmCortex-M4core ƒOnboard2GBLPDDR4memoryandeMMC16GB ƒ1xHDMI2.0upto4096x2160,1x4-LaneMIPIDSI ƒ2xUSB3.0,4xUSB2.0,4xUART,4xI2C,12xGPIO, 1xPCIe2.0,1x4-laneMIPICSIcamerainpu

RockchipRK3399Cortex®-A72A53SMARC2.1Computer-on-Module

Features ƒRockchipRK3399ArmdualCortex-A72andquadCortex-A531.8GHz ƒOnboard2/4GBLPDDR4memoryand16/32GBeMMC ƒSupportHDMI2.04K,1xeDP,1xLVDS ƒSupport4KH.264/H.265Videodecoder ƒ2xUSB3.0,3xUSB2.0,1xUSB2,0OTG,3xUART,12xGPIO ƒ1xPCIe2.0,1xSATA,2xM

DevelopmentKitforRTX2.0computerModuleROM-3420

Features ƒƒEvaluationkitforROM-3420 ƒƒHighperformanceNXPi.mx6dual-core1GHzprocessor ƒƒOnbardDDR31GBmemoryandeMMC4GB ƒƒParallelRGB,HDMI,Singlechannel24bitLVDS,1366x768 ƒƒSupports4GBeMMCFlash,1SD/MMC,1SATA ƒƒSupports1PCIe,1GbE,1USB2.0,1USBOTG2.0,

DevelopmentKitforSMARCV1.1CPUModuleROM-5420

Features ƒƒEvaluationkitforROM-5420 ƒƒHighperformanceNXPi.mx6dual-core1GHzprocessor ƒƒOnbardDDR31GBmemoryandeMMC4GB ƒƒParallelRGB,HDMI,Singlechannel24bitLVDS,1366x768 ƒƒSupports4GBeMMCFlash,1SD/MMC,1SATA ƒƒ2CAN,4UART,5I2C,12GPIO,1PCIe,1camer

15XGATFTLEDLCDThin-ClientTerminalwithIntel®Atom™ProcessorandULClass1Division2

Features ƒIndustrial-grade15XGATFTLCDwith70KlifetimeandLEDbacklight ƒIntel®Atom™E38451.91GHzquad-coreprocessorwith4GBDDR3L SDRAMand64GSSD ƒIn-cabinetDesignwithTrue-flattouchscreenwith5-wireresistivetouch controlandIP66-ratedfrontpanel ƒULC1D2certified

18.5WXGATFTLEDLCDTouchPanelComputerwith8thGen.Intel®Core™i5Processor,built-in8GDDR4RAMandULClass1Division2

Features ƒIndustrial-grade18.5WXGATFTLCDwith50KlifetimeandLEDbacklight ƒ8thGen.Intel®Core™i5-8365UEquad-coreprocessorwithbuilt-in8GB DDR4SO-DIMM ƒDualchannelmemoryslotssupportupto64Gintotal ƒCompact,fanlessembeddedsystemwithaluminumalloyfrontbezeland

ModularTPC-ComputingBoxModulewithIntel®8thGen.Core™iCPU

Features ƒModularComputingBoxpoweredby8thGen.Intel®Core™i3-8145UE dual-core/i5-8365UEquad-core/i7-8665UEquad-coreprocessorwith built-in8GBDDR4SO-DIMM ƒDualchannelmemoryslotssupportupto32GBintotal ƒCompact,fanlessembeddedsystemwithchassisgroundingprotectio

ModularTPC-ComputingBoxModulewithIntel®10thGen.Core™iCPUSocket(LGA1200)

Features ƒHighPerformanceComputingBoxpoweredbyIntel®10thGen.Core™iCPU Socket(LGA1200)withfanlessdesign ƒ6xPanelModules(IP66)rangingfrom15to23.8inselection ƒDualChannelMemoryslots(DDR4)supportupto64GBintotal ƒComprehensiveI/Os,including6xUSB,2xCO

DevelopmentKitforSMARCV1.1CPUModuleROM-5420

Features ƒƒEvaluationkitforROM-5420 ƒƒHighperformanceNXPi.mx6dual-core1GHzprocessor ƒƒOnbardDDR31GBmemoryandeMMC4GB ƒƒParallelRGB,HDMI,Singlechannel24bitLVDS,1366x768 ƒƒSupports4GBeMMCFlash,1SD/MMC,1SATA ƒƒ2CAN,4UART,5I2C,12GPIO,1PCIe,1camer

NXPARM®Cortex®-A9i.MX6SMARCv1.1Module

Features ƒNXPARM®Cortex®-A9i.MX6highperformanceprocessor ƒOnbardDDR3memoryandeMMC16GB ƒParallelRGB,HDMI,singlechannel18/24-bitLVDS,1366x768 ƒ2xCAN,4xUART,5xI2C,12xGPIO,1xPCIe,1xcamerainputand 1xGigabitLAN ƒSupportsOpenGLES2.0andOpenVG1.1

13.3ePaperWi-FiDisplaySolution

Features ƒARMCortex-M4CoreProcessor ƒSupportsIEEE802.11b/g/n ƒ13.3ePaperpaneldisplay:EPD-662forred/black/white,EPD-660forblack/ white(16graylevel) ƒMultipleControlI/O:5buttonsand2colorLED ƒSupportswideoperatingtemperatures0~40°C;32~105°F(red/black/

InterchangeableDisplayModuleswith12XGA/15XGA/17SXGA/19SXGA/15.6FHD/18.5HD/21.5FHD/23.8FHD

Features ƒModularfrontdisplaydesigninthreeapplication-basedmodulecategories, enablingflexibleconfigurations ƒFrontpanelmodulewithP-CAPmulti-touchsensoravailableinvarioussizes (12and19moduleisequippedwith5-wireresistivetouchcontrol) ƒIndustrial-gradeLEDLCDwi

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