3UShort-depthRackmount/TowerChassisforEATX/ATX/MicroATXMotherboard

Features ƒSupportsEATX/ATX/MicroATXmotherboardwithdualprocessors ƒTwohot-swap3.5/2.5drivebays,oneslimODDdrivebayandtwointernal 3.5HDDbays ƒDualfrontUSB3.0ports ƒSupportsFlexATXpower,2U80Plussingleorredundantpowersupply ƒFront-accessiblesystemfanwithou

NVIDIAIGXPlatformforEnterpriseServerTowerChassis

Features ƒEnterprisegradeservertowerchassisedgeAIsystem ƒEmbeddedwithNVIDIA®IGXOrin™upto248TOPS ƒSupports1xNVIDIARTXA6000forpowerfulvisualcomputing

EmbeddedMini-ITXChassiswithOneExpansionSlot

Features ƒSupportsIntel®7thGenCore™&6thGenCore™iprocessor/Pentium/ Celeron(LGA1151)withIntelH110chipset ƒTwo260-pinSO-DIMMupto32GBDDR42133MHzSDRAM ƒSupportsDualdisplayconfigurationbymultipleinterface:DP/DVI-D/VGA ƒSupportsDirectX12,OpenGL4.4,OpenCL2.

1URackmountNetworkAppliancewith4thgen.Intel®Xeon®ProcessorE3seriesandIntel®Core™i7/i5/i3Processors,4NMCslots

Features ƒƒSupportsIntel®Xeon®ProcessorE3-1275/E3-1225/E3-1268LV3and4th GenIntel®Core™Processorsi5-4570TE,i3-4360,i3-4330,i3-4330TE,Intel® Pentium®ProcessorG3320TEandIntel®Celeron®ProcessorG1820TE. ƒƒSupports2channelfourDDR3ECCUn-buffered1333/1600DIMMs, upto32GB

1URackmountNetworkAppliancewithIntel®Xeon®ProcessorDFamilyforvE-CPEandNetworkApplications,2NMCslots

Features ƒƒIntel®Xeon®ProcessorDSystemOnChipupto16coresand1.5MBlast levelcachepercore ƒƒ4xDDR4ECCUDIMMs/RDIMMsandRDIMMs,upto2400MHzandupto 128GB ƒƒ4serverclassGbEportsimplementedbyanIntel®i350EthernetController withadvancedLANbypasssupport ƒƒ2

2URackmountNetworkAppliancewith4thgen.Intel®Xeon®ProcessorE3seriesandIntel®Core™i7/i5/i3Processors,4NMCslots

Features ƒƒSupportsIntel®Xeon®ProcessorE3-1275/E3-1225/E3-1268LV3and4thGen Intel®Core™Processorsi7-4790S,i7-4770S,i7-4770TE,i5-4590T,i5-4590S, i5-4570TE,i3-4360,i3-4330,i3-4330TE,Intel®Pentium®ProcessorG3320TE andIntel®Celeron®ProcessorG1820TE. ƒƒSupports2channelfou

2URackmountNetworkAppliancewith4thgen.Intel®Xeon®ProcessorE3seriesandIntel®Core™i7/i5/i3Processors,2NMCslots

Features ƒƒIntel®Xeon®ProcessorE3v3familyand4thGenIntel®Core™i7/i5/i3 Processors,Intel®Pentium®andIntel®Celeron®Processor ƒƒ4xDDR3Un-buffered1333/1600DIMMs,upto32GB ƒƒ8xIntel®i210-AT10/100/1000MbpsLANonboardwithupto3bypass segments ƒƒUpto2Network

Compact2UHighCapacityStorageServerbasedonIntel®Xeon®ProcessorScalableFamily

Features ƒƒ2U27.5deeprackmountserver ƒƒDualIntel®Xeon®Platinum,Gold,SilverorBronzeProcessor(Upto205W TDP) ƒƒ16xDIMMsocketssupportupto1024GBDDR42666/2933MHzDDR4 (ECC/RDIMM/LRDIMM) ƒƒRichAdd-InCardSupport:UptofourFH/FLPCIex8Gen3slots,twoFH/HL PCIex

