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1470价格
参考价格:¥2.1142
型号:1470 品牌:Abbatron 备注:这里有1470多少钱,2025年最近7天走势,今日出价,今日竞价,1470批发/采购报价,1470行情走势销售排行榜,1470报价。型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
---|---|---|---|---|
1470 | LINEAR INTEGRATED CIRCUIT 文件:112.21 Kbytes Page:5 Pages | UTC 友顺 | ||
1470 | Space saving design for high density packaging 文件:493.41 Kbytes Page:1 Pages | etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商 | ||
1470 | High Power, N or SMK Connectors 文件:511.42 Kbytes Page:1 Pages | APITECH | ||
1470 | 包装:散装 描述:CONN PIN RCPT .015-.025 SOLDER 连接器,互连器件 PC 引脚插座,插座连接器 | KEYSTONE Keystone Electronics Corp. | ||
Time and light control Hour counters Description - Digital hour counter - Installation cutout 45 mm x 45 mm - With EEPROM memory provides reliable operating data capture even with loss of power - Control panel installation - 7-digit high-contrast LCD display - Screw terminals - Onscreen progress display - Tension clamp brack | THEBEN 德国泰邦 | |||
Connector System for Universal Serial Bus Product Facts ■ Plug and Play capability ■ Hot pluggable, permits attaching or detaching peripherals without power down or reboot ■ Single 4-position connector, polarized for proper orientation ■ Complete family of boardmount receptacles, including right-angle, thru-hole, thru-hole type B | TEC 泰科电子 | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
Connector System for Universal Serial Bus Product Facts ■ Plug and Play capability ■ Hot pluggable, permits attaching or detaching peripherals without power down or reboot ■ Single 4-position connector, polarized for proper orientation ■ Complete family of boardmount receptacles, including right-angle, thru-hole, thru-hole type B | TEC 泰科电子 | |||
Connector System for Universal Serial Bus Product Facts ■ Plug and Play capability ■ Hot pluggable, permits attaching or detaching peripherals without power down or reboot ■ Single 4-position connector, polarized for proper orientation ■ Complete family of boardmount receptacles, including right-angle, thru-hole, thru-hole type B | TEC 泰科电子 | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
FPC Connector Family As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To | MACOM | |||
PP15/45 series are the smallest Powerpole® housings. • High Power Density Up to 55 amps in a compact footprint • Wire-to-Wire & Wire-to-Board Configurations Wire & PCB contacts can be used in the same housings • Finger Proof Housings Available Protects against accidental contact with live circuits | APP | |||
PP15/45 series are the smallest Powerpole® housings. • High Power Density Up to 55 amps in a compact footprint • Wire-to-Wire & Wire-to-Board Configurations Wire & PCB contacts can be used in the same housings • Finger Proof Housings Available Protects against accidental contact with live circuits | APP | |||
PP15/45 series are the smallest Powerpole® housings. • High Power Density Up to 55 amps in a compact footprint • Wire-to-Wire & Wire-to-Board Configurations Wire & PCB contacts can be used in the same housings • Finger Proof Housings Available Protects against accidental contact with live circuits | APP | |||
PP15/45 series are the smallest Powerpole® housings. • High Power Density Up to 55 amps in a compact footprint • Wire-to-Wire & Wire-to-Board Configurations Wire & PCB contacts can be used in the same housings • Finger Proof Housings Available Protects against accidental contact with live circuits | APP | |||
PP15/45 series are the smallest Powerpole® housings. • High Power Density Up to 55 amps in a compact footprint • Wire-to-Wire & Wire-to-Board Configurations Wire & PCB contacts can be used in the same housings • Finger Proof Housings Available Protects against accidental contact with live circuits | APP | |||
PP15/45 series are the smallest Powerpole® housings. • High Power Density Up to 55 amps in a compact footprint • Wire-to-Wire & Wire-to-Board Configurations Wire & PCB contacts can be used in the same housings • Finger Proof Housings Available Protects against accidental contact with live circuits | APP | |||
