PGAZIFTest&Burn-inSocketforAnyFootprintonStd8x8to21x21Grid

FEATURES •StrongMetalCamActivatesNormally-closedContacts,PreventingDependencyonPlasticfor ContactForce •HandlemountedonRight-orLeft-handSide •AnyFootprintAcceptedonStandard13x13to21x21Grid GENERALSPECIFICATIONS •SOCKETBODY:blackUL94V-0PolyphenyleneSulfid

功能：电压，电流，电阻 包装：盒 描述：DMM AUTO-RANGE 0-24MA OUTPUT 测试与计量 设备 - 万用表

功能：螺丝端子 包装：散装 描述：PROTO-SCREWSHIELD WINGSHIELD R3 开发板，套件，编程器 评估板 - 扩展板，子卡

MINIATUREFUSES-5x20mm

文件：87.25 Kbytes Page：2 Pages

RUGGEDandLIGHTWEIGHTALUMINUMBATTERYHOLDERS

文件：115.71 Kbytes Page：2 Pages

TemperatureSensorsLineGuide

文件：736.09 Kbytes Page：11 Pages

Intel®Atom™E38452UFanlessSystem;EN50121-4CompliantforRailwayApplications

Features ƒBuilt-inIntel®Atom™E3845quad-coreprocessor,1.91GHz ƒ4GBofDDR3memoryonboard ƒ2Ufanlessrackmountsystem ƒSupports3xITA-EMmodulesforI/Oexpansion ƒSupportsEasy-Swappowermodule ƒUpto26GbEor26SerialportswithITA-EMmodules ƒCompliantwithEN50121-

RackmountFanlessSystemwithIntel®6thGenCore™iProcessor

Features ƒIntel®6thGenCore™i7/i3(BGAtype)processorwithIntel®QM170chipset ƒWideoperatingtemperature(-20~60°C) ƒ8GBonboardDDR4memory+1xsocketforexpansion.Max.24GBintotal. ƒ2xDVIports(supportstripledisplay) ƒ2xGigaLAN,2xUSB3.0.6xUSB2.0 ƒ2xPCI

3UShort-depthRackmount/TowerChassisforEATX/ATX/MicroATXMotherboard

Features ƒSupportsEATX/ATX/MicroATXmotherboardwithdualprocessors ƒTwohot-swap3.5/2.5drivebays,oneslimODDdrivebayandtwointernal 3.5HDDbays ƒDualfrontUSB3.0ports ƒSupportsFlexATXpower,2U80Plussingleorredundantpowersupply ƒFront-accessiblesystemfanwithou

200kS/s,16-Bit,16-ChMultifunctionDAQUSBModule

Features ƒSupportsUSB3.0SuperSpeed ƒPortable ƒBuspowered ƒ16xAnaloginputchannels ƒ16-bitresolutionanaloginput ƒUpto200kS/ssamplingrate ƒ8-chDigitalinput/8-chdigitaloutput,2-chanalogoutput,and1x32-bit counter ƒDetachablescrewterminalonmodules ƒSuita

3UShort-depthRackmount/TowerChassisforEATX/ATX/MicroATXMotherboard

Features ƒSupportsEATX/ATX/MicroATXmotherboardwithdualprocessors ƒTwohot-swap3.5/2.5drivebays,oneslimODDdrivebayandtwointernal 3.5HDDbays ƒDualfrontUSB3.0ports ƒSupportsFlexATXpower,2U80Plussingleorredundantpowersupply ƒFront-accessiblesystemfanwithou

8chAIVideoSystemonNVIDIAJetson®

Features ƒNVIDIAJetson™NANOembedded ƒSupport8chPoEVideoInput ƒSupport2x3.5HDD ƒBundlewithLinuxUbuntu18.04withBSP ƒLowpowerconsumption ƒH.264/H.265camerasupported

8chAIVideoSystemonNVIDIA®Jetson™XavierNX

Features ƒNVIDIA®Jetson™XavierNXembedded ƒSupports8CHPoEvideoinput ƒSupports2x3.5HDD ƒBoardsupportpackage(BSP)includesLinuxUbuntu18.04 ƒLowpowerconsumption ƒSupportsH.264/H.265cameras