AIInferenceSystembasedonNVIDIAJetson®Xavier

Features ƒNVIDIAJetson™Xavierembedded ƒFanlesscompactdesign ƒSupport1xMiniPCIe&1xM.2(PCIex2NVMe) ƒBundlewithLinuxUbuntu18.04 ƒLowpowerconsumption ƒSupportPCIeAdd-onCard ƒSupport24/7secureremotemonitoring,control,andOTAdeployment empoweredbyAllxon(su

CompactFanlessSystemwith10thGenIntel®Xeon®/Core™iCPUSocket(LGA1200)

Features ƒIntel®10thGenXeon®/Core™iCPUsocket-type(LGA1200)withIntel® W480E/H420Echipset ƒWideoperatingtemperature(-10~60°C) ƒVGAandHDMIoutput ƒ2xGigaLAN,2xUSB3.2(Gen2)and6xUSB3.2(Gen1) ƒ2xRS-232/422/485and4xRS232serialports(Optional) ƒ1x2.5H

CompactFanlessSystemwith12thGenIntel®Core™iCPUSocket(LGA1700)

Features ƒIntel®12thGenCore™iCPUsocket-type(LGA1700)withIntel®R680E/ H610Echipset ƒWideoperatingtemperature(-20~60°C) ƒVGAandHDMIoutput ƒ2xGigaLAN,2xUSB3.2(Gen2)and6xUSB3.2(Gen1) ƒ2xRS-232/422/485and4xRS232serialports(Optional) ƒ1x2.5HDD/SS

21.5MultimodalClinicalDisplay

Features ƒWide21.5screenwithFullHD1920x1080resolution ƒFanlessdesignwithoptionalupgradeIP54-ratedprotectionforsuperior hygieneandinfectioncontrol ƒMultimodaldesignforeasyupgradesandmaintenance ƒWith10pointmulti-touchcontrolfunction

23.8MultimodalClinicalDisplay

Features ƒWide23.8screenwithFullHD1920x1080resolution ƒFanlessdesignwithoptoinalupgradeIP54-ratedprotectionforsuperior hygieneandinfectioncontrol ƒMultimodaldesignforeasyupgradesandmaintenance ƒWith10pointmulti-touchcontrolfunction

23.8IndoorSelf-ServiceKiosk

Features ƒIndoorself-servicekioskequippedwitha23.8touchscreen ƒColorfuleye-catchingLEDindicatorsensureintuitiveoperation ƒMultiplestandswithRFIDbinandtrayforeasyinstallation ƒModularizeddesignallowsforeasyupgradesandfunctionexpansion ƒSupportsDeviceOn/iServ

15.6UbiquitousTouchComputer

Features ƒCompactandlightweightforconvenientinstallationinspace-limited environments ƒColorfuleye-catchingLEDindicatorsensureintuitiveoperation ƒModularizeddesignallowsforeasyupgradesandfunctionexpansion ƒCanbeflexiblyconfiguredforvariousfieldapplicationsands

IntelligentCompactFanlessBOXPC

Features ƒEquippedwithDeviceOn/iServicesoftwareremotedevicemanagement ƒEmbeddedinIntelBayTrailJ1900/SkylakeCorei3/i5processor ƒCompactdesignwith45mminheight ƒEasy/quickinstallationforadditionalperipheralsandexpandedmodular ƒSupport1x2.5SATAHDDBayand1mSA

15UbiquitousServiceComputerwithIntel®Celeron3955Uor3965U/Corei3-6100Uori3-7100U/i5-6300Uori5-7300U

Features ƒEquippedwithDeviceOn/iServicesoftwareforremotedevicemanagement ƒ15TFTLCD(LEDbacklight)withPCAPTouch ƒBuiltinIntel®Celeron3955Uor3965U/Corei3-6100Uori3-7100U/ i5-6300Uori5-7300U ƒInnovationLEGOstanddesignenableadaptableconfigurations ƒStylish

Multi-purposestand

Features ƒƒStylishlookingandFlexibleassembleforeasymaintenances ƒƒVarietyofPCcanbechooseformeetcustomer’sdifferenceapplication requested ƒƒCompactfortighttablespace ƒƒMinorcustomizationacceptableformechanicalhousingpartandperipheral installation ƒƒDTOSacce

