IndustrialGradeCyberSecurityAppliancebasedonIntel®Atom™x5-E3940/x5-E3930Processor

Features ƒIndustrialGradeDINRailfanlessCyberSecurityAppliance ƒSupportsIntel®Atom™x5-E3940Processor ƒ1xDDR3L1600/1867MHzSODIMM,upto8G ƒ1xGbECopperMgmt.port ƒ4x10/100/1000MbpsCopperportswith2segmentsofLANbypass ƒ2x10/100/1000MbpsSFPports ƒ1x2.5

1Ushort-depthOptimizedChassisforASMB-61SeriesEdgeAcceleratorServerBoard

Features ƒSupportsASMB-61edgeseriesproprietarymotherboard ƒ18short-depthchassisdesign ƒFourPCIeexpansionslotssupport ƒGPUCardsupportwithactiveFAN ƒTwohot-swappable2.5SATA/SAS/SSDdrivebays ƒMultiplepowersupplyoptions ƒ1UFrontBezelinoption

1U18short-depthEdgeAcceleratorServerwithIntel®Xeon®W&10thGen.Core™processors,supporting4expansionslots

Features ƒProcessor:SingleIntel®Xeon®W&10thGen.Core™processors ƒMemory:DDR42933/2666/2400MHzECC/Non-ECCUDIMMupto128GB ƒOnePCIex16slotortwoPCIex8slotssupportFH/10.5”LengthCards* ƒTwoPCIeX4slotssupportoneexternalandoneinternalLowProfileCards ƒTwoho

4URackmountIntel®Xeon®ScalableGPUServer,Supporting10xPCIex16Double-DeckCardsPlus1xPCIex16and1xPCIex8Single-DeckCards

Features ƒProcessor:Dual2ndGenIntel®Xeon®ScalableProcessors ƒMemory:24xDDR42666/2933MHzECCRDIMM/LRDIMM/IntelOptane DCPersistentMemory,upto6TB ƒRemoteManagement:IPMIfunctionsupport ƒExpansion:Supporting10*PCIex16double-deckcardwithpeertopeer feature+

ModularAIPlatformforScalableSurveillanceandFleetManagement

Features ƒEquippedwithDeviceOn/iServicesoftwareforremotedevicemanagement ƒScalablecomputingperformanceviaCPUboardsforspecificapplication requirements ƒAdvancedvideosurveillancesystemwithAIacceleratorforvideoAI capabilities ƒModulardesignsupportsthelatestRFco

7In-VehicleSmartDisplaywithSmartDisplay2.0

Features ƒ7WVGA(16:10)TFTLCDwith4-wireresistivetouchcontrol ƒRugged,vehicle-gradedesign ƒSmartdisplayport2.0and10-meter/5-meterconnectorcable ƒEasilypairedwithTREKcomputingboxviaasingle-cableconnection ƒBuilt-inlightsensorforautomaticdimming ƒExtendedI/

Intel®&NVIDIA®JetsonOrin™NXDual-SystemAIComputingSolution

Features ƒEquippedwithDeviceOn/iServicesoftwareforremotedevicemanagement ƒIntel®&NVIDIA®Dual-Systemtoprovidethebestcomputingperformance ƒScalableruggedAIplatformtoenhanceefficiency ƒScalablecomputingperformanceviaCPUboardsforspecificapplication requirements

ModularAIPlatformforScalableSurveillanceandFleetManagement

Features ƒEquippedwithDeviceOn/iServicesoftwareforremotedevicemanagement ƒScalablecomputingperformanceviaCPUboardsforspecificapplication requirements ƒAdvancedvideosurveillancesystemwithAIacceleratorforvideoAI capabilities ƒModulardesignsupportsthelatestRFco

7In-VehicleSmartDisplaywithSmartDisplay2.0

Features ƒ7WVGA(16:10)TFTLCDwith4-wireresistivetouchcontrol ƒRugged,vehicle-gradedesign ƒSmartdisplayport2.0and10-meter/5-meterconnectorcable ƒEasilypairedwithTREKcomputingboxviaasingle-cableconnection ƒBuilt-inlightsensorforautomaticdimming ƒExtendedI/