8chAINetworkVideoRecorderonNVIDIAJetson®Xavier

Features ƒNVIDIAJetson™Xavierembedded ƒSupport8chPoEvideoinput ƒSupport2x3.5HDD ƒBundlewithLinuxUbuntu18.04withBSP ƒLowpowerconsumption ƒH.264/H.265camerasupported ƒJetpack4.2.2compatible

DualGPUExpansionModuleforVideoAIEdgeComputingwithMIC-7Series

Features ƒOfferingpowerfulGPUsolutionwithdualNVIDIA250W,2.75-slot width/331mmlengthGPUcardsfornewAIapplication ƒTriple24VDCpowerinputs,provideindependentpowerforGPUcardsand MIC-7system ƒIntelligentpowerstatusindicatingLEDforsystemandGPUcard independently

CompactSizeTowerIPCwith12thGenIntel®Core™iCPUSocket(LGA1700)and250WPSU

Features ƒIntel®12thgenerationCore™i9/i7/i5/i3&Pentium®/Celeron®processor withH610Echipset ƒDesignforoperatorIPCandapplicationwithspacelimit ƒDualUSB3.2anddualUSB2.0portonbothfrontandrearside ƒDualIndependentDisplay(HDMI/DP) ƒ2lowprofileExpansionslo

200kS/s,16-Bit,16-ChMultifunctionDAQUSBModule

Features ƒSupportsUSB3.0SuperSpeed ƒPortable ƒBuspowered ƒ16xAnaloginputchannels ƒ16-bitresolutionanaloginput ƒUpto200kS/ssamplingrate ƒ8-chDigitalinput/8-chdigitaloutput,2-chanalogoutput,and1x32-bit counter ƒDetachablescrewterminalonmodules ƒSuita

MicroComputerwithIntel®Core™i7/i5/i3Processor,Intel®H110Chipset,2xExpansionSlots,and250W80PLUSPSU

Features ƒIntel®6th/7thGenCore™i7/i5/i3/Celeron®processerwithIntel®H110chipset ƒ1xPCIex16and1xPCIex4(1xPCIforAIMC-3202-01)expansionslots ƒCompactdesignwithfront-accessibleI/O ƒ1xVGA+DVI-D,2xGbELAN,3xUSB3.0,2xCOM ƒ2x2.5internal,shock-resistantS

EmbeddedMini-ITXChassiswithOneExpansionSlot

Features ƒSupportsIntel®7th&6thGenCore™iprocessor(LGA1151)withIntelQ170 ƒTwo260-pinSO-DIMMupto32GBDDR42133MHzSDRAM ƒSupportstripledisplayofVGA/DP/HDMI ƒOneexpansionslot(lowprofile) ƒReserved4USB,1COM,punchoutsonfrontpanel ƒTwoShockResistant2.5dr

EmbeddedMini-ITXChassiswithOneExpansionSlot

Features ƒSupportsIntel®7thGenCore™&6thGenCore™iprocessor/Pentium/ Celeron(LGA1151)withIntelH110chipset ƒTwo260-pinSO-DIMMupto32GBDDR42133MHzSDRAM ƒSupportsDualdisplayconfigurationbymultipleinterface:DP/DVI-D/VGA ƒSupportsDirectX12,OpenGL4.4,OpenCL2.

PoECompactSystem,SupportsIntel®Core™i7/i5/i3CPU,4-CHGbEPoE

Features ƒƒIntel®3rdCore™i7/i5/i3CPU(LGA1155) ƒƒ4-CHGbEPoE(PoweroverEthernet),IEEE802.3afcompliant ––Powereddeviceautodetectionandclassification ––SupportsIEEE1588&GigEVisiondevice ––CompatiblewithGigECameras ƒƒCompact&thoughtfuldesign ––Volumelessthan3L

CompactVisionSystem,Intel®10thGenCoreiCPU,4-CHCameraInterfaceforGigEPoEorUSB3.0,PCIeexpansionslot,supports4-CHLightingandIsolatedDIO

Features ƒIntel10thgenerationCoreiCPU(LGA1200) ƒAIIS-3411P:4-CHGbEPoE(PoweroverEthernet) –Powereddeviceautodetectionandclassification –IEEE802.3afcompliant,supportsIEEE1588 –CompatiblewithGigEcameras ƒAIIS-3411U:4-CHUSB3.0withdedicatedcontroller –Maximi