LGA11504thGenIntel®Xeon®andCore™i7/i5/i3Half-sizeSHBwithPCIe3.0/Tripleindependentdisplay/DualGbELAN/SATA3.0/m-SATA/USB3.0

Features ƒComplieswithPICMG1.3 ƒSupportsIntelXeonE31200v3series,Corei7/i5/i3LGA1150processors withC226 ƒDualChannelDDR31066/1333/1600upto16GB ƒSupportsPCIE3.0,USB3.0,SATA3.0,SWRaid0,1,5,10 ƒSupportstripledisplays ƒSupportdual10/100/1000MbpsEthernet

AMDT40E/T16RISAHalf-sizeSBCwithDualIndependentDisplay/DualGbE/SATA/USB/m-SATA/COM/LPT

Features ƒUltralowpower,AMDdual-coreAcceleratedProcessingUnitT40Eorfanless T16R ƒDDR31066memoryonboard1GB+DDR31066SO-DIMMsocket4GB ƒDualindependentdisplay ƒUpto2GbELANsupported ƒUpto7USB2.0(480Mbps) ƒ4xSATA3.0(600MB/s)and1m-SATA(600MB/s) ƒLe

LGA11504thGenerationIntel®Core™i7/i5/i3Half-sizeSHBwithPCIe/VGA/DVI/DualGbELAN

Features ƒComplieswithPICMG1.3 ƒSupportsIntel®Core™i7/i5/i3LGA1150processorswithH81 ƒDualChannel(Non-ECC)DDR31066/1333/1600upto16GB ƒSupportsUSB3.0,SATA3.0 ƒSupportsCRTandDVI-D(optional)display ƒSupportdual10/100/1000MbpsEthernet ƒSupportsAdvantechTPM

LGA11516thand7thGenIntel®Core™i7/i5/i3Half-sizeSHBwithPCIe3.0/DualIndependentDisplay/DualGbELAN/SATAIII/m-SATA/USB3.0

Features ƒComplieswithPICMG1.3 ƒSupportsIntel®Core™i7/i5/i3/Celeron®/Pentium®processorwithH110 chipset ƒDualChannel(Non-ECC)DDR41866/2133upto32GB ƒSupportsUSB3.0,SATAIII,PCIe3.0 ƒSupportsCRTandDVI-D/DP(optional)display ƒSupportsAdvantechTPMmodule(option

MicroComputer,Intel®Core™i7/i5/i3CPU,H81,4Expansions2PCI/2PCIe,300W80PlusPSU

Features ƒƒIntel®H81Platform ––Intel®4thgenCore™i7/i5/i3CPU(LGA1150) ––TwoPCIe(x16/x1)&twoPCIExpansionSlots ƒƒCompact&RichI/OConfiguration ––Oneinternal3.5SATAHDDbayswithshock-resistant ––Optionalfrontremovable2.5HDDbay ––VGA,2GbELAN,4USB2.0,2COM ––E

MicroComputerwithIntel®Core™i7/i5/i3Processor,Intel®H110Chipset,4xExpansionSlots,and300W80PLUSPSU

Features ƒIntel®6th/7thGenCore™i7/i5/i3/Celeron®processerwithIntel®H110chipset ƒTwoPCIe(x16/x1)&twoPCIexpansionslots ƒCompactdesignwithfront-accessibleI/O ƒ1xVGA,2xGbELAN,2xUSB2.0,1xUSB3.0,2xCOM ƒ1x3.5shock-resistantHDDbay ƒReusablefilterand

MicroComputer,Intel®Core™i7/i5/i3CPU,H81,2Expansions,250W80PlusPSU

Features ƒIntel®H81Platform –Intel®4thgenCore™i7/i5/i3CPU(LGA1150) –OnePCIex16*&onePCIex4ExpansionSlots ƒCompact,well-thought-outdesign –Twointernal,shock-resistant,2.5SATAHDDbays –FrontaccessibleI/O:VGA+DVI-D,2GbELAN,3USB2.0,2COM –Easy-to-maintains

8chAIVideoSystemonNVIDIAJetson®

Features ƒNVIDIAJetson™NANOembedded ƒSupport8chPoEVideoInput ƒSupport2x3.5HDD ƒBundlewithLinuxUbuntu18.04withBSP ƒLowpowerconsumption ƒH.264/H.265camerasupported