ModularAIPlatformforScalableSurveillanceandFleetManagement

Features ƒEquippedwithDeviceOn/iServicesoftwareforremotedevicemanagement ƒScalablecomputingperformanceviaCPUboardsforspecificapplication requirements ƒAdvancedvideosurveillancesystemwithAIacceleratorforvideoAI capabilities ƒModulardesignsupportsthelatestRFco

Intel®&NVIDIA®JetsonOrin™NXDual-SystemAIComputingSolution

Features ƒEquippedwithDeviceOn/iServicesoftwareforremotedevicemanagement ƒIntel®&NVIDIA®Dual-Systemtoprovidethebestcomputingperformance ƒScalableruggedAIplatformtoenhanceefficiency ƒScalablecomputingperformanceviaCPUboardsforspecificapplication requirements

ModularAIPlatformforScalableSurveillanceandFleetManagement

Features ƒEquippedwithDeviceOn/iServicesoftwareforremotedevicemanagement ƒScalablecomputingperformanceviaCPUboardsforspecificapplication requirements ƒAdvancedvideosurveillancesystemwithAIacceleratorforvideoAI capabilities ƒModulardesignsupportsthelatestRFco

IndustrialGradeCyberSecurityAppliancebasedonIntel®Atom™x5-E3940/x5-E3930Processor

Features ƒIndustrialGradeDINRailfanlessCyberSecurityAppliance ƒSupportsIntel®Atom™x5-E3940Processor ƒ1xDDR3L1600/1867MHzSODIMM,upto8G ƒ1xGbECopperMgmt.port ƒ4x10/100/1000MbpsCopperportswith2segmentsofLANbypass ƒ2x10/100/1000MbpsSFPports ƒ1x2.5

RockchipRK3399Cortex-A722.5SBCwithUIO40-Express

Features ƒRockchipRK3399ARMDualCortex-A72andQuadCortex-A531.8GHz ƒOnboardLPDDR42GB ƒ1HDMI,1DualChannel24bitLVDSor1eDP ƒ22-wireRS-232,1USB3.0,4USB2.0,1MicroSD,1Mic.in/Lineout ƒ1mini-PCIeforLTE/WiFi/BT ƒSupportsDebian9/10andAndroid7.1/10.0 ƒSup

NXPi.MX8MPlusCortex®-A532.5SBCwithUIO40-Express

Features ƒNXPArm®Cortex®-A53i.MX8MPlusQuad/Dualupto1.8GHz ƒOnboardLPDDR44GB/6GB,4000MT/smemory ƒHDMI1920x1080at60Hz,1Singleor1DualChannel24bitLVDS (or14-LaneMIPI-DSIbyBOMOption) ƒ14-wireRS-232/422/485,1USB3.2Gen1By1,1USB2.0,1MicroSD, 1Mic.i

MediaTekGenio1200CortexA78&A552.5SBCwithUIO40-Express

Features ƒMediaTekGenio12004coresA78&4coresA55 ƒOnboardLPDDR48GB,4000MT/smemory ƒHDMI4k60fps,1xDualChannel24bitLVDS ƒ1x4-wireRS-232/422/485,2xUSB3.2Gen1By1,2xUSB2.0, 1xMicroSD,1xMic.in/Lineout ƒ1xM.23052KeyBfor5G,1xM.22230KeyESlot

Intel®Celeron™J1900FanlessCompactSystemwith8GBonboard

Features ƒBuilt-inIntel®Celeron™J1900quad-coreprocessor,2.0GHz ƒFanless,compactsystemdesign ƒ8GBofDDR3memoryonboardwithoptionalNVRAM ƒ4xLAN,6xUSB,14xCOM,and1xUSB3.0ports ƒReplaceablesecondarydisplay(VGA2/DVI-D/LVDS/HDMI) ƒSupportsdualoutputsofful