EdgeIntelligenceSystemPoweredByWISE-DeviceOn

Features ƒIntegratedhardwareplussoftwaretobuildupedge-to-cloudapplications ƒPoweredbyWISE-DeviceOnforIoTdeviceremoteandoperationmanagement ƒPre-configuredsystem:Intel®Celeron®N3350dualcore,Windows10IoT Enterprise,4GDDR3Lmemoryand64GSSD ƒDIN-Railsystemwith

EdgeAIInferenceSystemwithIntelAtom®E3940QCSoCandTwoIntelMA2485VPUs

Features ƒIntelAtom®E3940QuadCoreSoCturboburstupto1.8GHz ƒIntel®Movidius™Myriad™XVPUMA2485x2Built-in ƒIntel®OpenVINO™toolkitsupported ƒSATASlim64GSSDx1Built-in ƒ204-pinSO-DIMMDDR3L8GBmemoryx1built-in ƒDIN-RailAIsystemwithessentialI/Oportsonfron

IntelCeleronN3350DCSoCwith4KDualHDMI/DualLAN/M.2DIN-RailFanlessBoxPC

Features ƒIntelCeleronN3350DualCore1.1GHz ƒDIN-RailsystemwithessentialI/Oportsonfront-sidebezel ƒI-Grade4GDDR3Lmemoryand64GSSDbuilt-in ƒWindows10IoTEnterprisebuilt-in ƒ60Wadaptorbundledintheaccessorybox ƒDualHDMIdisplayupto4Kresolution ƒ1xfull-s

IntelAtomE3940QCSoCwithisolatedGbEandCOMportsDIN-RailFanlessBoxPC

Features ƒIntelAtomE3940QuadCoreSoCturboburstupto1.8GHz ƒDIN-RailsystemwithessentialI/Oportsonfront-sidebezel ƒ2xIsolatedIntelGbEwithprotectionto2.5KVDC ƒ2xIsolatedCOMwithprotectionto2.5KVDC ƒIsolated8bitGPIO(4DI/4DO)withwithprotectionto2.5KV

Intel®Atom™E3940QCSoCwith4KDualHDMI/DualLAN/M.2DIN-RailFanlessBoxPC

Features ƒIntel®Atom™E3940QuadCoreSoCturboburstupto1.8GHz ƒDIN-RailsystemwithessentialI/Oportsonfront-sidebezel ƒ2xIntelGbEand4xUSB3.0 ƒDualHDMIdisplayupto4Kresolution ƒ1xfull-sizemPCIewithSIMholderand1xM.22230forWIFI#1 ƒ1x2.5SATAIIIS

Intel®Atom™E3940QCSoCwith4KDualHDMI/DualLAN/M.2DIN-RailFanlessBoxPC

Features ƒIntel®Atom™E3940QuadCoreSoCturboburstupto1.8GHz ƒDIN-RailsystemwithessentialI/Oportsonfront-sidebezel ƒ2xIntelGbEand4xUSB3.0 ƒDualHDMIdisplayupto4Kresolution ƒ1xfull-sizemPCIewithSIMholderand1xM.22230forWIFI#1 ƒ1x2.5SATAIIIS

RockchipRK3399Cortex-A72UIO40-ExpressEdgeAIBoxComputer

Features ƒRockchipRK3399ARMDualCortex-A72andQuadCortex-A531.8GHz ƒOnboardLPDDR42GB ƒHDMI1920x1080at60Hz ƒDualLan,12-wireRS-232,1USB3.0,1USB2.0,1MicroSD ƒ1mini-PCIeforLTE/WiFi/BT ƒCompatiblewithUIO40-Expressmodules:UIO-4030,UIO-4032and UIO-4034 ƒSup

RackmountFanlessSystemwithIntel®6thGenCore™iProcessor

Features ƒIntel®6thGenCore™i7/i3(BGAtype)processorwithIntel®QM170chipset ƒWideoperatingtemperature(-20~60°C) ƒ8GBonboardDDR4memory+1xsocketforexpansion.Max.24GBintotal. ƒ2xDVIports(supportstripledisplay) ƒ2xGigaLAN,2xUSB3.0.6xUSB2.0 ƒ2xPCI