8chAIVideoSystemonNVIDIA®Jetson™XavierNX

Features ƒNVIDIA®Jetson™XavierNXembedded ƒSupports8CHPoEvideoinput ƒSupports2x3.5HDD ƒBoardsupportpackage(BSP)includesLinuxUbuntu18.04 ƒLowpowerconsumption ƒSupportsH.264/H.265cameras

GPUExpansionModuleforVideoAIEdgeComputingwithMIC-7Series

Features ƒOfferingpowerfulGPUsolutionwithNVIDIA350W,2.75-slotwidth,334.6mm lengthGPUcardsfornewAIapplication ƒDual24VDCpowerinputswithreliablepowerandOCPsolutionforupto 700Wmaximumpeakpowercurrency ƒIntelligentpowerstatusindicatingLEDforsystemandGPUc

DualGPUExpansionModuleforVideoAIEdgeComputingwithMIC-7Series

Features ƒOfferingpowerfulGPUsolutionwithdualNVIDIA250W,2.75-slot width/331mmlengthGPUcardsfornewAIapplication ƒTriple24VDCpowerinputs,provideindependentpowerforGPUcardsand MIC-7system ƒIntelligentpowerstatusindicatingLEDforsystemandGPUcard independently

1URackmountNetworkAppliancewith4thgen.Intel®Xeon®ProcessorE3seriesandIntel®Core™i7/i5/i3Processors,4NMCslots

Features ƒƒSupportsIntel®Xeon®ProcessorE3-1275/E3-1225/E3-1268LV3and4th GenIntel®Core™Processorsi5-4570TE,i3-4360,i3-4330,i3-4330TE,Intel® Pentium®ProcessorG3320TEandIntel®Celeron®ProcessorG1820TE. ƒƒSupports2channelfourDDR3ECCUn-buffered1333/1600DIMMs, upto32GB

2URackmountNetworkAppliancewith4thgen.Intel®Xeon®ProcessorE3seriesandIntel®Core™i7/i5/i3Processors,4NMCslots

Features ƒƒSupportsIntel®Xeon®ProcessorE3-1275/E3-1225/E3-1268LV3and4thGen Intel®Core™Processorsi7-4790S,i7-4770S,i7-4770TE,i5-4590T,i5-4590S, i5-4570TE,i3-4360,i3-4330,i3-4330TE,Intel®Pentium®ProcessorG3320TE andIntel®Celeron®ProcessorG1820TE. ƒƒSupports2channelfou

2URackmountNetworkAppliancewith4thgen.Intel®Xeon®ProcessorE3seriesandIntel®Core™i7/i5/i3Processors,2NMCslots

Features ƒƒIntel®Xeon®ProcessorE3v3familyand4thGenIntel®Core™i7/i5/i3 Processors,Intel®Pentium®andIntel®Celeron®Processor ƒƒ4xDDR3Un-buffered1333/1600DIMMs,upto32GB ƒƒ8xIntel®i210-AT10/100/1000MbpsLANonboardwithupto3bypass segments ƒƒUpto2Network

Intel®Celeron™J1900FanlessCompactSystemwith8GBonboard

Features ƒBuilt-inIntel®Celeron™J1900quad-coreprocessor,2.0GHz ƒFanless,compactsystemdesign ƒ8GBofDDR3memoryonboardwithoptionalNVRAM ƒ4xLAN,6xUSB,14xCOM,and1xUSB3.0ports ƒReplaceablesecondarydisplay(VGA2/DVI-D/LVDS/HDMI) ƒSupportsdualoutputsofful

Intel®Atom™E38451UFanlessSystem;EN50121-4CompliantforRailwayApplications

Features ƒBuilt-inIntel®Atom™E3845quad-coreprocessor,1.91GHz ƒ4GBofDDR3memoryonboard ƒ1Ufanlessrackmountsystem ƒ4xGbEand10xRS-232/422/485portswithisolationdesign ƒ6xUSB2.0and1xUSB3.0slots ƒ1xVGAand1xDVI-Ddisplayoutputs ƒCompliantwithEN5012

