In-System Programmable High Density PLD

Description The ispLSI 1032/883 is a High-Density Programmable Logic Device processed in full compliance to MIL-STD-883. This military grade device contains 192 Registers, 64 Universal I/O pins, eight Dedicated Input pins, four Dedicated Clock Input pins and a Global Routing Pool (GRP). The GRP p

1032 Sanitary Pressure Gauge

FEATURES „ Can be Clean-in-place (CIP) or Steam-in-place (SIP) „ Autoclave or sterilize with 3½˝ dial with polysulfone window option „ Easy Zero™ provides external adjustability of instrument span (3½˝ dial) „ 12-15 RA (microinches) electropolished diaphragm surface „ Material certificates an

Heyco-Flex?줞ounting Brackets

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包装：散装 描述：PC TEST POINT SLOTTED 测试与计量 测试点

包装：散装 描述：PC TEST POINT SLOTTED 测试与计量 测试点

Heyco-Flex™Mounting Brackets

文件：102.49 Kbytes Page：1 Pages

Performance Restrictions Associated

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High-performance 24-port 10Gb aggregation switch

The X590 Series products are purpose-built 24-port 1Gb/10Gb switches designed for high-performance enterprise and aggregation applications. The X590 can also support a range of uplink interface speeds, including 10Gb, 25Gb, 40Gb, 50Gb, and 100Gb, all in a compact 1RU form factor. This enables the

Scalable advanced 10Gb aggregation switch

The X670-G2 product family provides high density 10 Gigabit Ethernet and 40 Gigabit Ethernet switching in a small 1RU form factor. With its versatile design, the X670-G2 provides high density Layer 2/3 10Gb networking with low latency cut-through switching, and IPv4 and IPv6 unicast and multicast

High-performance 48-port 10Gb aggregation and leaf switch

The X690 Series products are high-density, purpose-built 10Gb/100Gb switches designed for high-performance enterprise and aggregation applications. The X690 can support a range of interface speeds, including 1Gb, 10Gb, 25Gb, 40Gb, 50Gb, and 100Gb, all in a compact 1RU form factor. This enables the

100Gb Spine Switch and High Density 10Gb Leaf Switch

The X870 product family are high-density, purpose-built 100Gb switches designed for high-performance enterprise and cloud data centers. With 32 QSFP28 ports, the X870 can support a range of interface speeds, including 10Gb, 25Gb, 40Gb, 50Gb and 100Gb, all in a compact 1RU form factor. This enables

AT9064

Description 10w LED IP54 Dimmable Surface Mount D/L -Black/3000k/60o - Warm White

3M™ Mini D Ribbon (MDR) Connectors

• Design features durable two-piece glass reinforced polyester backshell with ground strap (compatible with 101XX-3000VE plug) • Round straight exit • Reliable metal strain relief clamp provides grounding for cable shield • Quick release metal latching mechanism • Positions: 14, 20, 26, 36

3M™ Mini D Ribbon (MDR) Connectors

• Design features durable two-piece glass reinforced polyester backshell with ground strap (compatible with 101XX-3000VE plug) • Round straight exit • Reliable metal strain relief clamp provides grounding for cable shield • Quick release metal latching mechanism • Positions: 14, 20, 26, 36

12VAC Transformer IP67

Description 30W 12Vac Dimmable Weatherproof Transformer

100Gb Spine Switch and High Density 10Gb Leaf Switch

The X870 product family are high-density, purpose-built 100Gb switches designed for high-performance enterprise and cloud data centers. With 32 QSFP28 ports, the X870 can support a range of interface speeds, including 10Gb, 25Gb, 40Gb, 50Gb and 100Gb, all in a compact 1RU form factor. This enables

High-performance 48-port 10Gb aggregation and leaf switch

The X690 Series products are high-density, purpose-built 10Gb/100Gb switches designed for high-performance enterprise and aggregation applications. The X690 can support a range of interface speeds, including 1Gb, 10Gb, 25Gb, 40Gb, 50Gb, and 100Gb, all in a compact 1RU form factor. This enables the

Scalable advanced 10Gb aggregation switch

The X670-G2 product family provides high density 10 Gigabit Ethernet and 40 Gigabit Ethernet switching in a small 1RU form factor. With its versatile design, the X670-G2 provides high density Layer 2/3 10Gb networking with low latency cut-through switching, and IPv4 and IPv6 unicast and multicast

High-performance 24-port 10Gb aggregation switch

The X590 Series products are purpose-built 24-port 1Gb/10Gb switches designed for high-performance enterprise and aggregation applications. The X590 can also support a range of uplink interface speeds, including 10Gb, 25Gb, 40Gb, 50Gb, and 100Gb, all in a compact 1RU form factor. This enables the