ModularAIPlatformforScalableSurveillanceandFleetManagement

Features ƒEquippedwithDeviceOn/iServicesoftwareforremotedevicemanagement ƒScalablecomputingperformanceviaCPUboardsforspecificapplication requirements ƒAdvancedvideosurveillancesystemwithAIacceleratorforvideoAI capabilities ƒModulardesignsupportsthelatestRFco

Intel®&NVIDIA®JetsonOrin™NXDual-SystemAIComputingSolution

Features ƒEquippedwithDeviceOn/iServicesoftwareforremotedevicemanagement ƒIntel®&NVIDIA®Dual-Systemtoprovidethebestcomputingperformance ƒScalableruggedAIplatformtoenhanceefficiency ƒScalablecomputingperformanceviaCPUboardsforspecificapplication requirements

Intel®Atom®x6000SeriesProcessor(CodeName:ElkhartLake)Pico-ITXSBC

Features ƒIntelAtomx6000ESeries ƒOnboardLPDDR4xupto8GBandEMMCupto128GB ƒSupport12~24Vwidevoltagerangeand-40~85°Coperatingtemperature ƒ2xGbELAN,2xUSB3.2,2xRS-232/422/485,I2C ƒM.2E-KeyandB-KeyforSATAstorage,optiontosupportRS-232module ƒSupportiManag

11thGen.Intel®Core™i7/i5/i3/CeleronU-seriesPico-ITXSBC

Features ƒ11thGen.Intel®Core™ProcessorwithQuad/DualCores,TDP15W ƒOn-boardLPDDR4x-4267upto32GwithIBECCforIndustrialSku ƒDualindependentdisplay:eDP/MIPI-DSI,DPupto8K ƒ2GbE,2USB3.2,COMPort,SMBus/I2C ƒExpansion:M.2E-Key,M.2B-Key/M-KeyNVMex2 ƒSupportsi

12thGen.Intel®Core™ProcessorsS-series(LGA1700)on4EPICSBC

Features ƒ12thGen.Intel®Core™Processorupto16Cores,TDP35W ƒHighscalabilitywithsockettypeCPU(LGA1700)&SupportStd.CPUcooler ƒDDR54800upto32GB+3simultaneousdisplay:DualHDMI+eDP ƒDualHighSpeed2.5GEthernetwithTSN,2xCOM,CANbus,TPM ƒ3Expansions:DualM

Intel®Atom®x6000EseriesandIntelCeleronNandJseries3.5SBC

Features ƒAtom®x6000EseriesandIntel®Celeron®JandNserieswithQuad/Dual Cores,TDP6W/10W/12W ƒSingleChannelDDR4-3200upto32GB ƒ3independentdisplaysviaLVDS,DP1.4,andHDMI2.0upto4K@60Hz ƒDualGbE,6USB,6UART,TPM2.0 ƒCE/FCCClassB,CoastlineI/OESD8KV/15KVCr

11thGen.Intel®Core™i7/i5/i3/CeleronU-Series3.5SBCw/MIOe

Features ƒ11thGen.Intel®Core™ProcessorwithQuad/DualCores,TDP15W/28W ƒDualChannelDDR4-3200upto64GB ƒ4simultaneousdisplays:LVDS/HDMI/DP/USBType-C,eDP(optional) ƒ2GbE,4USB3.2,CANBus,DC-in12-24V ƒExpansion:M.2E-Key/B-Key/M-Key(supportsNVMe),MIOe ƒSupportsi

12thGen.Intel®CoreTMi7/i5/i3P-series3.5SBC

Features ƒ12thGen.Intel®Core™Processorupto12Cores,TDP28/15W ƒDualChannelDDR5-4800upto64GB ƒ4simultaneousdisplays:LVDS/HDMI/DP/USB-CAlt.DP ƒ2GbE,6USB,USB4/TBT4,4UART,2CANBus,3I2C ƒ3Expansions:M.2E-Key,B-Key,M-Key(supportNVMe) ƒSupportsiManager&Sof

M.2B-key&F/SminiPCIeDualIntel®GbE

Features ƒLow-profiledesign(11mm)MIOexpansionboard ƒRichI/O:2xIntelGbE,4xUSB2.0,8xUART(4xHigh-speedserialport+ 4xserialports),1xLine-out,1xGPIO,2xisolatedCANBus ƒMultipleexpansion:Full-sizeminiPCIeslotandM.2B-KeyforM.230424G/ LTEmodulewithon-bo