RackmountFanlessSystemwithIntel®6thGenCore™iProcessor

Features ƒIntel®6thGenCore™i7/i3(BGAtype)processorwithIntel®QM170chipset ƒWideoperatingtemperature(-20~60°C) ƒ8GBonboardDDR4memory+1xsocketforexpansion.Max.24GBintotal. ƒ2xDVIports(supportstripledisplay) ƒ2xGigaLAN,2xUSB3.0.6xUSB2.0 ƒ2xPCI

FanlessNetworkApplianceforSD-WAN&uCPEEdgeDeploymentwithComing5G&Wi-Fi6Support

Features ƒIntel®Atom®C3000-seriesprocessor ƒFan-lessdesign ƒIP40compliance ƒWide-operatingtemperaturesupportfrom-20~70°CbySKUoption ƒDesignreservedfor5GandAdvanced-LTEmodule ƒDesignreservedfor802.11ax(WiFi6)module ƒReliabilityenhancementwithbetterESD/Sur

FanlessNetworkApplianceforSD-WAN&uCPEEdgeDeploymentwithComing5G&Wi-Fi6Support

Features ƒIntel®Atom®C3000-seriesprocessor ƒFan-lessdesign ƒIP40compliance ƒNormal-operatingtemperaturesupportfrom0~40°C ƒDesignreservedfor5GandAdvanced-LTEmodule ƒDesignreservedfor802.11ax(WiFi6)module ƒTPM2.0featuresisavailablebyBOMoption ƒ6xethernet

TinyNetworkAppliancewithIntel®Celeron®J3355/J3455forEntryLevelSD-WANandSecurityGateway

Features ƒIndustry-standardx86platformforSOHOandsmallenterprise installations ƒCertifiedbykeyecosystempartnersinNFVandsecurityindustry ƒTinyphysicalappearanceandfan-lessdesignsupportedby optionalWall/VESA/DIN-railmountingkit ƒQuad1GbERJ45withoptional3G/4GL

10.1Medical-GradeTabletwithIntel®Atom™ProcessorandPCAPTouchscreen

Features ƒEquippedwithDeviceOn/iServicesoftwareforremotedevicemanagement ƒIntel®Atom™processorwithsupportforbothWindowsandAndroidOS ƒ10.1fullHDprojectedcapacitivetouchscreenwithscratch-resistant Corning®Gorilla®Glass ƒSupportsactivestyluspen,glovedoperation,

8Industrial-GradeTabletwithQualcomm®Snapdragon™660Processor,Android10withGMS

Features ƒQualcomm®Snapdragon™660withAndroid10operatingsystem ƒCertifiedforGoogleMobileServicesfordownloadingappsandAPIs ƒ8LCDwith400-nitbrightness,1920x1200resolution ƒCorning®Gorilla®Glass3touchscreensupportsglovedandstylusoperation ƒIP65-ratedprotecti

8Industrial-GradeTabletwithQualcomm®Snapdragon™660Processor,Android12withAndroidEnterpriseRecommended

Features ƒQualcomm®Snapdragon™660processorwithAndroid12andAndroid EnterpriseRecommendedcertification ƒ8industrial-gradeLCDwith1920x1200resolution,400-nitbrightness,and upto12,000hoursMTBF ƒProjectedcapacitivetouchscreenwithscratch-resistantCorning®Gorilla® Glas

10.1MedicalGradeTabletwithQualcomm®Snapdragon™660

Features ƒEquippedwithDeviceOn/iServicesoftwareforremotedevicemanagement ƒQualcommSDA660withAndroid10 ƒ10.1Full-HDcapacitivetouchscreendesignedwithscratch-resistant Corning®Gorilla®Glass ƒSupportsglovemodeandstyluswithpalmdetectiontoexpandusability ƒIntegra

6thGenerationIntel®Core™UseriesFanlessSignagePlayerwithTripleIndependentDisplaySupport

Features ƒAdvancedgraphicsenginewithIntelHD520 ƒSupports4K/UltraHDresolutionbyHDMI2.0andHEVCvideodecoding ƒIntegratedwithDualchannelDDR42133SO-DIMM ƒFlexibilityforexpansion(MiniPCIeandM.22230/1630EKey)andstorage devices(2.5SATAIIIHDD/SSD,m-SATA) ƒCon