10321 Extreme Compatible Direct Attach Copper Breakout Cable 40G QSFP to 4x10G SFP (3m, Passive)

Features ATGBICS 10321 compatible 40GBase QSFP+ to 4x10G SFP+ direct attach breakout cable operates over passive copper with a cable length of 3m. It is suitable for very short distances and provides a cost-efficient way to connect hardware within close proximity racks. This breakout cable conn

High-performance 24-port 10Gb aggregation switch

The X590 Series products are purpose-built 24-port 1Gb/10Gb switches designed for high-performance enterprise and aggregation applications. The X590 can also support a range of uplink interface speeds, including 10Gb, 25Gb, 40Gb, 50Gb, and 100Gb, all in a compact 1RU form factor. This enables the

1032 2˝ Fractional Sanitary Pressure Gauge

FEATURES FlutterGuard™ option reduces movement wear and eliminates pointer flutter Heat lot traceable material certificates

10322 Extreme Compatible Direct Attach Copper Breakout Cable 40G QSFP to 4x10G SFP (5m, Passive)

Features ATGBICS 10322 compatible 40GBase QSFP+ to 4x10G SFP+ direct attach breakout cable operates over passive copper with a cable length of 5m. It is suitable for very short distances and provides a cost-efficient way to connect hardware within close proximity racks. This breakout cable conn

Scalable advanced 10Gb aggregation switch

The X670-G2 product family provides high density 10 Gigabit Ethernet and 40 Gigabit Ethernet switching in a small 1RU form factor. With its versatile design, the X670-G2 provides high density Layer 2/3 10Gb networking with low latency cut-through switching, and IPv4 and IPv6 unicast and multicast

High-performance 48-port 10Gb aggregation and leaf switch

The X690 Series products are high-density, purpose-built 10Gb/100Gb switches designed for high-performance enterprise and aggregation applications. The X690 can support a range of interface speeds, including 1Gb, 10Gb, 25Gb, 40Gb, 50Gb, and 100Gb, all in a compact 1RU form factor. This enables the

100Gb Spine Switch and High Density 10Gb Leaf Switch

The X870 product family are high-density, purpose-built 100Gb switches designed for high-performance enterprise and cloud data centers. With 32 QSFP28 ports, the X870 can support a range of interface speeds, including 10Gb, 25Gb, 40Gb, 50Gb and 100Gb, all in a compact 1RU form factor. This enables

High-performance 24-port 10Gb aggregation switch

The X590 Series products are purpose-built 24-port 1Gb/10Gb switches designed for high-performance enterprise and aggregation applications. The X590 can also support a range of uplink interface speeds, including 10Gb, 25Gb, 40Gb, 50Gb, and 100Gb, all in a compact 1RU form factor. This enables the

10323 Extreme Compatible Direct Attach Copper Twinax Cable 40G QSFP (5m, Passive)

Features ATGBICS 10323 compatible 40GBase-CU QSFP+ to QSFP+ direct attach cable operates over passive copper with a cable length of 5m. It is suitable for short reach connection between two QSFP+ ports in 40G interconnecting networking applications.  Our product meets the specification of Extrem

High-performance 24-port 10Gb aggregation switch

The X590 Series products are purpose-built 24-port 1Gb/10Gb switches designed for high-performance enterprise and aggregation applications. The X590 can also support a range of uplink interface speeds, including 10Gb, 25Gb, 40Gb, 50Gb, and 100Gb, all in a compact 1RU form factor. This enables the

Scalable advanced 10Gb aggregation switch

The X670-G2 product family provides high density 10 Gigabit Ethernet and 40 Gigabit Ethernet switching in a small 1RU form factor. With its versatile design, the X670-G2 provides high density Layer 2/3 10Gb networking with low latency cut-through switching, and IPv4 and IPv6 unicast and multicast

High-performance 48-port 10Gb aggregation and leaf switch

The X690 Series products are high-density, purpose-built 10Gb/100Gb switches designed for high-performance enterprise and aggregation applications. The X690 can support a range of interface speeds, including 1Gb, 10Gb, 25Gb, 40Gb, 50Gb, and 100Gb, all in a compact 1RU form factor. This enables the

100Gb Spine Switch and High Density 10Gb Leaf Switch

The X870 product family are high-density, purpose-built 100Gb switches designed for high-performance enterprise and cloud data centers. With 32 QSFP28 ports, the X870 can support a range of interface speeds, including 10Gb, 25Gb, 40Gb, 50Gb and 100Gb, all in a compact 1RU form factor. This enables

High-performance 48-port 10Gb aggregation and leaf switch

The X690 Series products are high-density, purpose-built 10Gb/100Gb switches designed for high-performance enterprise and aggregation applications. The X690 can support a range of interface speeds, including 1Gb, 10Gb, 25Gb, 40Gb, 50Gb, and 100Gb, all in a compact 1RU form factor. This enables the