9th/8thGen.IntelXeon/Core™Processor,3.5SBCw/MIOe

Features ƒ9th/8thGen.Intel®Xeon®/Core™Processor,upto6cores,andTDP45W/25W ƒDualchannelDDR4-2400,upto64GB*,ECCforXeonSKU ƒTriplesimultaneousdisplayswith48-bitLVDS+HDMI+DP ƒUSB3.1Gen2(10Gbps),TPM2.0&NVMe/PCIeGen3x4SSD ƒDualGbE,SATAIII,RS-232/422/485,CA

M.2B-key&F/SminiPCIeDualIntel®GbE

Features ƒLow-profiledesign(11mm)MIOexpansionboard ƒRichI/O:2xIntelGbE,4xUSB2.0,8xUART(4xHigh-speedserialport+ 4xserialports),1xLine-out,1xGPIO,2xisolatedCANBus ƒMultipleexpansion:Full-sizeminiPCIeslotandM.2B-KeyforM.230424G/ LTEmodulewithon-bo

Intel®Atom®x6000SeriesProcessor(CodeName:ElkhartLake)Pico-ITXSBC

Features ƒIntelAtomx6000ESeries ƒOnboardLPDDR4xupto8GBandEMMCupto128GB ƒSupport12~24Vwidevoltagerangeand-40~85°Coperatingtemperature ƒ2xGbELAN,2xUSB3.2,2xRS-232/422/485,I2C ƒM.2E-KeyandB-KeyforSATAstorage,optiontosupportRS-232module ƒSupportiManag

11thGen.Intel®Core™i7/i5/i3/CeleronU-seriesPico-ITXSBC

Features ƒ11thGen.Intel®Core™ProcessorwithQuad/DualCores,TDP15W ƒOn-boardLPDDR4x-4267upto32GwithIBECCforIndustrialSku ƒDualindependentdisplay:eDP/MIPI-DSI,DPupto8K ƒ2GbE,2USB3.2,COMPort,SMBus/I2C ƒExpansion:M.2E-Key,M.2B-Key/M-KeyNVMex2 ƒSupportsi

12thGen.Intel®Core™ProcessorsS-series(LGA1700)on4EPICSBC

Features ƒ12thGen.Intel®Core™Processorupto16Cores,TDP35W ƒHighscalabilitywithsockettypeCPU(LGA1700)&SupportStd.CPUcooler ƒDDR54800upto32GB+3simultaneousdisplay:DualHDMI+eDP ƒDualHighSpeed2.5GEthernetwithTSN,2xCOM,CANbus,TPM ƒ3Expansions:DualM

Intel®Atom®x6000EseriesandIntelCeleronNandJseries3.5SBC

Features ƒAtom®x6000EseriesandIntel®Celeron®JandNserieswithQuad/Dual Cores,TDP6W/10W/12W ƒSingleChannelDDR4-3200upto32GB ƒ3independentdisplaysviaLVDS,DP1.4,andHDMI2.0upto4K@60Hz ƒDualGbE,6USB,6UART,TPM2.0 ƒCE/FCCClassB,CoastlineI/OESD8KV/15KVCr

11thGen.Intel®Core™i7/i5/i3/CeleronU-Series3.5SBCw/MIOe

Features ƒ11thGen.Intel®Core™ProcessorwithQuad/DualCores,TDP15W/28W ƒDualChannelDDR4-3200upto64GB ƒ4simultaneousdisplays:LVDS/HDMI/DP/USBType-C,eDP(optional) ƒ2GbE,4USB3.2,CANBus,DC-in12-24V ƒExpansion:M.2E-Key/B-Key/M-Key(supportsNVMe),MIOe ƒSupportsi