Intel®6thGenerationCore™iProcessor2UFanlessSystem;EN50121-4CompliantforRailwayApplications

Features ƒBuilt-inIntel®Core™i7-6822EQquad-coreprocessor,2.0GHz ƒ16GBofDDR4memoryonboard ƒ2Ufanlessrackmountsystem ƒSupports3ITA-EMmodulesforI/Oexpansion ƒSupportsEasy-Swappowermodule ƒUpto26GbEor26SerialportswithITA-EMmodules ƒCompliantwithEN50121-

Intel®Atom™E38452UFanlessSystem;EN50121-4CompliantforRailwayApplications

Features ƒBuilt-inIntel®Atom™E3845quad-coreprocessor,1.91GHz ƒ4GBofDDR3memoryonboard ƒ2Ufanlessrackmountsystem ƒSupports3xITA-EMmodulesforI/Oexpansion ƒSupportsEasy-Swappowermodule ƒUpto26GbEor26SerialportswithITA-EMmodules ƒCompliantwithEN50121-

Intel®Atom™E38451UFanlessSystem;EN50121-4CompliantforRailwayApplications

Features ƒBuilt-inIntel®Atom™E3845quad-coreprocessor,1.91GHz ƒ4GBofDDR3memoryonboard ƒ1Ufanlessrackmountsystem ƒ4xGbEand10xRS-232/422/485portswithisolationdesign ƒ6xUSB2.0and1xUSB3.0slots ƒ1xVGAand1xDVI-Ddisplayoutputs ƒCompliantwithEN5012

TinyNetworkAppliancewithIntel®Celeron®J3355/J3455forEntryLevelSD-WANandSecurityGateway

Features ƒIndustry-standardx86platformforSOHOandsmallenterprise installations ƒCertifiedbykeyecosystempartnersinNFVandsecurityindustry ƒTinyphysicalappearanceandfan-lessdesignsupportedby optionalWall/VESA/DIN-railmountingkit ƒQuad1GbERJ45withoptional3G/4GL

InterchangeableDisplayModuleswith12XGA/15XGA/17SXGA/19SXGA/15.6FHD/18.5HD/21.5FHD/23.8FHD

Features ƒModularfrontdisplaydesigninthreeapplication-basedmodulecategories, enablingflexibleconfigurations ƒFrontpanelmodulewithP-CAPmulti-touchsensoravailableinvarioussizes (12and19moduleisequippedwith5-wireresistivetouchcontrol) ƒIndustrial-gradeLEDLCDwi

18.5WXGATFTLEDLCDTouchPanelComputerwith8thGen.Intel®Core™i5Processor,built-in8GDDR4RAMandULClass1Division2

Features ƒIndustrial-grade18.5WXGATFTLCDwith50KlifetimeandLEDbacklight ƒ8thGen.Intel®Core™i5-8365UEquad-coreprocessorwithbuilt-in8GB DDR4SO-DIMM ƒDualchannelmemoryslotssupportupto64Gintotal ƒCompact,fanlessembeddedsystemwithaluminumalloyfrontbezeland

Intel®Atom™E38452UFanlessSystem;EN50121-4CompliantforRailwayApplications

Features ƒBuilt-inIntel®Atom™E3845quad-coreprocessor,1.91GHz ƒ4GBofDDR3memoryonboard ƒ2Ufanlessrackmountsystem ƒSupports3xITA-EMmodulesforI/Oexpansion ƒSupportsEasy-Swappowermodule ƒUpto26GbEor26SerialportswithITA-EMmodules ƒCompliantwithEN50121-

Intel®Atom™E38451UFanlessSystem;EN50121-4CompliantforRailwayApplications

Features ƒBuilt-inIntel®Atom™E3845quad-coreprocessor,1.91GHz ƒ4GBofDDR3memoryonboard ƒ1Ufanlessrackmountsystem ƒ4xGbEand10xRS-232/422/485portswithisolationdesign ƒ6xUSB2.0and1xUSB3.0slots ƒ1xVGAand1xDVI-Ddisplayoutputs ƒCompliantwithEN5012