Scalable advanced 10Gb aggregation switch

The X670-G2 product family provides high density 10 Gigabit Ethernet and 40 Gigabit Ethernet switching in a small 1RU form factor. With its versatile design, the X670-G2 provides high density Layer 2/3 10Gb networking with low latency cut-through switching, and IPv4 and IPv6 unicast and multicast

High-performance 24-port 10Gb aggregation switch

The X590 Series products are purpose-built 24-port 1Gb/10Gb switches designed for high-performance enterprise and aggregation applications. The X590 can also support a range of uplink interface speeds, including 10Gb, 25Gb, 40Gb, 50Gb, and 100Gb, all in a compact 1RU form factor. This enables the

3M™ Mini D Ribbon (MDR) Connectors

• Design features durable two-piece glass reinforced polyester backshell with ground strap (compatible with 101XX-3000VE plug) • Round straight exit • Reliable metal strain relief clamp provides grounding for cable shield • Quick release metal latching mechanism • Positions: 14, 20, 26, 36

3M™ Mini D Ribbon (MDR) Connectors

• Design features durable two-piece glass reinforced polyester backshell with ground strap (compatible with 101XX-3000VE plug) • Round straight exit • Reliable metal strain relief clamp provides grounding for cable shield • Quick release metal latching mechanism • Positions: 14, 20, 26, 36

Scalable advanced 10Gb aggregation switch

The X670-G2 product family provides high density 10 Gigabit Ethernet and 40 Gigabit Ethernet switching in a small 1RU form factor. With its versatile design, the X670-G2 provides high density Layer 2/3 10Gb networking with low latency cut-through switching, and IPv4 and IPv6 unicast and multicast

High-performance 48-port 10Gb aggregation and leaf switch

The X690 Series products are high-density, purpose-built 10Gb/100Gb switches designed for high-performance enterprise and aggregation applications. The X690 can support a range of interface speeds, including 1Gb, 10Gb, 25Gb, 40Gb, 50Gb, and 100Gb, all in a compact 1RU form factor. This enables the

STTB 2,5-R1K/O-U - Double-level spring-cage terminal block

Double-level spring-cage terminal block, nom. voltage: 500 V, nominal current: 22 A, connection method: Spring-cage connection, 1st and 2nd level, Rated cross section: 2.5 mm2, cross section: 0.08 mm2 - 4 mm2, mounting type: NS 35/7,5, NS 35/15, color: gray

PML-C101 (D39)R - Label

Label, Roll, white/red, pre-printed, can be labeled with: THERMOMARK E.300 (D)/600 (D), THERMOMARK ROLL 2.0, THERMOMARK ROLL, THERMOMARK ROLL X1, THERMOMARK ROLLMASTER 300/600, THERMOMARK X1.2: pre-printed, mounting type: adhesive, Number of individual labels: 500, text field height: 39 mm, tex

High-performance 24-port 10Gb aggregation switch

The X590 Series products are purpose-built 24-port 1Gb/10Gb switches designed for high-performance enterprise and aggregation applications. The X590 can also support a range of uplink interface speeds, including 10Gb, 25Gb, 40Gb, 50Gb, and 100Gb, all in a compact 1RU form factor. This enables the

Scalable advanced 10Gb aggregation switch

The X670-G2 product family provides high density 10 Gigabit Ethernet and 40 Gigabit Ethernet switching in a small 1RU form factor. With its versatile design, the X670-G2 provides high density Layer 2/3 10Gb networking with low latency cut-through switching, and IPv4 and IPv6 unicast and multicast

High-performance 48-port 10Gb aggregation and leaf switch

The X690 Series products are high-density, purpose-built 10Gb/100Gb switches designed for high-performance enterprise and aggregation applications. The X690 can support a range of interface speeds, including 1Gb, 10Gb, 25Gb, 40Gb, 50Gb, and 100Gb, all in a compact 1RU form factor. This enables the

100Gb Spine Switch and High Density 10Gb Leaf Switch

The X870 product family are high-density, purpose-built 100Gb switches designed for high-performance enterprise and cloud data centers. With 32 QSFP28 ports, the X870 can support a range of interface speeds, including 10Gb, 25Gb, 40Gb, 50Gb and 100Gb, all in a compact 1RU form factor. This enables

Inst, 1 Pr #18 Str BC, PVC Ins E1, OS, Blk PVC Jkt, 300V PLTC ITC CMG

Product Description UL Instrumentation, 1 Pair 18AWG (7x26) Bare Copper, PVC Insulation E1 Color Code, Overall Beldfoil® Shield, Black PVC Outer Jacket, PLTC ITC CMG AWM 2464 SUN RES