PP15/45 series are the smallest Powerpole® housings. • High Power Density Up to 55 amps in a compact footprint • Wire-to-Wire & Wire-to-Board Configurations Wire & PCB contacts can be used in the same housings • Finger Proof Housings Available Protects against accidental contact with live circuits | APP | |||
PP15/45 series are the smallest Powerpole® housings. • High Power Density Up to 55 amps in a compact footprint • Wire-to-Wire & Wire-to-Board Configurations Wire & PCB contacts can be used in the same housings • Finger Proof Housings Available Protects against accidental contact with live circuits | APP | |||
Heyco®-Tite Brass Lazy Bend Liquid Tight Cordgrips 文件:126.18 Kbytes Page:1 Pages | Heyco | |||
Motor Development Kit (MDK) 4 kW Board with Intelligent Power Module SPM31 650 V 文件:5.87016 Mbytes Page:30 Pages | ONSEMI 安森美半导体 | |||
包装:托盘 描述:CONN SATA PLUG 14POS SLD R/A 连接器,互连器件 插拔式连接器组件 | ETC 知名厂家 | ETC | ||
Heyco®-Tite Brass Lazy Bend Liquid Tight Cordgrips 文件:126.18 Kbytes Page:1 Pages | Heyco | |||
High Power, N or SMK Connectors 文件:511.42 Kbytes Page:1 Pages | APITECH | |||
AMP HPI 2.0MM 母端连接器 | TE | |||
AMP HPI 2.0MM 板端连接器 | TE | |||
AMPMODU Interconnection System 文件:3.23293 Mbytes Page:60 Pages | TEC 泰科电子 | |||
AMPMODU Interconnection System 文件:3.23293 Mbytes Page:60 Pages | TEC 泰科电子 | |||
AMP HPI 2.0MM 板端连接器 | TE | |||
AMPMODU Interconnection System 文件:3.23293 Mbytes Page:60 Pages | TEC 泰科电子 | |||
AMPMODU Interconnection System 文件:3.23293 Mbytes Page:60 Pages | TEC 泰科电子 | |||
Heyco®-Tite Brass Lazy Bend Liquid Tight Cordgrips 文件:126.18 Kbytes Page:1 Pages | Heyco | |||
High Power, N or SMK Connectors 文件:511.42 Kbytes Page:1 Pages | APITECH | |||
AMPMODU 2.0mm PITCH REC CONN, VERTICAL MOUNT TYPE 文件:311.24 Kbytes Page:2 Pages | MACOM | |||
AMPMODU Interconnection System 文件:3.23293 Mbytes Page:60 Pages | TEC 泰科电子 | |||
AMPMODU Interconnection System 文件:3.23293 Mbytes Page:60 Pages | TEC 泰科电子 | |||
AMPMODU Interconnection System 文件:3.23293 Mbytes Page:60 Pages | TEC 泰科电子 | |||
AMPMODU Interconnection System 文件:3.23293 Mbytes Page:60 Pages | TEC 泰科电子 | |||
AMPMODU Interconnection System 文件:3.23293 Mbytes Page:60 Pages | TEC 泰科电子 | |||
AMPMODU Interconnection System 文件:3.23293 Mbytes Page:60 Pages | TEC 泰科电子 | |||
AMPMODU Interconnection System 文件:3.23293 Mbytes Page:60 Pages | TEC 泰科电子 | |||
AMPMODU Interconnection System 文件:3.23293 Mbytes Page:60 Pages | TEC 泰科电子 | |||
AMPMODU Interconnection System 文件:3.23293 Mbytes Page:60 Pages | TEC 泰科电子 |
1470产品属性
- 类型
描述
- 型号
1470
- 功能描述
JACK .015-.025.161L SLD MNT
- RoHS
否
- 类别
连接器,互连式 >> 端子 - PC 引脚插座,插口
- 系列
-
- 标准包装
500
- 系列
324 Tail
- Type
标准尾
- 端子
陷形 长度 -
- 总体
0.602(15.29mm) Accepts Pin
- Diameter
0.032 ~ 0.046(0.81mm ~ 1.17mm)
- 安装孔直径
0.094(2.39mm) Pin Hole
- Diameter
0.064(1.63mm)
- 法兰直径
0.125(3.18mm) Tail
- Diameter
0.040(1.02mm) Socket
- Depth
0.195(4.95mm)
- 触点材料
铜铍
- 触点表面涂层
金
- 触点涂层厚度
30µin(0.76µm)
- 包装
散装
- 特点
-
- 工作温度
-55°C ~ 125°C
- 板厚度
0.188(4.78mm) Insertion
- Force
-
- 其它名称
0324-5151534271000324515153427100324515153427100
IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
NEC |
24+ |
QFP |
89 |
大批量供应优势库存热卖 |
|||
TE |
54 |
||||||
TE/AMP/TYCO |
2018+ |
connector |
37832 |
||||
TE/泰科 |
24+ |
connector |
49823 |
只做原装进口现货连接器 |
|||
AMP |
25+ |
NA |
880000 |
明嘉莱只做原装正品现货 |
|||
TYCO |
23+ |
NA |
649 |
专做原装正品,假一罚百! |
|||
AMP |
24+ |
60 |
|||||
TE/泰科 |
2508+ |
/ |
391805 |
一级代理,原装现货 |
|||
TE/TYCO/AMP |
三合一卡座 SD/MS/MMC |
69820 |
一级代理百分百有货,原装正品现货,支持实单! |
||||
Anderson Power Products, Inc. |
23+ |
原厂封装 |
12592 |
只做原装只有原装现货实报 |
1470芯片相关品牌
1470规格书下载地址
1470参数引脚图相关
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- 146C
- 1469I
- 1469A
- 146995-000
- 1469920-2
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- 1468-2
- 14682
1470数据表相关新闻
142-0761-851
优势渠道
2023-7-1114N50L-TO220FT-TGTC_UTC代理商
14N50L-TO220FT-TGTC_UTC代理商
2023-2-231500-0110
进口代理
2022-11-2614235R-500
14235R-500
2022-6-3014N50L
14N50L,全新.当天发货或门市自取,如需了解更多产品信息联系我们.零七五五.八二七三二二九一企鹅:一一七四零五二三五三,V:八七六八零五五八.
2021-11-41461220-4原装TE继电器
只做原装,假一罚十,可开16%增值税票。TE.NXP.ON.Renesas.Microchip.英飞凌.ALLEGRO深圳市大唐盛世半导体有限公司
2019-3-13
DdatasheetPDF页码索引
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