1470价格

参考价格:¥2.1142

型号:1470 品牌:Abbatron 备注:这里有1470多少钱,2025年最近7天走势,今日出价,今日竞价,1470批发/采购报价,1470行情走势销售排行榜,1470报价。
型号 功能描述 生产厂家 企业 LOGO 操作
1470

LINEAR INTEGRATED CIRCUIT

文件:112.21 Kbytes Page:5 Pages

UTC

友顺

1470

Space saving design for high density packaging

文件:493.41 Kbytes Page:1 Pages

etc2List of Unclassifed Manufacturers

etc未分类制造商etc2未分类制造商

1470

High Power, N or SMK Connectors

文件:511.42 Kbytes Page:1 Pages

APITECH

1470

包装:散装 描述:CONN PIN RCPT .015-.025 SOLDER 连接器,互连器件 PC 引脚插座,插座连接器

KEYSTONE

Keystone Electronics Corp.

Time and light control Hour counters

Description - Digital hour counter - Installation cutout 45 mm x 45 mm - With EEPROM memory provides reliable operating data capture even with loss of power - Control panel installation - 7-digit high-contrast LCD display - Screw terminals - Onscreen progress display - Tension clamp brack

THEBEN

德国泰邦

Connector System for Universal Serial Bus

Product Facts ■ Plug and Play capability ■ Hot pluggable, permits attaching or detaching peripherals without power down or reboot ■ Single 4-position connector, polarized for proper orientation ■ Complete family of boardmount receptacles, including right-angle, thru-hole, thru-hole type B

TEC

泰科电子

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

Connector System for Universal Serial Bus

Product Facts ■ Plug and Play capability ■ Hot pluggable, permits attaching or detaching peripherals without power down or reboot ■ Single 4-position connector, polarized for proper orientation ■ Complete family of boardmount receptacles, including right-angle, thru-hole, thru-hole type B

TEC

泰科电子

Connector System for Universal Serial Bus

Product Facts ■ Plug and Play capability ■ Hot pluggable, permits attaching or detaching peripherals without power down or reboot ■ Single 4-position connector, polarized for proper orientation ■ Complete family of boardmount receptacles, including right-angle, thru-hole, thru-hole type B

TEC

泰科电子

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

FPC Connector Family

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

MACOM

PP15/45 series are the smallest Powerpole® housings.

• High Power Density Up to 55 amps in a compact footprint • Wire-to-Wire & Wire-to-Board Configurations Wire & PCB contacts can be used in the same housings • Finger Proof Housings Available Protects against accidental contact with live circuits

APP

PP15/45 series are the smallest Powerpole® housings.

• High Power Density Up to 55 amps in a compact footprint • Wire-to-Wire & Wire-to-Board Configurations Wire & PCB contacts can be used in the same housings • Finger Proof Housings Available Protects against accidental contact with live circuits

APP

PP15/45 series are the smallest Powerpole® housings.

• High Power Density Up to 55 amps in a compact footprint • Wire-to-Wire & Wire-to-Board Configurations Wire & PCB contacts can be used in the same housings • Finger Proof Housings Available Protects against accidental contact with live circuits

APP

PP15/45 series are the smallest Powerpole® housings.

• High Power Density Up to 55 amps in a compact footprint • Wire-to-Wire & Wire-to-Board Configurations Wire & PCB contacts can be used in the same housings • Finger Proof Housings Available Protects against accidental contact with live circuits

APP

PP15/45 series are the smallest Powerpole® housings.

• High Power Density Up to 55 amps in a compact footprint • Wire-to-Wire & Wire-to-Board Configurations Wire & PCB contacts can be used in the same housings • Finger Proof Housings Available Protects against accidental contact with live circuits

APP

PP15/45 series are the smallest Powerpole® housings.

• High Power Density Up to 55 amps in a compact footprint • Wire-to-Wire & Wire-to-Board Configurations Wire & PCB contacts can be used in the same housings • Finger Proof Housings Available Protects against accidental contact with live circuits

APP

PP15/45 series are the smallest Powerpole® housings.

• High Power Density Up to 55 amps in a compact footprint • Wire-to-Wire & Wire-to-Board Configurations Wire & PCB contacts can be used in the same housings • Finger Proof Housings Available Protects against accidental contact with live circuits

APP

PP15/45 series are the smallest Powerpole® housings.