Inst, 1 Pr #18 Str BC, PVC Ins E1, OS, Blk PVC Jkt, 300V PLTC ITC CMG

Product Description UL Instrumentation, 1 Pair 18AWG (7x26) Bare Copper, PVC Insulation E1 Color Code, Overall Beldfoil® Shield, Black PVC Outer Jacket, PLTC ITC CMG AWM 2464 SUN RES

Inst, 1 Pr #18 Str BC, PVC Ins E1, OS, Blk PVC Jkt, 300V PLTC ITC CMG

Product Description UL Instrumentation, 1 Pair 18AWG (7x26) Bare Copper, PVC Insulation E1 Color Code, Overall Beldfoil® Shield, Black PVC Outer Jacket, PLTC ITC CMG AWM 2464 SUN RES

Inst, 1 Pr #18 Str BC, PVC Ins E1, OS, Blk PVC Jkt, 300V PLTC ITC CMG

Product Description UL Instrumentation, 1 Pair 18AWG (7x26) Bare Copper, PVC Insulation E1 Color Code, Overall Beldfoil® Shield, Black PVC Outer Jacket, PLTC ITC CMG AWM 2464 SUN RES

Inst, 1 Pr #18 Str BC, PVC Ins E1, OS, Blk PVC Jkt, 300V PLTC ITC CMG

Product Description UL Instrumentation, 1 Pair 18AWG (7x26) Bare Copper, PVC Insulation E1 Color Code, Overall Beldfoil® Shield, Black PVC Outer Jacket, PLTC ITC CMG AWM 2464 SUN RES

Inst, 1 Pr #18 Str BC, PVC Ins E1, OS, Blk PVC Jkt, 300V PLTC ITC CMG

Product Description UL Instrumentation, 1 Pair 18AWG (7x26) Bare Copper, PVC Insulation E1 Color Code, Overall Beldfoil® Shield, Black PVC Outer Jacket, PLTC ITC CMG AWM 2464 SUN RES

In-System Programmable High Density PLD

Description The ispLSI and pLSI 1032E are High Density Programmable Logic Devices containing 192 Registers, 64 Universal I/O pins, eight Dedicated Input pins, four Dedicated Clock Input pins and a Global Routing Pool (GRP). The GRP provides complete interconnectivity between all of these elements

High-Density Programmable Logic

Description The ispLSI and pLSI 1032E are High Density Programmable Logic Devices containing 192 Registers, 64 Universal I/O pins, eight Dedicated Input pins, four Dedicated Clock Input pins and a Global Routing Pool (GRP). The GRP provides complete interconnectivity between all of these elements

High-Density Programmable Logic

Description The ispLSI and pLSI 1032E are High Density Programmable Logic Devices containing 192 Registers, 64 Universal I/O pins, eight Dedicated Input pins, four Dedicated Clock Input pins and a Global Routing Pool (GRP). The GRP provides complete interconnectivity between all of these elements

High-Density Programmable Logic

Description The ispLSI and pLSI 1032E are High Density Programmable Logic Devices containing 192 Registers, 64 Universal I/O pins, eight Dedicated Input pins, four Dedicated Clock Input pins and a Global Routing Pool (GRP). The GRP provides complete interconnectivity between all of these elements

High-Density Programmable Logic

Description The ispLSI and pLSI 1032E are High Density Programmable Logic Devices containing 192 Registers, 64 Universal I/O pins, eight Dedicated Input pins, four Dedicated Clock Input pins and a Global Routing Pool (GRP). The GRP provides complete interconnectivity between all of these elements

High-Density Programmable Logic

Description The ispLSI and pLSI 1032E are High Density Programmable Logic Devices containing 192 Registers, 64 Universal I/O pins, eight Dedicated Input pins, four Dedicated Clock Input pins and a Global Routing Pool (GRP). The GRP provides complete interconnectivity between all of these elements

High-Density Programmable Logic

Description The ispLSI and pLSI 1032E are High Density Programmable Logic Devices containing 192 Registers, 64 Universal I/O pins, eight Dedicated Input pins, four Dedicated Clock Input pins and a Global Routing Pool (GRP). The GRP provides complete interconnectivity between all of these elements

High-Density Programmable Logic

Description The ispLSI and pLSI 1032E are High Density Programmable Logic Devices containing 192 Registers, 64 Universal I/O pins, eight Dedicated Input pins, four Dedicated Clock Input pins and a Global Routing Pool (GRP). The GRP provides complete interconnectivity between all of these elements

High-Density Programmable Logic

Description The ispLSI and pLSI 1032E are High Density Programmable Logic Devices containing 192 Registers, 64 Universal I/O pins, eight Dedicated Input pins, four Dedicated Clock Input pins and a Global Routing Pool (GRP). The GRP provides complete interconnectivity between all of these elements

2.0WAF POWER AMPLIFIER