Inductive Sensor – For Rotary Actuators

Features ■Rectangular, housing DSU35 ■Plastic, PP-GF30-VO ■Two outputs for monitoring the position of rotary actuators ■Mounting on all standard actuators ■Valves can be connected ■AS‐Interface, 18…33 VDC ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects

Inductive Sensor – For Rotary Actuators

Features ■Rectangular, housing DSU35 ■Plastic, PP-GF30-VO ■Two outputs for monitoring the position of rotary actuators ■Mounting on all standard actuators ■Valves can be connected ■AS‐Interface, 18…33 VDC ■M12 x 1 male connector Functional principle Inductive sensors detect metal objects

Inductive Sensor – For Rotary Actuators

Features ■Rectangular, housing DSU35 ■Plastic, PP-GF30-VO ■Two outputs for monitoring the position of rotary actuators ■Mounting on all standard actuators ■Valves can be connected ■AS‐Interface, 18…33 VDC ■Terminal chamber Functional principle Inductive sensors detect metal objects cont

Inductive Sensor – For Rotary Actuators

Features ■Rectangular, housing DSU35 ■Plastic, PP-GF30-VO ■Two outputs for monitoring the position of rotary actuators ■All metal housing parts are made of stainless steel ■Mounting on all standard actuators ■Valves can be connected ■AS‐Interface, 18…33 VDC ■7/8 male connector Functiona

Inductive Sensor – For Rotary Actuators

Features ■Rectangular, housing DSU35 ■Plastic, PP-GF30-VO ■Two outputs for monitoring the position of rotary actuators ■Mounting on all standard actuators ■AS‐Interface V3.0 certified ■Valves can be connected ■2 x M12 connector ■18…33 VDC Functional principle Inductive sensors detect me

包装：盒 描述：FAN AXIAL 176X112MM 115VAC TNE2C 风扇，热管理 AC 风扇

包装：散装 描述：FAN AXIAL 176X112MM 230VAC TNE3A 风扇，热管理 AC 风扇

Thermal transfer printer - THERMOMARK GO.K

文件：207.91 Kbytes Page：15 Pages

Magazine insert - CMS-P1-M/WAGO WMB

文件：47.17 Kbytes Page：2 Pages

Magazine insert - CMS-P1-M/WAGO WSB 5

文件：47.48 Kbytes Page：2 Pages

Plotter accessories - CMS-P1-PENDEPOT

文件：49.91 Kbytes Page：2 Pages

Accessories - CMS-P1-M/WEID-PAD

文件：47.84 Kbytes Page：2 Pages

Magazine insert - CMS-P1-M/WAGO MINI WSB

文件：47.73 Kbytes Page：2 Pages

Magazine insert - CMS-P1-M/WAGO WSB 4

文件：46.96 Kbytes Page：2 Pages

Magazine insert - CMS-P1-M/ENTRELEC RC

文件：47.95 Kbytes Page：2 Pages

Magazine insert - CMS-P1-M/MURR 400

文件：46.95 Kbytes Page：2 Pages

Magazine insert - CMS-P1-M/MURR 401

文件：48.63 Kbytes Page：2 Pages

Cutter - THERMOMARK S1-CUTTER

文件：50.67 Kbytes Page：2 Pages

Thermal transfer printer - THERMOMARK ROLL 2.0

文件：108.81 Kbytes Page：9 Pages

插拔式接线端子

Printed-circuit board connector - MC 1,5/ 7-G-3,81 AU

文件：57.7 Kbytes Page：4 Pages

20V, SOT23F, NPN high gain power transistor

Description Advanced process capability has been used to maximize the performance of this transistor. The SOT23F package is compatible with the industry standard SOT23 footprint but offers lower profile and higher dissipation for applications where power density is of utmost importance. Features

20V, SOT23F, NPN high gain power transistor

Description Advanced process capability has been used to maximize the performance of this transistor. The SOT23F package is compatible with the industry standard SOT23 footprint but offers lower profile and higher dissipation for applications where power density is of utmost importance. Features

20V, SOT23F, NPN high gain power transistor

Description Advanced process capability has been used to maximize the performance of this transistor. The SOT23F package is compatible with the industry standard SOT23 footprint but offers lower profile and higher dissipation for applications where power density is of utmost importance. Features

20V, SOT23F, NPN high gain power transistor

Description Advanced process capability has been used to maximize the performance of this transistor. The SOT23F package is compatible with the industry standard SOT23 footprint but offers lower profile and higher dissipation for applications where power density is of utmost importance. Features

20V, SOT23F, PNP medium power transistor

Description Advanced process capability has been used to maximize the performance of this transistor. The SOT23F package is compatible with the industry standard SOT23 footprint but offers lower profile and higher dissipation for applications where power density is of utmost importance. Features