• High Power Density Up to 55 amps in a compact footprint • Wire-to-Wire & Wire-to-Board Configurations Wire & PCB contacts can be used in the same housings • Finger Proof Housings Available Protects against accidental contact with live circuits

APP

Heyco®-Tite Brass Lazy Bend Liquid Tight Cordgrips

文件:126.18 Kbytes Page:1 Pages

Heyco

Motor Development Kit (MDK) 4 kW Board with Intelligent Power Module SPM31 650 V

文件:5.87016 Mbytes Page:30 Pages

ONSEMI

安森美半导体

包装:托盘 描述:CONN SATA PLUG 14POS SLD R/A 连接器,互连器件 插拔式连接器组件

ETC

知名厂家

Heyco®-Tite Brass Lazy Bend Liquid Tight Cordgrips

文件:126.18 Kbytes Page:1 Pages

Heyco

High Power, N or SMK Connectors

文件:511.42 Kbytes Page:1 Pages

APITECH

AMP HPI 2.0MM 母端连接器

TE

AMP HPI 2.0MM 板端连接器

TE

AMPMODU Interconnection System

文件:3.23293 Mbytes Page:60 Pages

TEC

泰科电子

AMPMODU Interconnection System

文件:3.23293 Mbytes Page:60 Pages

TEC

泰科电子

AMP HPI 2.0MM 板端连接器

TE

AMPMODU Interconnection System

文件:3.23293 Mbytes Page:60 Pages

TEC

泰科电子

AMPMODU Interconnection System

文件:3.23293 Mbytes Page:60 Pages

TEC

泰科电子

Heyco®-Tite Brass Lazy Bend Liquid Tight Cordgrips

文件:126.18 Kbytes Page:1 Pages

Heyco

High Power, N or SMK Connectors

文件:511.42 Kbytes Page:1 Pages

APITECH

AMPMODU 2.0mm PITCH REC CONN, VERTICAL MOUNT TYPE

文件:311.24 Kbytes Page:2 Pages

MACOM

AMPMODU Interconnection System

文件:3.23293 Mbytes Page:60 Pages

TEC

泰科电子

AMPMODU Interconnection System

文件:3.23293 Mbytes Page:60 Pages

TEC

泰科电子

AMPMODU Interconnection System

文件:3.23293 Mbytes Page:60 Pages

TEC

泰科电子

AMPMODU Interconnection System

文件:3.23293 Mbytes Page:60 Pages

TEC

泰科电子

AMPMODU Interconnection System

文件:3.23293 Mbytes Page:60 Pages

TEC

泰科电子

AMPMODU Interconnection System

文件:3.23293 Mbytes Page:60 Pages

TEC

泰科电子

AMPMODU Interconnection System

文件:3.23293 Mbytes Page:60 Pages

TEC

泰科电子

AMPMODU Interconnection System

文件:3.23293 Mbytes Page:60 Pages

TEC

泰科电子

AMPMODU Interconnection System

文件:3.23293 Mbytes Page:60 Pages

TEC

泰科电子

1470产品属性

  • 类型

    描述

  • 型号

    1470

  • 功能描述

    JACK .015-.025.161L SLD MNT

  • RoHS

  • 类别

    连接器,互连式 >> 端子 - PC 引脚插座,插口

  • 系列

    -

  • 标准包装

    500

  • 系列

    324 Tail

  • Type

    标准尾

  • 端子

    陷形 长度 -

  • 总体

    0.602(15.29mm) Accepts Pin

  • Diameter

    0.032 ~ 0.046(0.81mm ~ 1.17mm)

  • 安装孔直径

    0.094(2.39mm) Pin Hole

  • Diameter

    0.064(1.63mm)

  • 法兰直径

    0.125(3.18mm) Tail

  • Diameter

    0.040(1.02mm) Socket

  • Depth

    0.195(4.95mm)

  • 触点材料

    铜铍

  • 触点表面涂层

  • 触点涂层厚度

    30µin(0.76µm)

  • 包装

    散装

  • 特点

    -

  • 工作温度

    -55°C ~ 125°C

  • 板厚度

    0.188(4.78mm) Insertion

  • Force

    -

  • 其它名称

    0324-5151534271000324515153427100324515153427100

更新时间:2025-9-24 17:54:00
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NEC
24+
QFP
89
大批量供应优势库存热卖
TE
54
TE/AMP/TYCO
2018+
connector
37832
TE/泰科
24+
connector
49823
只做原装进口现货连接器
AMP
25+
NA
880000
明嘉莱只做原装正品现货
TYCO
23+
NA
649
专做原装正品,假一罚百!
AMP
24+
60
TE/泰科
2508+
/
391805
一级代理,原装现货
TE/TYCO/AMP
三合一卡座 SD/MS/MMC
69820
一级代理百分百有货,原装正品现货,支持实单!
Anderson Power Products, Inc.
23+
原厂封装
12592
只做原装只有原装现货实报

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