| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
CAT5eHorizontalBonded-Pair,4pr,UTP,FEPJkt,CMP-LC ProductDescription CAT5e+(350MHz),4-Bonded-pairs,U/UTP-unshielded,LimitedCombustibleFHC25/50,Plenum-CMP,PremiseHorizontalcable,24AWGsolidbarecopper conductors,FEPinsulation,FEPjacket. | BELDEN Belden Inc. |  |   | |
Low-FrequencyGeneral-PurposeAmpApplications???? Low-FrequencyGeneral-PurposeAmplifierApplications Features •Largecurrentcapacity. •Lowcollector-to-emittersaturationvoltage. Applications •AFpoweramplifier,medium-speedswitching,small-sizedmotordriverapplications. | SANYOSanyo 三洋三洋电机株式会社 |  | | |
SigmaDSP28/56-BitAudioProcessorwith2ADC/4DAC GENERALDESCRIPTION TheADAU1701isacompleteaudiosystem-on-a-chipincludinga28/56-bitaudioDSP,ADCsandDACs,andmicrocontroller-likecontrolinterfaces.Signalprocessingincludesequalization,crossover,bassenhancement,multibanddynamicsprocessing,delaycompensation,speaker | ADAnalog Devices 亚德诺亚德诺半导体技术有限公司 |  | | |
CCFLINVERTER 文件：1.80276 Mbytes Page：2 Pages | ACIPOWER Applied Concepts Inc. |  | | |
SigmaDSP28-/56-BitAudioProcessor 文件：1.07592 Mbytes Page：52 Pages | ADAnalog Devices 亚德诺亚德诺半导体技术有限公司 | | |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
ADI(亚德诺) |
22+ |
NA |
10000 |
原装,BOM表可配单 |
|||
ADI/亚德诺 |
21+ |
LQFP-48 |
10000 |
原装，品质保证，请来电咨询 |
|||
ADI/亚德诺 |
21+ |
原封装 |
13880 |
公司只售原装,支持实单 |
|||
ADI |
2018+ |
QFP |
30000 |
ADI一级代理原装现货假一罚十 |
|||
AD |
23+ |
原厂原包 |
19960 |
只做进口原装 终端工厂免费送样 |
|||
ADI(亚德诺) |
23+ |
标准封装 |
13859 |
正规渠道,大量现货,只等你来。 |
|||
ADI(亚德诺) |
23+ |
NA |
10000 |
原装,BOM表可配单 |
|||
ADI(亚德诺) |
23+ |
NA/ |
8735 |
原厂直销,现货供应,账期支持! |
|||
ADI |
2017+ |
QFP |
2000 |
原装现货假一罚十 |
|||
ADI(亚德诺) |
23+ |
N/A |
10000 |
原装，可配单 |
C1701C芯片相关品牌
C1701C规格书下载地址
C1701C参数引脚图相关
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C1701C数据表相关新闻
C1608X5R1E105K080AC
C1608X5R1E105K080AC
2022-2-10C19D903205P1375
C19D903205P1375OTHER20+标准封装 C8051F001SILICONLABS20+标准封装 C8051F023-GQSILICONLABS20+标准封装 CAT24C04WICATALYSTSEMICONDUCTOR20+标准封装 CAT24C08WI-GT3CATALYSTSEMICONDUCTOR20+标准封装 CAT28F010G-12(PROG)OTHER20+标准封装 CMCPCI102BRCALIFORNIAMICRODEVICES20+标准封装 CP
2021-6-5C1720J5003AHF定向耦合器
C1720J5003AHF定向耦合器
2021-3-23C1608C0G1H332J080AA产品技术参数 资料品牌TDK 批号2019 封装：SMD
C1608C0G1H332J080AA产品技术参数资料品牌TDK
2020-6-13C1608COG1HR68CT000N0603-0.68PPB-FREE，C1608COG221JT000N
C1608COG1HR68CT000N0603-0.68PPB-FREE，C1608COG221JT000N
2020-4-3C17AH，C18003，C18005(104-022-B)，C1806，C1808DKNPOEBN6R0
C17AH，C18003，C18005(104-022-B)，C1806，C1808DKNPOEBN6R0
2020-4-3
DdatasheetPDF页码索引
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