AMDT40E/T16RISAHalf-sizeSBCwithDualIndependentDisplay/DualGbE/SATA/USB/m-SATA/COM/LPT

Features ƒUltralowpower,AMDdual-coreAcceleratedProcessingUnitT40Eorfanless T16R ƒDDR31066memoryonboard1GB+DDR31066SO-DIMMsocket4GB ƒDualindependentdisplay ƒUpto2GbELANsupported ƒUpto7USB2.0(480Mbps) ƒ4xSATA3.0(600MB/s)and1m-SATA(600MB/s) ƒLe

Intel®Atom™N455/D525SBCwithVGA/DualGbELAN

Features ƒƒUltralowpower,fanlessN455CPUandmaximum2GBDDR3800memory (OnlyforNSKU) ƒƒDualcorehighperformanceIntel®Atom™D525processorandmaximum3 GBDDR3800memory(OnlyforDSKU) ƒƒMemoryanti-vibrationthrough1GBonboardmemoryandSO-DIMM mountingholes ƒƒIE61

LGA120010thGenerationIntel®Core™i9/i7/i5/i3&Pentium®/Celeron®ATXwithDVI/VGA,DDR4,USB3.2,M.2,6COMs

Features ƒIntel®10thgenerationCore™i9/i7/i5/i3&Pentium®/Celeron®processor withH420Echipset ƒDualchannel(Non-ECC)DDR42400/2666/2933upto64GB ƒSupportVGAandDVIdisplay ƒM.2,SATA3.0,USB3.2,dualGbEs ƒ5RS-232and1RS-232/422/485serialports ƒ1PCIex16(Gen3)a

FrontAccessMicroComputer,IntelCorei7/i5/i3CPUwith10COM,8USBand4Expansion

Features ..Intel®H61Platform ..Intel®Core™i7/i5/i3CPU(LGA1155) ..OnePCIex16&onePCIex1slot ..Compact&RichI/OConfiguration ..Twointernal3.5SATAHDDbays ..2VGA,2GbELAN,8USB2.0,10COM ..Optionalfiltermodulefordustproof ..Optionalbracketmodulesupportupt

LGA11516th/7thGenerationIntel®Core™i7/i5/i3/Pentium®/Celeron®ATXwithDVI/VGA,DDR4,SATAIII,USB3.0&6COMs

Features ƒIntel®6th/7thgenerationCore™i7/i5/i3/Pentium®/Celeron®processor ƒDualchannel(Non-ECC)DDR41866/2133upto32GB ƒSupportsVGAandDVIdisplay ƒSupportsSATA3.0,USB3.0,dualGbEs ƒSupports5RS-232and1RS-232/422/485serialports ƒ1PCIex16(Gen3)and1PCIex4(Gen

Intel®Core™i9/i7/i5/i3LGA1200Intel®Core™i9/i7/i5/i3LGA1200DualLAN,M.2,DDR4,DCInput

Features ƒSupportsIntel®10thGenCore™iprocessor(LGA1200)withIntelH420E chipset ƒTwo260-pinSO-DIMMupto64GBDDR42933MHzSDRAM ƒSupportsdualdisplayofHDMI1.4/HDMI2.0/eDP ƒSupports1M.2Mkey&1M.2Ekey,6USB3.0&2USB2.0and2SATAIII ƒSupports12V~24V ƒSup

Intel®Xeon®E3/Core™i7/i5/i3LGA1151MicroATXwithDVI-D/HDMI/DP/eDP/VGA,2COM,DualLAN,8SATAIII,10USB3.0

Features ƒƒSupportsIntel®Xeon®/6th&7thGenCore™i7/i5/i3processorwithC236 chipset ƒƒUptofourDIMMsocketssupportupto64GBDDR42133MHzSDRAM ƒƒSupportsDVI-D,HDMI,DP++,eDP,VGAdisplay ƒƒSupportsIntelAMT11.0andIntelvProcompetent ƒƒSupportsPCIEGen3,upto10x

Intel®Xeon®W10thGenCore™(CometLake-S)i9/i7/i5/i3LGA1200,MicroATXwith2DP/VGA/eDP/6COM,210GbELANs,2GbELANs,4USB3.2Gen2,6USB3.2Gen1