12thGen.Intel®CoreTMi7/i5/i3P-series3.5SBC

Features ƒ12thGen.Intel®Core™Processorupto12Cores,TDP28/15W ƒDualChannelDDR5-4800upto64GB ƒ4simultaneousdisplays:LVDS/HDMI/DP/USB-CAlt.DP ƒ2GbE,6USB,USB4/TBT4,4UART,2CANBus,3I2C ƒ3Expansions:M.2E-Key,B-Key,M-Key(supportNVMe) ƒSupportsiManager&Sof

9th/8thGen.IntelXeon/Core™Processor,3.5SBCw/MIOe

Features ƒ9th/8thGen.Intel®Xeon®/Core™Processor,upto6cores,andTDP45W/25W ƒDualchannelDDR4-2400,upto64GB*,ECCforXeonSKU ƒTriplesimultaneousdisplayswith48-bitLVDS+HDMI+DP ƒUSB3.1Gen2(10Gbps),TPM2.0&NVMe/PCIeGen3x4SSD ƒDualGbE,SATAIII,RS-232/422/485,CA

8-ch,24-bit,128kS/sDynamicSignalAcquisitionPCIExpressCard

Features ƒƒ8simultaneouslysampledanaloginputs,upto128kS/s ƒƒ24-bitresolutionADCswith-102dBtotalharmonicdistortionplusnoise (THD+N) ƒƒWideinputrangeof±1~10V ƒƒBuilt-inanti-aliasingfilter ƒƒLowpowerconsumption ƒƒSoftware-selectableAC/DCcoupling ƒƒFullau

1MS/s,16bit,32-chAnalogInputPCIECard

Features ƒƒ32-chsingle-endedor16-chdifferentialoracombinationofanaloginput ƒƒ16-bitA/Dconverter,withupto1MHzsamplingrate ƒƒAutocalibration ƒƒCurrentmeasurement(0-20mAor4-20mA) ƒƒSupportdigitalandanalogtriggers ƒƒMulti-cardsynchronization

IntelAtomx6413EQCSoCwithHDMIandDP/DualLAN/DualCOMDIN-RailFan-lessBoxPC

Features ƒIntelAtomx6413EQuadCoreSoCturboburstupto3.00GHz ƒDIN-RailsystemwithessentialI/Oportsonfront-sidebezel ƒ2xIntelGbEand2xRS-232/422/485 ƒDualindependentdisplayswithone4KHDMIandone4KDP ƒ1xM.22280BkeywithnanoSIMholderand1xM.22230Ek

Intel®11thgenCore™iprocessorwithTripleLAN/QuadrupleCOMDin-RailFanlessBoxPC

Features ƒIntel11thgen.Corei5/i3 ƒDIN-RailsystemwithessentialI/Oportsonfront-sidebezel ƒ3xIntelGbE,4xRS-232/422/485,8-bitDIO,optionalCANBus ƒ3Expansions:M.2E-Key2230,M.2B-Key2280,1xFull-sizemSATAshare withmPCIeslot ƒDualindependentdisplayswithone4

M.2B-key&F/SminiPCIeDualIntel®GbE

Features ƒLow-profiledesign(11mm)MIOexpansionboard ƒRichI/O:2xIntelGbE,4xUSB2.0,8xUART(4xHigh-speedserialport+ 4xserialports),1xLine-out,1xGPIO,2xisolatedCANBus ƒMultipleexpansion:Full-sizeminiPCIeslotandM.2B-KeyforM.230424G/ LTEmodulewithon-bo

15.6ConfigurablePanelPCChassisforSelectableMini-ITXMotherboards

Features ƒ15.6true-flatpanelPCwithmulti-touchprojectedcapacitive ƒSupportscertifiedmini-ITXmotherboards(upto65WTDPprocessor) ƒPCIorPCIeexpansionslots ƒFront-facingpowerstatusLEDindicators ƒIP66-ratedfrontpanel

18.5ConfigurablePanelPCChassisforSelectableMini-ITXMotherboards

Features ƒ18.5true-flatpanelPCwithmulti-touchprojectedcapacitive ƒSupportscertifiedmini-ITXmotherboards(upto65WTDPprocessor) ƒPCIorPCIeexpansionslots ƒFront-facingpowerstatusLEDindicators ƒIP66-ratedfrontpanel ƒSupportdualHDDdrawer