CompactDIN-RailControllerwithIntel®Atom®E3940CPU,2xLAN,2xCOM,3xUSB3.0,1xUSB2.0,2xDP1.2,8xDI,8xDO,1xM.2,1xmPCIe,andTPM2.0

Features ƒIntel®Atom®E3940processor(1.6GHz)with8GBDDR3Lmemory ƒWidepowerinputrange(10~36VDC) ƒWideoperatingtemperaturerange(-40~70°C/-40~158°F) ƒPortisolationfor8xDI,8xDO,2xCOM ƒDP++ensuresHDMI/DVIcompatibility ƒDualstorage:M.22242SATASSDan

CompactDIN-RailControllerwithIntel®Atom®E3940CPU,2xLAN,2xCOM,3xUSB3.0,1xUSB2.0,2xDP1.2,8xDI,8xDO,1xM.2Bkey,1xmPCIe,andTPM2.0

Features ƒIntel®Atom®E3940processor(1.6GHz)with8GBDDR3Lmemory ƒWidepowerinputrange(10~36VDC) ƒWideoperatingtemperaturerange(-40~70°C/-40~158°F) ƒPortisolationfor8xDI,8xDO,2xCOM ƒDP++ensuresHDMI/DVIcompatibility ƒDualstorage:M.22242SATASSDan

21.5ClinicalDisplay

Features ƒWide21.5screenwithFullHD1920x1080resolution ƒFanlessdesignwithupgradeIP54-ratedprotectionforsuperiorhygieneand infectioncontrol ƒWith10pointmulti-touchcontrolfunction ƒFactorycalibrationincludedforGAMMA2.2 ƒCompliantwithIEC/EN60601-1-2EMC,IEC/EN

23.8ClinicalDisplay

Features ƒWide23.8screenwithFullHD1920x1080resolution ƒFanlessdesignwithupgradeIP54-ratedprotectionforsuperiorhygieneand infectioncontrol ƒWith10pointmulti-touchcontrolfunction ƒFactorycalibrationincludedforGAMMA2.2 ƒCompliantwithUL60601-1,IEC/EN60601-1,I

8Industrial-GradeTabletwithIntel®Atom™Processor

Features ƒƒIntel®Atom™processorforWindows10IoTandAIMAndroid6.0 ƒƒ8WUXGAfullHDdisplaywithscratch-resistantCorning®Gorilla®Glass3 andmulti-touchPCAPcontrol ƒƒWLAN,BT,NFC,3G/4GLTEtechnologyforseamlesscommunications ƒƒOptionalextensioninclude1D/2Dbarcodesc

10.1IndustrialTabletwithQualcommProcessor

Features ƒEquippedwithDeviceOn/iServicesoftwareforremotedevicemanagement ƒQualcommSDA660/SDM660withAndroid10 ƒ10WUXGAfullHDdisplaywithscratch-resistantCorning®Gorilla®Glass andmulti-touchPCAPcontrolsupportsglovemode ƒIntegratedbarcodescannersupportsdatacolle

10.1IndustrialTabletwithIntel®Atom™Processor

Features ƒƒIntel®Atom™processorforWindows10IoTandAIMAndroid6.0 ƒƒThehot-swappablebatterywithcapacitymeterthatshowstheremaining powerandrechargestatusminimizessysteminterruptionsforreliable long-durationoperation ƒƒIntegratedbarcodescannersupportsdatacollect

Intel®8th9thGenCore™i7/i5/i3LGA1151MicroATXwithVGA/DP/DVI-D/eDP(LVDS),14COM,8USB3.0,12USB2.0,DualLAN

Features ƒSupportsIntel®8th/9thGenCorei7/i5/i3processorwithH310chipset ƒSupportsupto14COM,8USB3.0,12USB2.0,TPM1.2/2.0(optional) ƒSupportsDualdisplayofVGA,DP,DVI,eDP,LVDS(optional)andtwoGbE LAN ƒTwoDIMMsocketssupportupto64GBDDR42666MHzSDRAM ƒS

Intel®Xeon®W10thGenCore™(CometLake-S)i9/i7/i5/i3LGA1200,MicroATXwith2DP/VGA/eDP/6COM,210GbELANs,2GbELANs,4USB3.2Gen2,6USB3.2Gen1