Features ƒSupportsIntel®Xeon®W10thGenCore™(CometLake-S)i9/i7/i5/i3 processorwithW480E/Q470E/H420Echipset ƒSupportstripledisplays.(2DP++,eDP,VGAdisplay) ƒSupportsIntelAMT12.0andIntelvProcompetent ƒSupportsPCIeGen3,maxupto4xUSB3.2Gen2,6xUSB3.2Gen1, 6x

EmbeddedSystemwith4PCIEExpansionSlots

Features ƒ4UEmbeddedSystemforMicro-ATXmotherboard ƒUpto4PCIEExpansionSlots ƒ2ShockResistant2.5drivebays ƒToaccommodate300WPSUfordifferentapplications ƒPlentifulIOPortsforVariousApplications

EmbeddedSystemwith4PCIEExpansionSlots

Features ƒ4UEmbeddedSystem ƒUpto4PCIEExpansionSlots ƒUpto6ShockResistant2.5drivebays ƒToaccommodate700Woroptional1200WPSUfordifferentapplications ƒPlentifulIOPortsforVariousApplications ƒServerGradeCPUforHigh-endComputing

Intel®10thGenCore™processor,LGA1200Mini-ITXmotherboard

Features ƒSupportsIntel®10thGenCore™iprocessor(LGA1200)withIntelQ470E/ H420Echipset ƒTwo260-pinSO-DIMMupto64GBDDR42933MHzSDRAM ƒSupportsdisplaysofHDMI2.0a/DP1.2/VGA/LVDs(oreDP) ƒSupports1M.2Mkey&1M.2Ekey ƒSupports4USB3.2Gen2&4USB3.2Gen1,and3SA

Intel®Xeon®E3/Core™i7/i5/i3LGA1151MicroATXwithDVI-D/HDMI/DP/eDP/VGA,2COM,DualLAN,8SATAIII,10USB3.0

Features ƒƒSupportsIntel®Xeon®/6th&7thGenCore™i7/i5/i3processorwithC236 chipset ƒƒUptofourDIMMsocketssupportupto64GBDDR42133MHzSDRAM ƒƒSupportsDVI-D,HDMI,DP++,eDP,VGAdisplay ƒƒSupportsIntelAMT11.0andIntelvProcompetent ƒƒSupportsPCIEGen3,upto10x

LGA11504thGenerationIntel®Core™i7/i5/i3Half-sizeSHBwithPCIe/VGA/DVI/DualGbELAN

Features ƒComplieswithPICMG1.3 ƒSupportsIntel®Core™i7/i5/i3LGA1150processorswithH81 ƒDualChannel(Non-ECC)DDR31066/1333/1600upto16GB ƒSupportsUSB3.0,SATA3.0 ƒSupportsCRTandDVI-D(optional)display ƒSupportdual10/100/1000MbpsEthernet ƒSupportsAdvantechTPM

LGA11504thGenIntel®Xeon®andCore™i7/i5/i3Half-sizeSHBwithPCIe3.0/Tripleindependentdisplay/DualGbELAN/SATA3.0/m-SATA/USB3.0

Features ƒComplieswithPICMG1.3 ƒSupportsIntelXeonE31200v3series,Corei7/i5/i3LGA1150processors withC226 ƒDualChannelDDR31066/1333/1600upto16GB ƒSupportsPCIE3.0,USB3.0,SATA3.0,SWRaid0,1,5,10 ƒSupportstripledisplays ƒSupportdual10/100/1000MbpsEthernet

LGA1150Intel®Core™i7/i5/i3/Pentium®SHBDDR3/SATA3.0/USB3.0/DualGbE/3Displays

Features ƒSupportsIntel®Core™i7/i5/i3LGA1150processorswithQ87 ƒDualChannel(Non-ECC)DDR31333/1600upto16GB ƒSupportsPCIE3.0,USB3.0,SATA3.0,SWRaid0,1,5,10 ƒSupportsCRTand2xDP/DVI-D(optional)display ƒSupportsout-of-bandremotemanagementwithAMT9.0 ƒSuppo