21.5ConfigurablePanelPCChassisforSelectableMini-ITXMotherboards

Features ƒ21.5true-flatpanelPCwithmulti-touchprojectedcapacitive ƒSupportscertifiedmini-ITXmotherboards(upto65WTDPprocessor) ƒPCIorPCIeexpansionslots ƒFront-facingpowerstatusLEDindicators ƒIP66-ratedfrontpanel ƒSupportdualHDDdrawer

CompactFanlessSystemwith10thGenIntel®Xeon®/Core™iCPUSocket(LGA1200)

Features ƒIntel®10thGenXeon®/Core™iCPUsocket-type(LGA1200)withIntel® W480E/H420Echipset ƒWideoperatingtemperature(-10~60°C) ƒVGAandHDMIoutput ƒ2xGigaLAN,2xUSB3.2(Gen2)and6xUSB3.2(Gen1) ƒ2xRS-232/422/485and4xRS232serialports(Optional) ƒ1x2.5H

CompactFanlessSystemwith12thGenIntel®Core™iCPUSocket(LGA1700)

Features ƒIntel®12thGenCore™iCPUsocket-type(LGA1700)withIntel®R680E/ H610Echipset ƒWideoperatingtemperature(-20~60°C) ƒVGAandHDMIoutput ƒ2xGigaLAN,2xUSB3.2(Gen2)and6xUSB3.2(Gen1) ƒ2xRS-232/422/485and4xRS232serialports(Optional) ƒ1x2.5HDD/SS

DualGPUExpansionModuleforVideoAIEdgeComputingwithMIC-7Series

Features ƒOfferingpowerfulGPUsolutionwithdualNVIDIA250W,2.75-slot width/331mmlengthGPUcardsfornewAIapplication ƒTriple24VDCpowerinputs,provideindependentpowerforGPUcardsand MIC-7system ƒIntelligentpowerstatusindicatingLEDforsystemandGPUcard independently

GPUExpansionModuleforVideoAIEdgeComputingwithMIC-7Series

Features ƒOfferingpowerfulGPUsolutionwithNVIDIA350W,2.75-slotwidth,334.6mm lengthGPUcardsfornewAIapplication ƒDual24VDCpowerinputswithreliablepowerandOCPsolutionforupto 700Wmaximumpeakpowercurrency ƒIntelligentpowerstatusindicatingLEDforsystemandGPUc

CompactIndustrialComputerSystemwith6th/7thGenIntel®Core™iCPUSocket(LGA1151)

Features ƒIntel®6th/7thGenCore™iCPUsocket-type(LGA1151)withIntel®Q170/ H110chipset ƒ3xindependentdisplays(thirddisplayoutput(DP)viaoptionalcable) ƒ2xGigaLanand6xUSB3.0(Q170)/4xUSB3.0(H110) ƒ2xRS-232/422/485and2xRS232serialports ƒ2x2.5HDD/SSD,a

CompactIndustrialComputerSystemwith10thGenIntel®Core™iCPUSocket(LGA1200)

Features ƒIntel®10thGenCore™iCPUsocket-type(LGA1200)withIntel®Q470E/ H420Echipset ƒ3xindependentdisplays(thirddisplayoutput(DP)viaoptionalcable) ƒ2xGigaLanand6xUSB3.2 ƒ2xRS-232/422/485and2xRS232serialports ƒ1xNVMeM.2(Q470EOnly),2x2.5HDD/SSD,a

3UCompactPCI®SerialDualMiniPCIeCarrierBoard

Features ƒ3UHeightCompactPCIserialinterfaceperipheralboard ƒDualMiniPCIemodulecarrier ƒPICMGCPCI-S.0CompactPCI®serialspec.

包装：散装 描述：FAN AXIAL 127X38.1MM GL12Z3 风扇，热管理 无刷直流风扇（BLDC）

包装：盒 描述：FAN BLOWER 50.8MM SPDD24K1 24VDC 风扇，热管理 无刷直流风扇（BLDC）

AccessoriesConnectorsandCables

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