Features ƒSupportsIntel®Xeon®W10thGenCore™(CometLake-S)i9/i7/i5/i3 processorwithW480E/Q470E/H420Echipset ƒSupportstripledisplays.(2DP++,eDP,VGAdisplay) ƒSupportsIntelAMT12.0andIntelvProcompetent ƒSupportsPCIeGen3,maxupto4xUSB3.2Gen2,6xUSB3.2Gen1, 6x

17SXGAIndustrialOpenFrameMonitor

Features ƒƒ17SXGALCDpanelwithLEDbacklightfor20powersavingand environmentalprotection ƒƒ-20°C~+60°Cwiderangeoperatingtemperature ƒƒ5-wireresistivetouchscreensolution ƒƒCombotouchinterfaceofRS-232andUSB ƒƒDualsignalinterfacewithVGA&DVI ƒƒIntegratedbr

19SXGAIndustrialOpenFrameMonitor

Features ƒƒ19SXGALCDpanelwithLEDbacklightfor20powersavingand environmentalprotection ƒƒ0°C~+45°Coperatingtemperature ƒƒ5-wireresistivetouchscreensolution ƒƒCombotouchinterfaceofRS232andUSB ƒƒDualsignalinterfacewithVGA&DVI ƒƒIntegratedbracketforeasy

19SXGAIndustrialPanelMountMonitor

Features ƒƒ19SXGALCDpanelwithLEDbacklightfor20powersavingand environmentalprotection ƒƒ0°~+45°Coperatingtemperature ƒƒ5-wireresistivetouchscreensolutionor3mmtemperedsmudgeresistant protectedglass ƒƒCombotouchinterface:RS-232andUSB ƒƒDualsignalinterface

15.6UbiquitousTouchComputerUTC-115GwithIntel®Pentium®N4200

Features ƒSlimmerandLighterdesign ƒLowpowerandfanlesssystemdesign ƒBuilt-inIntelPentium®N4200 ƒ15.6monitorwith16:9widescreendisplay ƒIP65-ratedfrontpanelforwateranddustresistance ƒCleanbackcoverdesignwith3WayIOcablerouting ƒSupportsbothlandscapeand

IntelAtomE3900seriesEmbeddedSBCFanlessSlimSystem

Features ƒIntel®Atom™E3900series ƒOnboard4GBLPDDR4-2400MT/s,32GBeMMC ƒIndependentdisplaybyHDMI ƒSemi-IndustryFanlessslimsysten,DinRailorWallmountdesign ƒSupportHDMIx1,GbEx2USB3.0x2,COMx2,DIOx2 ƒFlexibleexpansionM.2Ekey,F/SminiPCIe ƒ12Vpower

8thGen.Intel®CoreProcessorSoCMultipleI/OsFanlessEmbeddedSystem

Features ƒ8thGen.IntelCorei7-8665UE/i5-8365UEQuadCore ƒDualDisplayHDMI+DP,upto4K2K ƒ4xGbE,8xUSB3.0/2.0,4xUART,2xCANBus ƒ4Expansion:M.2E-Key2230,M-Key2280,B-Key3042,F/SmPCIe ƒDC-in12V,WallMount&DINRail ƒiManager3.0&SWAPIs,WISE-PaaS/DeviceOn

IntelAtomPlatformPalmSizeFanlesssystem

Features ƒIntel®AtomQuadCore/DualCoreProcessor ƒPalm-sizeformfactor:170(L)x117(W)x52.6mm(H) ƒSupports2xLAN,2xCOMport,1xHDMI,1xDisplayPort,4xUSB3.0, CANBus,andDCIN12~24V ƒBuilt-in1xM.2expansionslot(PCIeGen2,USB2.0co-lay),1xFullsize MiniPC

10.1Bezel-lessTouchMonitor

Features ƒ10.1LCDwidescreenpanelwithLEDbacklightdeliversalongservicelife ƒSupportswideoperatingtemperatures ƒTrueflatsurface–contemporaryProflatdesign ƒWideviewinganglessupportportraitandlandscapemodes ƒThinprofileenclosureeliminatesneedforadditionalcas