LGA1150Intel®Xeon®/Core™i3/Pentium®SHBDDR3/SATA3.0/USB3.0/DualGbE/3Displays

Features ƒSupportsIntel®Xeon®E31200v3series,Core™i7/i5/i3LGA1150 processorswithC226 ƒDualChannel(ECC/Non-ECC)DDR31333/1600upto16GB ƒSupportsPCIE3.0,USB3.0,SATA3.0,SWRaid0,1,5,10 ƒSupportsCRTand2xDP/DVI-D(optional)display ƒSupportsout-of-bandremotem

MicroComputer,Intel®Core™i7/i5/i3CPU,H81,4Expansions2PCI/2PCIe,300W80PlusPSU

Features ƒƒIntel®H81Platform ––Intel®4thgenCore™i7/i5/i3CPU(LGA1150) ––TwoPCIe(x16/x1)&twoPCIExpansionSlots ƒƒCompact&RichI/OConfiguration ––Oneinternal3.5SATAHDDbayswithshock-resistant ––Optionalfrontremovable2.5HDDbay ––VGA,2GbELAN,4USB2.0,2COM ––E

MicroComputerwithIntel®Core™i7/i5/i3Processor,Intel®H110Chipset,4xExpansionSlots,and300W80PLUSPSU

Features ƒIntel®6th/7thGenCore™i7/i5/i3/Celeron®processerwithIntel®H110chipset ƒTwoPCIe(x16/x1)&twoPCIexpansionslots ƒCompactdesignwithfront-accessibleI/O ƒ1xVGA,2xGbELAN,2xUSB2.0,1xUSB3.0,2xCOM ƒ1x3.5shock-resistantHDDbay ƒReusablefilterand

8thGenerationIntel®Core™ProcessorU-SeriesCeleron4000SeriesCOMExpressCompactModuleType6

Features ƒ8thGenerationIntel®Core™ProcessorU-Series ƒCOMExpressR3.0CompactmoduleType6Pinout ƒDualchannelDDR4SODIMM,max.64GB ƒHighspeedI/Os:4USB3.2gen2,8PCIegen3lanesand2SATAIII ƒOnboardstorageeMMC32GB,TPM2.0(Optional) ƒSupportsiManager,embeddedsoft

9th/8thGenIntel®Xeon®/Core™ProcessorsCOMExpressBasicModuleType6

Features ƒIntel9th/8thGenXeon®/Core™Hexa/QuadCores+PCHQM370/CM246 ƒDualchannelDDR4,Max96GB(ECCoptional) ƒHighSpeedI/O:4USB3.1(Gen2),8PCIex1(Gen3),4SATA(Gen3) ƒThreeIndependentSymmertricalDisplays(Upto4K) ƒSupportsiManager,WISE-Device-On,EmbeddedSoftware

IntelXeonProcessorD-1500COMExpressR3.0Type7ModuleforRuggedizedApplication

Features ƒCOMExpressR3.0BasicModuleType7pinout ƒIntel®Xeon®ProcessorD-1500ProductFamily ƒSolder-downmemoryw/ECC,max.32GB ƒHighspeedEthernet(dual10GBASE-KRinterfaces,oneGbE) ƒAbundantexpansion.(PCIex16,PCIex8,8PCIex1) ƒSupportsiManager,WISE-PaaS/Device

LGA1150Intel®Xeon®/Core™i3/Pentium®SHBDDR3/SATA3.0/USB3.0/DualGbE/3Displays

Features ƒSupportsIntel®Xeon®E31200v3series,Core™i7/i5/i3LGA1150 processorswithC226 ƒDualChannel(ECC/Non-ECC)DDR31333/1600upto16GB ƒSupportsPCIE3.0,USB3.0,SATA3.0,SWRaid0,1,5,10 ƒSupportsCRTand2xDP/DVI-D(optional)display ƒSupportsout-of-bandremotem

FM Stereo Multiplexer

LINEAR INTEGRATED CIRCUIT

PLL FM Multiplex Stereo Demodulator

PLL MULTIPLEX STEREO DEMODULATOR

Integrated Circuit Phase Lock Loop (PLL) FM Multiplex Stereo Demod

FM MULTIPLEX STEREO DEMODULATOR SILICON MONOLITHIC BIPOLAR INTEGRATED CIRCUIT